公开(公告)号：US06228429B1

公开(公告)日：2001-05-08

申请号：US09495545

申请日：2000-02-01

申请人： Terry Bluck ,  James H. Rogers ,  Jun Xie ,  Eric C. Lawson

发明人： Terry Bluck ,  James H. Rogers ,  Jun Xie ,  Eric C. Lawson

IPC分类号： B05D140

CPC分类号： C23C14/345 ,  B05D3/145 ,  C23C14/50 ,  C23C14/568 ,  G11B5/8404

摘要： A disk gripper for gripping an insulating disk, such as a glass disk, at its edge during processing includes a contact device for contacting the edge of the insulating disk and a mechanism for moving the contact device between a contact position, in contact with the edge of the disk, and a retracted position. In a first processing station, a conductive coating is applied to a disk held by the gripper, with the contact device in the retracted position. In a second processing station, ions are generated in a plasma adjacent to the surface of the disk held by the gripper. The contact device is in the contact position in contact with the conductive coating, and a bias voltage is applied to the contact device in the second processing station. The ions are accelerated from the plasma toward the disk by the bias voltage applied to the conductive coating.

摘要翻译： 用于在加工过程中在其边缘处夹持诸如玻璃盘的绝缘盘的盘夹持器包括用于接触绝缘盘的边缘的接触装置和用于使接触装置在与边缘接触的接触位置之间移动的机构 的缩回位置。 在第一处理站中，将导电涂层施加到由夹持器保持的盘上，其中接触装置处于缩回位置。 在第二处理站中，在由夹持器保持的盘的表面附近的等离子体中产生离子。 接触装置处于与导电涂层接触的接触位置，并且偏压被施加到第二处理站中的接触装置。 通过施加到导电涂层的偏置电压将离子从等离子体加速到盘。

公开(公告)号：US5738767A

公开(公告)日：1998-04-14

申请号：US342275

申请日：1994-11-23

申请人： George L. Coad ,  Eric C. Lawson ,  John Lester Hughes

发明人： George L. Coad ,  Eric C. Lawson ,  John Lester Hughes

IPC分类号： C23C14/56 ,  C03C17/00 ,  C23C14/50 ,  C23C14/34

CPC分类号： C03C17/002 ,  C23C14/50 ,  C23C14/56 ,  C23C14/566

摘要： A vacuum processing system for handling and processing rectangular glass panels for flat panel displays has a cluster configuration. The system includes a central buffer chamber, with multiple processing chambers, a load lock and an unload lock positioned around the buffer chamber and coupled to the buffer chamber through gate valves. The buffer chamber contains a turntable that is rotatable about a vertical axis. The system further includes substrate carriers, each for supporting a substrate in a vertical orientation as it is transported through the system and is processed. The turntable has dual substrate carrier positions for rotating substrate carriers into alignment with a selected processing chamber, the load lock or the unload lock. Multiple substrates can be handled and processed concurrently to achieve a high throughput rate. The system is typically used for sputter deposition of ITO films and metal films on the glass substrate.

摘要翻译： 用于处理和处理用于平板显示器的矩形玻璃面板的真空处理系统具有集群配置。 该系统包括中央缓冲室，具有多个处理室，负载锁定和位于缓冲室周围的卸载锁定，并通过闸阀连接到缓冲室。 缓冲室包含可围绕垂直轴线旋转的转台。 该系统还包括基板载体，每个基板载体用于在垂直方向上支撑基板，因为其被传送通过系统并被处理。 转盘具有用于使基板载体与所选择的处理室，加载锁定或卸载锁定对准的双基板载体位置。 可以同时处理和处理多个基板以实现高吞吐率。 该系统通常用于ITO膜和金属膜溅射沉积在玻璃基板上。

公开(公告)号：US06517691B1

公开(公告)日：2003-02-11

申请号：US09562039

申请日：2000-05-01

申请人： Terry Bluck ,  John Les Hughes ,  Eric C. Lawson ,  Tatsuru Tanaka

发明人： Terry Bluck ,  John Les Hughes ,  Eric C. Lawson ,  Tatsuru Tanaka

IPC分类号： C23C1434

CPC分类号： H01L21/67161 ,  C23C14/568 ,  C23C16/4587 ,  C23C16/54 ,  G11B5/725 ,  G11B5/8408 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67207 ,  H01L21/67236 ,  H01L21/67276 ,  Y10S414/138

摘要： A substrate processing system includes a primary processing assembly and secondary processing assembly. The secondary processing assembly has one or more interconnected modules and includes one or more process stations. The primary and secondary processing assemblies are connected by a vacuum conveyor, so that the substrates remain in vacuum during transport. The secondary processing assembly may include one or more modules which are interconnected to provide a desired system configuration. A dual processing module, including first and second process stations, is selectably operable in a serial mode or a parallel mode.

