公开(公告)号：US20060292740A1

公开(公告)日：2006-12-28

申请号：US11425694

申请日：2006-06-21

申请人： Edward Applebaum

发明人： Edward Applebaum

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L25/072 ,  H01L21/56 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/49562 ,  H01L24/32 ,  H01L2224/40227 ,  H01L2924/00014 ,  H01L2224/37099

摘要： A high temperature semiconductor packaging, a method for making the same packaging are providing. The packaging comprises a mounting platform, a semiconductor die positioned above the platform and a layer of high temperature passivation coating.

摘要翻译： 提供高温半导体封装，制造相同包装的方法。 该包装包括安装平台，位于平台上方的半导体管芯和一层高温钝化涂层。

公开(公告)号：US07115812B2

公开(公告)日：2006-10-03

申请号：US10931767

申请日：2004-08-31

申请人： Edward Applebaum

发明人： Edward Applebaum

IPC分类号： H05K9/00

CPC分类号： H01L23/556 ,  H01L23/047 ,  H01L23/10 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A radiation shielded semiconductor package for use in any variety of industries and applications is disclosed. In one embodiment, a radiation shielded semiconductor package comprises a radiation shielding base, one or more non-shielding sidewalls coupled to the shielding base, one or more radiation shielding flanges coupled to the sidewall, and one or more non-shielding coupling flanges coupled to the shielding flange. The base, the non-shielding sidewall, the shielding flange, and the non-shielding coupling flange define a device cavity, and at least one semiconductor device is positioned within the device cavity. A radiation shielding lid is coupled to the coupling flange and hermetically seals the semiconductor device within the device cavity. The shielding lid comprises shielding lid body and a non-shielding lid flange coupled to the lid body and is configured to couple to the coupling flange.

摘要翻译： 公开了用于各种行业和应用中的辐射屏蔽半导体封装。 在一个实施例中，辐射屏蔽半导体封装包括辐射屏蔽基底，耦合到屏蔽基底的一个或多个非屏蔽侧壁，耦合到侧壁的一个或多个辐射屏蔽凸缘以及耦合到 屏蔽法兰。 基座，非屏蔽侧壁，屏蔽凸缘和非屏蔽耦合凸缘限定了器件空腔，并且至少一个半导体器件位于器件腔内。 辐射屏蔽盖联接到联接凸缘并且将器件腔内的半导体器件气密地密封。 屏蔽盖包括屏蔽盖体和联接到盖体的非屏蔽盖凸缘，并且构造成联接到联接凸缘。

公开(公告)号：US20050051349A1

公开(公告)日：2005-03-10

申请号：US10931767

申请日：2004-08-31

申请人： Edward Applebaum

发明人： Edward Applebaum

IPC分类号： H01L20060101 ,  H01L23/047 ,  H01L23/10 ,  H01L23/552 ,  H01L23/556 ,  H05K9/00

CPC分类号： H01L23/556 ,  H01L23/047 ,  H01L23/10 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A radiation shielded device for use in any variety of industries and applications is disclosed herein. In one embodiment, a radiation shielded device disclosed includes a radiation shielding base, one or more non-shielding sidewalls coupled to the shielding base, one or more radiation shielding flanges coupled to the sidewall, one or more non-shielding coupling flanges coupled to the shielding flange, wherein the base, the non-shielding sidewall, the shielding flange, and the non-shielding coupling flange define a device cavity, at least one semiconductor device positioned within the device cavity, and a radiation shielding lid coupled to the coupling flange and hermetically sealing the semiconductor device within the device cavity, the shielding lid having a shielding lid body and a non-shielding lid flange coupled to the lid body and configured to couple to the coupling flange.

摘要翻译： 本文公开了用于各种工业和应用中的辐射屏蔽装置。 在一个实施例中，公开的辐射屏蔽设备包括辐射屏蔽底座，耦合到屏蔽底座的一个或多个非屏蔽侧壁，耦合到侧壁的一个或多个辐射屏蔽凸缘，耦合到该侧壁的一个或多个非屏蔽耦合凸缘 屏蔽凸缘，其中所述基座，所述非屏蔽侧壁，所述屏蔽凸缘和所述非屏蔽耦合凸缘限定器件空腔，定位在所述器件腔内的至少一个半导体器件，以及联接到所述耦合凸缘的辐射屏蔽盖 并且将所述半导体器件气密地密封在所述器件空腔内，所述屏蔽盖具有联接到所述盖体并被配置为耦合到所述耦合凸缘的屏蔽盖体和非屏蔽盖凸缘。

公开(公告)号：US06174995B1

公开(公告)日：2001-01-16

申请号：US08613822

申请日：1996-02-23

申请人： Haodong Li ,  Mark Adams ,  Solange Hanschke Lima ,  Ralph Alderson ,  Yuling Li ,  David Parmelee ,  John White ,  Edward Applebaum

发明人： Haodong Li ,  Mark Adams ,  Solange Hanschke Lima ,  Ralph Alderson ,  Yuling Li ,  David Parmelee ,  John White ,  Edward Applebaum

IPC分类号： C07K1452

CPC分类号： C07K14/52 ,  C07K14/523 ,  Y10S930/14

摘要： Human chemokine polypeptides and DNA/(RNA) encoding such chemokine polypeptides and a procedure for producing such polypeptides by recombinant techniques is disclosed. Also disclosed are methods for utilizing such chemokine polypeptides for the treatment of leukemia, tumors, chronic infections, autoimmune disease, fibrotic disorders, wound healing and psoriasis. Antagonists against such chemokine polypeptides and their use as a therapeutic to treat rheumatoid arthritis, autoimmune and chronic inflammatory and infective diseases, allergic reactions, prostaglandin-independent fever and bone marrow failure are also disclosed.

摘要翻译： 公开了人类趋化因子多肽和编码这种趋化因子多肽的DNA /（RNA）和通过重组技术产生此类多肽的方法。 还公开了利用这种趋化因子多肽治疗白血病，肿瘤，慢性感染，自身免疫疾病，纤维化病症，伤口愈合和牛皮癣的方法。 还公开了抗这种趋化因子多肽的拮抗剂及其作为治疗类风湿性关节炎，自身免疫性和慢性炎性和感染性疾病，过敏反应，前列腺素依赖性发烧和骨髓衰竭的治疗剂的用途。

公开(公告)号：US5306299A

公开(公告)日：1994-04-26

申请号：US948121

申请日：1992-09-21

申请人： Edward Applebaum

发明人： Edward Applebaum

IPC分类号： A61F2/18

CPC分类号： A61F2/18 ,  A61F2002/183

摘要： Disclosed is a prosthetic device for replacing a portion of the incus when the stapes or a portion of the lenticular process is generally intact. The device comprises an opening for receiving the head of the stapes or a portion of the lenticular process and a channel for receiving the remnant portion of the incus. The opening and the channel are oriented to allow proper functioning of the ossicular chain.

摘要翻译： 公开了一种假体装置，用于当镫骨或透镜状过程的一部分通常完整时更换砧骨的一部分。 该装置包括用于接收镫骨的头部或透镜过程的一部分的开口和用于接收砧座的残余部分的通道。 开口和通道被定向以允许听骨链的正常功能。