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公开(公告)号：US20210370649A1
公开(公告)日：2021-12-02
申请号：US17256727
申请日：2019-07-19
申请人： DAICEL-EVONIK LTD.
发明人： Daisuke FUJIKI , Toshihiko FUJINAKA
IPC分类号： B32B27/08 , B29C51/14 , B32B15/095 , B32B27/40 , B32B27/34 , B32B3/30 , B32B7/023 , C08L75/04 , C08L77/02 , C08L77/06
摘要： Provided is a laminate that generates a structural color, where the laminate can be subjected to a deep-drawing process without deteriorating the color developing structure of the structural color. The laminate according to an embodiment of the present invention includes a polyamide layer (1) and a thermoplastic polyurethane layer (2) having a color developing structure of a structural color. The thermoplastic polyurethane layer (2) is preferably a thermoplastic polyurethane layer having a structure having recesses and protrusions on a face that is opposite a face in contact with the polyamide layer (1) or a layer formed by alternately laminating two types of thermoplastic polyurethanes having a difference in refractive indexes of 0.03 or greater.
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公开(公告)号：US11142613B2
公开(公告)日：2021-10-12
申请号：US16313286
申请日：2017-04-10
申请人： DAICEL-EVONIK LTD.
发明人： Mitsuteru Mutsuda , Yoshiki Nakaie , Takayuki Uno
IPC分类号： C08J3/12 , C08K7/14 , C08L63/00 , C08L77/00 , C08G69/08 , C08G69/26 , C08K7/04 , C08G69/14 , C08J3/00 , C08K7/06
摘要： Polyamide particles including polyamide and having a water absorption rate of 0.5 to 2.5 wt. % are prepared to improve toughness of a cured product of a curable resin. The polyamide may be a semicrystalline polyamide. The polyamide has a glass transition temperature of approximately 100 to 150° C. The polyamide may have an alicyclic structure. The polyamide particles of this invention have an average particle size of approximately 5 to 40 μm and a specific surface area determined by the BET method of approximately 0.08 to 12 m2/g. The polyamide particles of the present invention may also be spherical and have an average particle size of approximately 15 to 25 μm. Furthermore, the polyamide particles of the present invention may have an exothermic peak in a temperature range between the glass transition temperature and a melting point of the polyamide upon heating the polyamide particles at a rate of 10° C./min by differential scanning calorimetry (DSC).
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公开(公告)号：US10370509B2
公开(公告)日：2019-08-06
申请号：US15759976
申请日：2016-10-05
申请人： DAICEL-EVONIK LTD.
发明人： Mitsuteru Mutsuda , Yoshiki Nakaie , Takayuki Uno
IPC分类号： C08J5/04 , C08J5/24 , C08J3/12 , C08J5/10 , B29B11/16 , C08G59/16 , C08K7/04 , C08L63/00 , C08L71/02 , C08L77/00 , C08G69/14 , C08G69/26
摘要： (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 μm. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C., or a polyamide resin having a γ-type crystal structure or a degree of crystallinity of not more than 50%). The matrix resin (C) may be a thermosetting resin.
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公开(公告)号：US10246586B2
公开(公告)日：2019-04-02
申请号：US14779226
申请日：2013-10-17
申请人： DAICEL-EVONIK LTD.
发明人： Tatsuki Akashi , Mitsuteru Mutsuda
摘要： Provided is an additive that increases or improves a light resistance of anon-fluorinated thermoplastic resin (e.g., a super engineering plastic, such as an aromatic polyamide, a liquid crystal polyester, or an aromatic polyetherketone resin). The additive comprises a fluorine-containing resin. The fluorine-containing resin may be, for example, a fluorine-containing resin comprising a tetrafluoroethylene unit as a monomer unit, in particular, may be a tetrafluoroethylene copolymer (e.g., at least one member selected from the group consisting of a copolymer of tetrafluoroethylene and another fluorinated olefin, a copolymer of tetrafluoroethylene and a fluorinated vinyl ether, and a copolymer of tetrafluoroethylene, another fluorinated olefin and a fluorinated vinyl ether).
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公开(公告)号：US20230089288A1
公开(公告)日：2023-03-23
申请号：US18074211
申请日：2022-12-02
申请人： DAICEL-EVONIK LTD.
发明人： Toshihiko FUJINAKA , HItomi OMAE
摘要： Provided is a polarizing sheet that can precisely impart a desired curved shape without causing whitening when bending is carried out. A polarizing sheet of an embodiment of the present invention having a structure in which a polyamide resin film (1), a polarizing film, and a polyamide resin film (2) are laminated in this order, wherein a retardation value of the polyamide resin film (1) is from 10 to 3000 nm, and the retardation value of the polyamide resin film (1) and a retardation value of the polyamide resin film (2) satisfy Formula (r): [Retardation Value of Polyamide Resin Film (1)]−[Retardation Value of Polyamide Resin Film (2)]≥10 nm (r).
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公开(公告)号：US11407864B2
公开(公告)日：2022-08-09
申请号：US16143847
申请日：2018-09-27
申请人： DAICEL-EVONIK LTD.
