Method for fabricating group-III nitride devices and devices fabricated using method
    1.
    发明申请
    Method for fabricating group-III nitride devices and devices fabricated using method 有权
    使用方法制造III族氮化物器件的方法和器件

    公开(公告)号:US20060049411A1

    公开(公告)日:2006-03-09

    申请号:US10848937

    申请日:2004-05-18

    IPC分类号: H01L33/00 H01L21/00

    摘要: A method according to the present invention for fabricating high light extraction photonic devices comprising growing an epitaxial semiconductor structure on a substrate and depositing a first mirror layer on the epitaxial semiconductor structure such that the epitaxial semiconductor structure is sandwiched between the first mirror layer and the substrate. Flip-chip mounting the epitaxial semiconductor structure, with its first mirror and substrate on a submount such that the epitaxial semiconductor device structure is sandwiched between the submount and substrate. The substrate is then removed from the epitaxial structure by introducing an etch environment to the substrate. A second mirror layer is deposited on the epitaxial semiconductor structure such that the epitaxial semiconductor structure is sandwiched between the first and second mirror layers. A device according to the present invention comprising a resonant cavity light emitting diode (RCLED) mounted to a submount.

    摘要翻译: 根据本发明的用于制造高光提取光子器件的方法,包括在衬底上生长外延半导体结构并在外延半导体结构上沉积第一镜面层,使得外延半导体结构夹在第一镜面层和衬底之间 。 倒装芯片将外延半导体结构安装,其第一反射镜和衬底位于基座上,使得外延半导体器件结构夹在底座和衬底之间。 然后通过向衬底引入蚀刻环境,从衬底去除衬底。 第二镜层沉积在外延半导体结构上,使得外延半导体结构夹在第一和第二镜层之间。 根据本发明的装置包括安装到底座的谐振腔发光二极管(RCLED)。

    Method for fabricating group-III nitride devices and devices fabricated using method
    2.
    发明授权
    Method for fabricating group-III nitride devices and devices fabricated using method 有权
    使用方法制造III族氮化物器件的方法和器件

    公开(公告)号:US07332365B2

    公开(公告)日:2008-02-19

    申请号:US10848937

    申请日:2004-05-18

    IPC分类号: H01L21/00 H01L33/00

    摘要: A method according to the present invention for fabricating high light extraction photonic devices comprising growing an epitaxial semiconductor structure on a substrate and depositing a first mirror layer on the epitaxial semiconductor structure such that the epitaxial semiconductor structure is sandwiched between the first mirror layer and the substrate. Flip-chip mounting the epitaxial semiconductor structure, with its first mirror and substrate on a submount such that the epitaxial semiconductor device structure is sandwiched between the submount and substrate. The substrate is then removed from the epitaxial structure by introducing an etch environment to the substrate. A second mirror layer is deposited on the epitaxial semiconductor structure such that the epitaxial semiconductor structure is sandwiched between the first and second mirror layers. A device according to the present invention comprising a resonant cavity light emitting diode (RCLED) mounted to a submount.

    摘要翻译: 根据本发明的用于制造高光提取光子器件的方法,包括在衬底上生长外延半导体结构并在外延半导体结构上沉积第一镜面层,使得外延半导体结构夹在第一镜面层和衬底之间 。 倒装芯片安装外延半导体结构,其第一反射镜和衬底位于基座上,使得外延半导体器件结构夹在基座和衬底之间。 然后通过向衬底引入蚀刻环境,从衬底去除衬底。 第二镜层沉积在外延半导体结构上,使得外延半导体结构夹在第一和第二镜层之间。 根据本发明的装置包括安装到底座的谐振腔发光二极管(RCLED)。

    Laser diode and method for fabricating same
    8.
    发明授权
    Laser diode and method for fabricating same 有权
    激光二极管及其制造方法

    公开(公告)号:US07769066B2

    公开(公告)日:2010-08-03

    申请号:US11600604

    申请日:2006-11-15

    IPC分类号: H01S5/00

    摘要: A laser diode and method for fabricating same, wherein the laser diode generally comprises an InGaN compliance layer on a GaN n-type contact layer and an AlGaN/GaN n-type strained super lattice (SLS) on the compliance layer. An n-type GaN separate confinement heterostructure (SCH) is on said n-type SLS and an InGaN multiple quantum well (MQW) active region is on the n-type SCH. A GaN p-type SCH on the MQW active region, an AlGaN/GaN p-type SLS is on the p-type SCH, and a p-type GaN contact layer is on the p-type SLS. The compliance layer has an In percentage that reduces strain between the n-type contact layer and the n-type SLS compared to a laser diode without the compliance layer. Accordingly, the n-type SLS can be grown with an increased Al percentage to increase the index of refraction. This along with other features allows for reduced threshold current and voltage operation.

    摘要翻译: 一种激光二极管及其制造方法,其中激光二极管通常包括在GaN n型接触层上的InGaN柔性层和在柔性层上的AlGaN / GaN n型应变超晶格(SLS)。 n型GaN分离限制异质结构(SCH)在所述n型SLS上,并且InGaN多量子阱(MQW)有源区在n型SCH上。 在MQW有源区上的GaN p型SCH,AlGaN / GaN p型SLS在p型SCH上,p型GaN接触层在p型SLS上。 顺应层具有与不具有柔顺层的激光二极管相比,n型接触层和n型SLS之间的应变的In百分比。 因此,n型SLS可以以增加的Al百分数生长以增加折射率。 这与其他功能一起允许降低阈值电流和电压操作。