公开(公告)号：US09507391B2

公开(公告)日：2016-11-29

申请号：US13305177

申请日：2011-11-28

申请人： Diane S. Busch ,  Michael S. June ,  Chunjian Ni ,  Pradeep Ramineni

发明人： Diane S. Busch ,  Michael S. June ,  Chunjian Ni ,  Pradeep Ramineni

IPC分类号： G06F1/20 ,  H01L23/34 ,  H01L23/467

CPC分类号： G06F1/20 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.

摘要翻译： 散热器包括多个翅片，其可以相对于散热器热耦合到的发热电子部件定位成多个取向。 可以使用控制器来检测升高的处理器温度并且激活驱动部件以自动调节散热器上的翅片的取向。 翅片可以移动并与在散热器上方形成的空气流对准。 可调节翅片散热片在电路板上布置处理器或其他发热电子部件提供了更大的灵活性。 散热鳍片的取向或位置也可以响应于空气流动方向的变化而自动改变，这表现为散热器或发热元件的温度升高。

公开(公告)号：US20130098593A1

公开(公告)日：2013-04-25

申请号：US13276362

申请日：2011-10-19

申请人： Diane S. Busch ,  Jason A. Matteson

发明人： Diane S. Busch ,  Jason A. Matteson

IPC分类号： F28F27/00

CPC分类号： H05K7/20209 ,  G06F1/206 ,  H05K7/2079 ,  H05K7/20836 ,  Y02D10/16

摘要： A computer system has a plurality of heat-generating computer devices arranged in a data center, a cooling system in the data center, and a real-time cooling controller. The cooling system is configured for directing a cooling fluid to a plurality of different zones of the computer system, where each zone is occupied by a different subset of the heat-generating devices. The real-time cooling controller is configured for monitoring a power consumption of the heat-generating devices at each zone, independently controlling a cooling fluid flow rate to each zone, targeting one of the zones for increased cooling in response to a detected increase in the power consumption at the targeted zone, and increasing the cooling fluid flow rate to the targeted zone in immediate response to the power consumption increase.

摘要翻译： 计算机系统具有布置在数据中心中的多个发热计算机装置，数据中心中的冷却系统和实时冷却控制器。 冷却系统被配置为将冷却流体引导到计算机系统的多个不同区域，其中每个区域被发热装置的不同子集所占据。 实时冷却控制器被配置为用于监测每个区域处的发热装置的功率消耗，独立地控制到每个区域的冷却流体流速，针对一个区域以响应于检测到的增加的冷却 在目标区域的功率消耗，并且立即响应于功率消耗增加而将目标区域的冷却流体流量增加。

公开(公告)号：US20100302725A1

公开(公告)日：2010-12-02

申请号：US12471625

申请日：2009-05-26

申请人： Diane S. Busch

发明人： Diane S. Busch

IPC分类号： G06F1/20 ,  F28F13/00 ,  B23P11/00

CPC分类号： G06F1/20 ,  F28D15/0233 ,  H01L23/427 ,  H01L23/433 ,  H01L2023/4056 ,  H01L2023/4081 ,  H01L2924/0002 ,  Y10T29/49945 ,  H01L2924/00

摘要： One embodiment provides a vapor chamber having an outwardly protruding boss. A frame surrounds a perimeter of the vapor chamber. A plurality of heat sink fins extend from the frame. A cross-member spans the frame across the vapor chamber wall and defines an opening through which the boss protrudes at least slightly beyond the cross-member. The heat sink may be secured to a socket on a circuit board, with the boss engaging a processor positioned in the socket. In response to securing the heat sink, the boss compresses flush with the cross-member and the cross-member engages the processor to seat the processor in the socket. The opening in the cross-member reinforces the boss against outward deformation.

摘要翻译： 一个实施例提供了具有向外突出的凸台的蒸气室。 框架围绕蒸气室的周边。 多个散热片从框架延伸。 横跨跨越蒸气室壁的框架并且限定了一个开口，凸台通过该开口至少稍微超过横梁。 散热器可以固定到电路板上的插座上，其中凸台接合位于插座中的处理器。 响应于固定散热器，凸台与横向构件齐平并且横向构件与处理器接合以将处理器安置在插座中。 横梁上的开口增强了凸台的外向变形。

公开(公告)号：US20130153199A1

公开(公告)日：2013-06-20

申请号：US13325198

申请日：2011-12-14

申请人： Diane S. Busch ,  Michael S. June ,  Mark E. Steinke

发明人： Diane S. Busch ,  Michael S. June ,  Mark E. Steinke

IPC分类号： F28F27/00

CPC分类号： F28F27/00 ,  F28D2021/0029 ,  F28F13/16 ,  F28F2250/00 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A system and method for cooling a heat-generating device. The system comprises a heat sink base for contacting the heat-generating device, and a plurality of heat sink fins extending from the heat sink base, wherein the fins provide airflow passages that are open along a top, a first side and a second side. An ionic air moving device is disposed along at least one side of the heat sink for moving air through the airflow passages, and a fan is mounted adjacent to the top of the fins for moving air through the airflow passages. A controller selectively controls the airflow through the heat sink using only the ionic device, only the fan, or both the ionic device and the fan. A user or a system component may instruct the controller to enter a performance mode, an energy efficiency mode, or an acoustic mode.