发明人： Mitsuteru Mutsuda , Yoshiki Nakaie , Takayuki Uno
IPC分类号： C08J5/04 , C08J5/24 , C08J3/12 , C08J5/10 , C08G59/16 , C08K7/04 , C08L63/00 , C08L77/00 , C08G69/14 , C08G69/26 , C08K7/02 , C08K3/04 , B29B11/16 , C08L71/02
摘要： (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 μm. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C., or a polyamide resin having a γ-type crystal structure or a degree of crystallinity of not more than 50%). The matrix resin (C) may be a thermosetting resin.
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公开(公告)号：US20210198541A1
公开(公告)日：2021-07-01
申请号：US17267682
申请日：2019-08-07
发明人： Mitsuteru MUTSUDA , Hirofumi IGUCHI , Toshiaki NAKAMURA , Nao SATO , Mutsuo TEZUKA , Yasufumi NAKAJIMA
IPC分类号： C09J175/12 , C09J11/06 , C08G18/80 , C08G18/60 , C08G18/58 , B32B15/088 , B32B15/18 , B32B27/34 , B32B7/12
摘要： Provided are a curable resin composition having high durability and adherence to a base material such as a metal, a molded composite member formed by coating the base material with the curable resin composition and performing resin molding, and a production method for the same. The curable resin composition contains a polyamide-based resin, a blocked polyisocyanate, and an epoxy compound, and the polyamide-based resin has an amino group concentration from 20 to 300 mmol/kg, and has a water absorption of 1 mass % or less determined by a water absorption test specified by ASTM D570. The polyamide-based resin has a C8-18 alkylene chain and has a melting point from 160 to 250° C. Per 1 mol of amino groups of the polyamide-based resin, a proportion of isocyanate groups of the blocked polyisocyanate is from 1.5 to 5 mol, and a proportion of epoxy groups of the epoxy compound is from 0.1 to 0.8 mol.
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公开(公告)号：US20200284961A1
公开(公告)日：2020-09-10
申请号：US16645156
申请日：2018-09-03
申请人： DAICEL-EVONIK LTD.
发明人： Toshihiko FUJINAKA , Hitomi OMAE
摘要： Provided is a polarizing sheet that can precisely impart a desired curved shape without causing whitening when bending is carried out. A polarizing sheet of an embodiment of the present invention having a structure in which a polyamide resin film (1), a polarizing film, and a polyamide resin film (2) are laminated in this order, wherein a retardation value of the polyamide resin film (1) is from 10 to 3000 nm, and the retardation value of the polyamide resin film (1) and a retardation value of the polyamide resin film (2) satisfy Formula (r): [Retardation Value of Polyamide Resin Film (1)]−[Retardation Value of Polyamide Resin Film (2)]≥10 nm (r).
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9.发明申请公开(公告)号：US20190161587A1
公开(公告)日：2019-05-30
申请号：US16313286
申请日：2017-04-10
申请人： DAICEL-EVONIK LTD.
发明人： Mitsuteru MUTSUDA , Yoshiki NAKAIE , Takayuki UNO
摘要： Polyamide particles including polyamide and having a water absorption rate of 0.5 to 2.5 wt. % are prepared to improve toughness of a cured product of a curable resin. The polyamide may be a semicrystalline polyamide. The polyamide has a glass transition temperature of approximately 100 to 150° C. The polyamide may have an alicyclic structure. The polyamide particles of this invention have an average particle size of approximately 5 to 40 μm and a specific surface area determined by the BET method of approximately 0.08 to 12 m2/g. The polyamide particles of the present invention may also be spherical and have an average particle size of approximately 15 to 25 μm. Furthermore, the polyamide particles of the present invention may have an exothermic peak in a temperature range between the glass transition temperature and a melting point of the polyamide upon heating the polyamide particles at a rate of 10° C./min by differential scanning calorimetry (DSC).
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公开(公告)号：US20190048153A1
公开(公告)日：2019-02-14
申请号：US16143847
申请日：2018-09-27
申请人： DAICEL-EVONIK LTD.
发明人： Mitsuteru MUTSUDA , Yoshiki NAKAIE , Takayuki UNO
摘要： (A) A reinforcing fiber, (B) a resin particle, and (C) a matrix resin are combined to prepare a resin composition which improves a reinforcing effect by the reinforcing fiber. The reinforcing fiber (A) contains a carbon fiber. The resin particle (B) contains a semicrystalline thermoplastic resin, the semicrystalline thermoplastic resin in the resin particle (B) has an exothermic peak in a temperature range between a glass transition temperature of the semicrystalline thermoplastic resin and a melting point of the semicrystalline thermoplastic resin, the peak being determined by heating the resin particle (B) at a rate of 10° C./min. by differential scanning calorimetry (DSC), and the resin particle (B) has an average particle size of 3 to 40 μm. The semicrystalline thermoplastic resin may be a polyamide resin having a melting point of not lower than 150° C. (particularly, a polyamide resin having an alicyclic structure and a glass transition temperature of not lower than 100° C., or a polyamide resin having a γ-type crystal structure or a degree of crystallinity of not more than 50%). The matrix resin (C) may be a thermosetting resin.
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