摘要翻译： 基板处理系统包括主处理组件和二次加工组件。 二次加工组件具有一个或多个互连模块并且包括一个或多个处理站。 初级和次级加工组件通过真空输送机连接，使得基材在运输过程中保持真空。 二次加工组件可以包括互连以提供期望的系统配置的一个或多个模块。 包括第一和第二处理站的双重处理模块可选地以串行模式或并行模式工作。

公开(公告)号：US5425611A

公开(公告)日：1995-06-20

申请号：US227085

申请日：1994-04-13

申请人： John L. Hughes ,  Eric C. Lawson

发明人： John L. Hughes ,  Eric C. Lawson

IPC分类号： C23C14/56 ,  B65G49/07 ,  G11B5/84 ,  G11B23/00 ,  H01J37/20 ,  H01J37/32 ,  H01L21/677 ,  C23C13/08

CPC分类号： H01L21/67706 ,  G11B23/00 ,  G11B5/8404 ,  H01L21/67712 ,  H01L21/6773 ,  H01L21/67754 ,  H01L21/6776 ,  Y10S414/137 ,  Y10S414/138 ,  Y10S414/139 ,  Y10S414/14

摘要： This invention relates to a system for handling and processing thin substrates, such as substrates for magnetic disks. The system includes a main chamber, entrance and output load locks, a buffer chamber, substrate load/unload structure, and a plurality of substrate processing stations positioned contiguous with the main vacuum chamber. The system further includes a transport for moving a plurality of cassettes carrying vertically oriented substrates into the entrance load lock, to the buffer chamber where the substrates are transferred into the main chamber, and to the output load lock where processed substrates are placed back in the cassettes. The substrates are transferred to and from the cassettes to and from the substrate load/unload structure by way of dedicated lift blades. The system further employs a simple three-step transfer of the substrates from processing station to processing station which greatly increases the throughput potential compared to prior art systems which rely on complex substrate handling and transfer.

摘要翻译： 本发明涉及一种用于处理和处理诸如磁盘的薄基板的薄基板的系统。 该系统包括主室，入口和输出负载锁，缓冲室，衬底装载/卸载结构以及与主真空室邻接定位的多个衬底处理站。 该系统还包括用于将承载垂直取向的基板的多个盒移动到入口装载锁中的传送装置，其中基板被转移到主室中的缓冲室以及处理后的基板被放回到输出装载锁 盒子 基板通过专用的提升叶片传送到和从盒子移出和从基板装载/卸载结构传送到基板装载/卸载结构。 与依赖于复杂的基板处理和传输的现有技术系统相比，系统进一步采用从处理站到处理站的简单的三步转移基板，这大大增加了吞吐量潜力。

公开(公告)号：US5215420A

公开(公告)日：1993-06-01

申请号：US763183

申请日：1991-09-20

申请人： John L. Hughes ,  Eric C. Lawson

发明人： John L. Hughes ,  Eric C. Lawson

IPC分类号： C23C14/56 ,  B65G49/07 ,  G11B5/84 ,  G11B23/00 ,  H01J37/20 ,  H01J37/32 ,  H01L21/677

CPC分类号： H01L21/67706 ,  G11B23/00 ,  G11B5/8404 ,  H01L21/67712 ,  H01L21/6773 ,  H01L21/67754 ,  H01L21/6776 ,  Y10S414/137 ,  Y10S414/138 ,  Y10S414/139 ,  Y10S414/14

摘要： A system for handling and processing thin substrates, such as substrates for magnetic disks. The system includes a main chamber, entrance and output load locks, a buffer chamber, substrate load/unload mechanism, and a plurality of substrate processing stations positioned contiguous with the main vacuum chamber. The system further includes a transport for moving a plurality of cassettes carrying vertically oriented substrates into the entrance load lock, to the buffer chamber where the substrates are transferred into the main chamber, and to the output load lock where processed substrates are placed back in the cassettes. The substrates are transferred to and from the cassettes to and from the substrate load/unload mechanism by means of dedicated lift blades. The system further employs a simple three-step transfer of the substrates from processing station to processing station which greatly increases the throughput potential compared to prior art systems which rely on complex substrate handling and transfer.

摘要翻译： 用于处理和处理薄基板的系统，例如用于磁盘的基板。 该系统包括主室，入口和输出负载锁，缓冲室，基板装载/卸载机构以及与主真空室邻接定位的多个基板处理站。 该系统还包括用于将承载垂直取向的基板的多个盒移动到入口装载锁中的传送装置，其中基板被转移到主室中的缓冲室，以及处理后的基板被放回到输出装载锁 盒子 这些基板通过专用的提升叶片传送到和从盒子移出和从基板装载/卸载机构传送到基板装载/卸载机构。 与依赖于复杂的基板处理和传输的现有技术系统相比，系统进一步采用从处理站到处理站的简单的三步转移基板，这大大增加了吞吐量潜力。