摘要翻译： 一种用于冷却发热装置的系统和方法。 该系统包括用于接触发热装置的散热器基座和从散热器基座延伸的多个散热鳍片，其中翅片提供沿顶部，第一侧面和第二侧开放的气流通道。 离子空气移动装置沿着散热器的至少一侧设置，用于使空气通过气流通道，并且风扇靠近翅片的顶部安装，以使空气通过气流通道。 控制器仅使用离子装置，仅风扇或离子装置和风扇来选择性地控制通过散热器的气流。 用户或系统组件可以指示控制器进入演奏模式，能量效率模式或声学模式。

公开(公告)号：US20130145612A1

公开(公告)日：2013-06-13

申请号：US13323811

申请日：2011-12-12

申请人： Diane S. Busch ,  Troy W. Glover ,  Michael S. June ,  Pradeep Ramineni

发明人： Diane S. Busch ,  Troy W. Glover ,  Michael S. June ,  Pradeep Ramineni

IPC分类号： G06F1/20 ,  H01P1/22 ,  H05K7/20

CPC分类号： G06F1/20 ,  G06F1/182 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H05K9/0041 ,  Y10T29/49018 ,  H01L2924/00

摘要： A system to remove heat from a heat-generating electronic component within a computer chassis and to contain electromagnetic radiation from traversing high-throughput vents in a bezel that forms a portion of the chassis containment structure comprises a heat sink having a fin structure with an inlet face, an outlet face and interconnected air channels therethrough, a base to engage the component and to transfer heat from the component to the fin structure, wherein the inlet face of the fin structure is disposed proximate the vents to block electromagnetic radiation from traversing the vents. In one embodiment, a heat pipe or a spreader bar moves heat from a base engaging a component distal from the bezel to the fin structure having an air inlet face proximal to the vents.

摘要翻译： 用于从计算机机箱内的发热电子部件移除热量并且在形成所述底盘容纳结构的一部分的边框中容纳穿过高通风口的电磁辐射的系统包括散热片，所述散热片具有翅片结构，所述散热片结构具有入口 面，出口面和相互连通的空气通道，底座，以接合部件并将热量从部件转移到散热片结构，其中散热片结构的入口面靠近通风口设置，以阻挡电磁辐射穿过通风口 。 在一个实施例中，热管或扩张杆将热量从接合远离边框的组件的基座移动到具有靠近通风口的进气面的翅片结构。

公开(公告)号：US20130138262A1

公开(公告)日：2013-05-30

申请号：US13305177

申请日：2011-11-28

申请人： Diane S. Busch ,  Michael S. June ,  Chunjian Ni ,  Pradeep Ramineni

发明人： Diane S. Busch ,  Michael S. June ,  Chunjian Ni ,  Pradeep Ramineni

IPC分类号： G05D23/19 ,  G06F1/20 ,  H05K7/20

CPC分类号： G06F1/20 ,  H01L23/34 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink comprises a plurality of fins that may be positioned in a plurality of orientations relative to a heat-generating electronic component to which the heat sink is thermally coupled. A controller may be used to detect an elevated processor temperature and to activate a drive member to automatically adjust the orientation of fins on the heat sink. The fins may be moved and aligned with an air flow made over the heat sink. The adjustable-fin heat sink affords added flexibility in arranging a processor or other heat-generating electronic component on a circuit board. The orientation or position of the heat sink fins may also be automatically changed in response to a change in the air flow direction as manifested by a rise in the temperature of the heat sink or the heat-generating member.

摘要翻译： 散热器包括多个翅片，其可以相对于散热器热耦合到的发热电子部件定位成多个取向。 可以使用控制器来检测升高的处理器温度并且激活驱动部件以自动调节散热器上的翅片的取向。 翅片可以移动并与在散热器上方形成的空气流对准。 可调节翅片散热片在电路板上布置处理器或其他发热电子部件提供了更大的灵活性。 散热鳍片的取向或位置也可以响应于空气流动方向的变化而自动改变，这表现为散热器或发热元件的温度升高。

公开(公告)号：US08018719B2

公开(公告)日：2011-09-13

申请号：US12471625

申请日：2009-05-26

申请人： Diane S. Busch

发明人： Diane S. Busch

IPC分类号： H05K5/00 ,  F28D15/00 ,  H05K7/20 ,  H01L23/34

CPC分类号： G06F1/20 ,  F28D15/0233 ,  H01L23/427 ,  H01L23/433 ,  H01L2023/4056 ,  H01L2023/4081 ,  H01L2924/0002 ,  Y10T29/49945 ,  H01L2924/00

摘要： One embodiment provides a vapor chamber having an outwardly protruding boss. A frame surrounds a perimeter of the vapor chamber. A plurality of heat sink fins extend from the frame. A cross-member spans the frame across the vapor chamber wall and defines an opening through which the boss protrudes at least slightly beyond the cross-member. The heat sink may be secured to a socket on a circuit board, with the boss engaging a processor positioned in the socket. In response to securing the heat sink, the boss compresses flush with the cross-member and the cross-member engages the processor to seat the processor in the socket. The opening in the cross-member reinforces the boss against outward deformation.

摘要翻译： 一个实施例提供了具有向外突出的凸台的蒸气室。 框架围绕蒸气室的周边。 多个散热片从框架延伸。 横跨跨越蒸气室壁的框架并且限定了一个开口，凸台通过该开口至少稍微超过横梁。 散热器可以固定到电路板上的插座上，其中凸台接合位于插座中的处理器。 响应于固定散热器，凸台与横向构件齐平并且横向构件与处理器接合以将处理器安置在插座中。 横梁上的开口增强了凸台的外向变形。