公开(公告)号：US09049805B2

公开(公告)日：2015-06-02

申请号：US13599475

申请日：2012-08-30

Applicant: David Findley ,  Robert James Hill

Inventor： David Findley ,  Robert James Hill

IPC: H05K1/03 ,  H05K3/28 ,  H05K3/46 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K3/284 ,  H05K1/0203 ,  H05K1/0373 ,  H05K3/3447 ,  H05K3/4626 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T29/49124

Abstract: A printed wiring board (PWB) can be fabricated with enhanced thermal characteristics that can enable the use of higher performance electronic components and/or a smaller packaging configuration. A substrate layer of the PWB includes a matrix material and optional reinforcing fibers embedded in the matrix material. The matrix material and/or the reinforcing fibers may include thermally-conductive particles such as nanodiamonds that increase the thermal conductivity of the substrate layer. Holes may be formed through the substrate layer for receiving and/or electrically connecting electronic components. The thermally-conductive particles are sized sufficiently small to allow the formation of the holes through the substrate layer using conventional equipment and processes such as drilling. The PWB may also include a protective coating that comprises thermally-conductive particles. The thermally-conductive particles described herein can reduce the need for heavy and bulky metal thermal layers in a manufacturing-friendly manner.

Abstract translation: 可以制造具有增强的热特性的印刷电路板（PWB），其可以使用更高性能的电子部件和/或较小的封装结构。 PWB的基板层包括嵌入基体材料中的基体材料和任选的增强纤维。 基体材料和/或增强纤维可以包括增加基底层的导热性的导热颗粒，例如纳米金刚石。 可以通过用于接收和/或电连接电子部件的基底层形成孔。 导热颗粒的尺寸足够小以允许使用常规设备和诸如钻孔的工艺通过基底层形成孔。 PWB还可以包括包含导热颗粒的保护涂层。 本文所述的导热颗粒可以以制造友好的方式减少对重的和庞大的金属热层的需要。

公开(公告)号：US08417509B2

公开(公告)日：2013-04-09

申请号：US11761492

申请日：2007-06-12

Applicant: George Dante M. Pineda ,  David L. Howell ,  Laura R. Pszczolkowski ,  David Findley ,  Stephen Dulaney ,  Amy Hicks ,  Yongmei Jia ,  George W. Krauss

Inventor： George Dante M. Pineda ,  David L. Howell ,  Laura R. Pszczolkowski ,  David Findley ,  Stephen Dulaney ,  Amy Hicks ,  Yongmei Jia ,  George W. Krauss

IPC: G06F17/20

CPC classification number: G06F3/0481 ,  G06F17/27

Abstract: A predefined interface is presented to a remote user. A natural language inquiry from the remote user is received via the predefined interface. The natural language inquiry is configured for use in an analysis. A customized interface is presented to the remote user based on the analysis of the natural language inquiry. The customized interface includes a customized set of communications options for the remote user to route communications.

Abstract translation: 向远程用户提供预定界面。 通过预定界面接收来自远程用户的自然语言查询。 自然语言查询配置为用于分析。 基于对自然语言查询的分析，向远程用户提供定制界面。 定制界面包括用于远程用户路由通信的定制的一组通信选项。

公开(公告)号：US20080312903A1

公开(公告)日：2008-12-18

申请号：US11761492

申请日：2007-06-12

Applicant: George Dante M PINEDA ,  David L HOWELL ,  Laura R PSZCZOLKOWSKI ,  David FINDLEY ,  Stephen DULANEY ,  Amy HICKS ,  Yongmei JIA ,  George W. KRAUSS

Inventor： George Dante M PINEDA ,  David L HOWELL ,  Laura R PSZCZOLKOWSKI ,  David FINDLEY ,  Stephen DULANEY ,  Amy HICKS ,  Yongmei JIA ,  George W. KRAUSS

IPC: G06F17/20

CPC classification number: G06F3/0481 ,  G06F17/27

Abstract: A predefined interface is presented to a remote user. A natural language inquiry from the remote user is received via the predefined interface. The natural language inquiry is configured for use in an analysis. A customized interface is presented to the remote user based on the analysis of the natural language inquiry. The customized interface includes a customized set of communications options for the remote user to route communications.

Abstract translation: 向远程用户提供预定界面。 通过预定界面接收来自远程用户的自然语言查询。 自然语言查询配置为用于分析。 基于对自然语言查询的分析，向远程用户提供定制界面。 定制界面包括用于远程用户路由通信的定制的一组通信选项。

公开(公告)号：US20060224621A1

公开(公告)日：2006-10-05

申请号：US11096204

申请日：2005-03-31

Applicant: David Findley ,  Karthik Kannan ,  Srinivas Cherukuri ,  Robert Meyer ,  Amy Hicks ,  Benjamin Droney ,  Ying Ma

Inventor： David Findley ,  Karthik Kannan ,  Srinivas Cherukuri ,  Robert Meyer ,  Amy Hicks ,  Benjamin Droney ,  Ying Ma

IPC: G06F17/00

CPC classification number: G06Q10/107

Abstract: A system and method for processing e-mail is provided wherein an e-mail is received from an originator or a customer, a routing destination is determined and responses to the e-mail are retrieved from a library based on the selected routing destination. Customer data is then accessed and the responses are filtered based on customer information that is extrinsic to the e-mail. An agent can select a response from the list of filtered responses and the selected response can be sent to the originator.

Abstract translation: 提供了一种用于处理电子邮件的系统和方法，其中从发起者或客户接收电子邮件，确定路由目的地，并且基于所选择的路由目的地从库中检索对电子邮件的响应。 然后访问客户数据，并根据电子邮件外在的客户信息对响应进行过滤。 代理人可以从过滤的响应列表中选择一个响应，并且可以将所选的响应发送给发起者。

公开(公告)号：US20140060898A1

公开(公告)日：2014-03-06

申请号：US13599475

申请日：2012-08-30

Applicant: David Findley ,  Robert James Hill

Inventor： David Findley ,  Robert James Hill

IPC: H05K1/03 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K3/284 ,  H05K1/0203 ,  H05K1/0373 ,  H05K3/3447 ,  H05K3/4626 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T29/49124

Abstract: A printed wiring board (PWB) can be fabricated with enhanced thermal characteristics that can enable the use of higher performance electronic components and/or a smaller packaging configuration. A substrate layer of the PWB includes a matrix material and optional reinforcing fibers embedded in the matrix material. The matrix material and/or the reinforcing fibers may include thermally-conductive particles such as nanodiamonds that increase the thermal conductivity of the substrate layer. Holes may be formed through the substrate layer for receiving and/or electrically connecting electronic components. The thermally-conductive particles are sized sufficiently small to allow the formation of the holes through the substrate layer using conventional equipment and processes such as drilling. The PWB may also include a protective coating that comprises thermally-conductive particles. The thermally-conductive particles described herein can reduce the need for heavy and bulky metal thermal layers in a manufacturing-friendly manner.

Abstract translation: 可以制造具有增强的热特性的印刷电路板（PWB），其可以使用更高性能的电子部件和/或较小的封装结构。 PWB的基板层包括嵌入基体材料中的基体材料和任选的增强纤维。 基体材料和/或增强纤维可以包括增加基底层的导热性的导热颗粒，例如纳米金刚石。 可以通过用于接收和/或电连接电子部件的基底层形成孔。 导热颗粒的尺寸足够小以允许使用常规设备和诸如钻孔的工艺通过基底层形成孔。 PWB还可以包括包含导热颗粒的保护涂层。 本文所述的导热颗粒可以以制造友好的方式减少对重的和庞大的金属热层的需要。