公开(公告)号：US4652065A

公开(公告)日：1987-03-24

申请号：US701575

申请日：1985-02-14

Applicant: Edgar R. Cassinelli

Inventor： Edgar R. Cassinelli

IPC: H01R12/04 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10 ,  H01R9/09

CPC classification number: H05K1/141 ,  H05K7/1084 ,  H05K1/023 ,  H05K2201/049 ,  H05K2201/10022 ,  H05K2201/10325 ,  H05K2201/10704 ,  H05K3/3447 ,  H05K3/368 ,  Y10T29/49126

Abstract: A semiconductor termination socket for use with a printed wiring board has a mounting socket base for attachment to the board and plural pin socket receiving elements in the base for connecting to leads of a semiconductor chip package which will be removably inserted into the socket. The socket further has electrical components fabricated within the socket base for connecting a pin of the socket and a termination potential. The electrical components are preferably fabricated using planar technology so that the socket becomes, in essence, a printed wiring board. The semiconductor packages can be of any configuration including, for example, 149 pin grid array packages. If more than one layer of component circuitry is needed, a plurality of layers can be embedded within the mounting socket.

Abstract translation: 与印刷电路板一起使用的半导体终端插座具有用于连接到基板的安装插座底座和底座中的多个插座接收元件，用于连接到可拆卸地插入插座中的半导体芯片封装的引线。 插座还具有在插座底座内制造的电气部件，用于连接插座的插脚和终端电位。 电气部件优选使用平面技术制造，使得插座本质上是印刷电路板。 半导体封装可以是包括例如149针栅格阵列封装的任何配置。 如果需要多于一层的部件电路，则可以在安装插座内嵌入多个层。