公开(公告)号：US20060082994A1

公开(公告)日：2006-04-20

申请号：US10965852

申请日：2004-10-18

Applicant: Bily Wang ,  Jonnie Chuang ,  Ching-Hung Ko ,  Chun-Cheng Weng

Inventor： Bily Wang ,  Jonnie Chuang ,  Ching-Hung Ko ,  Chun-Cheng Weng

IPC: B60Q1/26

CPC classification number: F21V29/83 ,  F21K9/00 ,  F21V29/70 ,  F21Y2103/33 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K3/0058

Abstract: An LED lamp uses a plurality of LEDs as a light source. The LED lamp has a casing, a conduction layer, a PCB, a plurality of LED and a drive electronics. The conduction layer is placed in an inner of the casing. The conduction layer is metal, copper or aluminum, or nonmetal, silica gel or mica, for conducting the heat of the PCB caused by the current heating effects. The PCB placed on an upper surface of the conduction layer is for mounting the LED. Each LED is electrically connected to the PCB by way of shunt winding or in series for providing a light source. The drive electronics is electrically connected to the PCB for driving color rendering.

Abstract translation: LED灯使用多个LED作为光源。 LED灯具有壳体，导电层，PCB，多个LED和驱动电子器件。 导电层被放置在壳体的内部。 导电层是金属，铜或铝，或非金属，硅胶或云母，用于传导由当前的加热效应引起的PCB的热量。 放置在导电层上表面的PCB用于安装LED。 每个LED通过并联绕组或串联电连接到PCB，以提供光源。 驱动电路与PCB电连接，用于驱动显色。

公开(公告)号：US20060034071A1

公开(公告)日：2006-02-16

申请号：US10915537

申请日：2004-08-11

Applicant: Bily Wang ,  Jonnie Chuang ,  Ching-Hung Ko ,  Chun-Cheng Weng

Inventor： Bily Wang ,  Jonnie Chuang ,  Ching-Hung Ko ,  Chun-Cheng Weng

IPC: F21L4/00

CPC classification number: F21S8/00 ,  F21W2111/02 ,  F21Y2115/10

Abstract: An LED lamp is enabled to evenly emit lights, and is provided with a single set of indicators to provide different colors of light, and as least comprises a tubular case, a circuit board and at least an LED. The inner wall of the tubular case has a rough, light-homogenizing layer disposed thereon. The circuit board is provided together with a control unit on the bottom of the tubular case. The color mixing LED is provided on the circuit board.

Abstract translation: LED灯能够均匀地发光，并且设置有单组指示器以提供不同颜色的光，并且至少包括管状外壳，电路板和至少LED。 管状壳体的内壁具有设置在其上的粗糙的轻质均质层。 电路板与管状外壳底部的控制单元一起提供。 混色LED设在电路板上。

公开(公告)号：US20060232983A1

公开(公告)日：2006-10-19

申请号：US11108800

申请日：2005-04-19

Applicant: Bily Wang ,  Jonnie Chuang ,  Chun-Cheng Weng

Inventor： Bily Wang ,  Jonnie Chuang ,  Chun-Cheng Weng

IPC: F21V29/00

CPC classification number: F21V29/70 ,  F21K9/00 ,  H01L33/64 ,  Y10S362/80

Abstract: A light module includes a lighting unit, a heat-dissipation plate and an insulative plate. The lighting unit has a leading contact. The heat-dissipation plate contacts the lighting module closely and has a channel corresponding to the leading contact. The insulative plate is disposed under the heat-dissipation plate, and has a predetermined conductive pattern arranged thereon and a through hole corresponding to the channel. The leading contact of the lighting unit penetrates through the channel of the heat-dissipation plate and the through hole of the insulative plate to electrically connect with the predetermined conductive pattern of the insulative plate.

Abstract translation: 光模块包括照明单元，散热板和绝缘板。 照明单元有一个领先的接触。 散热板与照明模块紧密接触，并具有与引导触点对应的通道。 绝缘板设置在散热板下方，并且具有布置在其上的预定导电图案和与通道对应的通孔。 照明单元的前导触头穿过绝热板的散热板的通道和通孔，以与绝缘板的预定导电图案电连接。

公开(公告)号：US07255463B2

公开(公告)日：2007-08-14

申请号：US11108800

申请日：2005-04-19

Applicant: Bily Wang ,  Jonnie Chuang ,  Chun-Cheng Weng

Inventor： Bily Wang ,  Jonnie Chuang ,  Chun-Cheng Weng

IPC: B60Q1/06

CPC classification number: F21V29/70 ,  F21K9/00 ,  H01L33/64 ,  Y10S362/80

Abstract: A light module includes a lighting unit, a heat-dissipation plate and an insulative plate. The lighting unit has a leading contact. The heat-dissipation plate contacts the lighting module closely and has a channel corresponding to the leading contact. The insulative plate is disposed under the heat-dissipation plate, and has a predetermined conductive pattern arranged thereon and a through hole corresponding to the channel. The leading contact of the lighting unit penetrates through the channel of the heat-dissipation plate and the through hole of the insulative plate to electrically connect with the predetermined conductive pattern of the insulative plate.

Abstract translation: 光模块包括照明单元，散热板和绝缘板。 照明单元有一个领先的接触。 散热板与照明模块紧密接触，并具有与引导触点对应的通道。 绝缘板设置在散热板下方，并且具有布置在其上的预定导电图案和与通道对应的通孔。 照明单元的前导触头穿过绝热板的散热板的通道和通孔，以与绝缘板的预定导电图案电连接。

公开(公告)号：US20060086945A1

公开(公告)日：2006-04-27

申请号：US10973408

申请日：2004-10-27

Applicant: Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu ,  Ching-Hung Ko ,  Chun-Cheng Weng

Inventor： Bily Wang ,  Jonnie Chuang ,  Shih-Yu Wu ,  Ching-Hung Ko ,  Chun-Cheng Weng

IPC: H01L33/00

CPC classification number: H01L33/642 ,  H01L25/0753 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014

Abstract: A package structure for an optical-electrical semiconductor is described. The package structure has a thermal conductive structure for heat transfer and is integrally formed in one piece to improve the structural strength thereof, while the thermal conductive structure prevent over-heating of the LED device for greater longevity. The package structure reduces the failure rate in production and has improved quality. When the present invention is applied in light-emitting diode packages, the special requirement can be reached and has better properties than the prior art.

Abstract translation: 描述了一种用于光电半导体的封装结构。 封装结构具有用于传热的导热结构，并且整体形成为一体以提高其结构强度，而导热结构防止LED器件的过热延长寿命。 封装结构降低了生产中的故障率，并提高了质量。 当本发明应用于发光二极管封装中时，可以达到特殊要求并具有比现有技术更好的性能。