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公开(公告)号：US09391447B2
公开(公告)日：2016-07-12
申请号：US13976970
申请日：2012-03-06
CPC分类号： H02H9/02 , G01R1/07385 , G01R1/36 , G01R31/2889
摘要： An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.
摘要翻译： 描述了内插器来调节晶圆测试工具中的电流。 在一个示例中，插入器包括耦合到自动测试设备的第一连接焊盘和耦合到被测器件的第二连接焊盘。 插入器还包括过电流限制电路，用于连接第一和第二连接焊盘，并且当第一和第二连接焊盘之间的电流超过预定量时，断开第一和第二连接焊盘。
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公开(公告)号：US20140029150A1
公开(公告)日：2014-01-30
申请号：US13976970
申请日：2012-03-06
IPC分类号： H02H9/02
CPC分类号： H02H9/02 , G01R1/07385 , G01R1/36 , G01R31/2889
摘要： An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.
摘要翻译： 描述了内插器来调节晶圆测试工具中的电流。 在一个示例中，插入器包括耦合到自动测试设备的第一连接焊盘和耦合到被测器件的第二连接焊盘。 插入器还包括过电流限制电路，用于连接第一和第二连接焊盘，并且当第一和第二连接焊盘之间的电流超过预定量时，断开第一和第二连接焊盘。
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3.发明授权公开(公告)号：US09128121B2
公开(公告)日：2015-09-08
申请号：US13629891
申请日：2012-09-28
CPC分类号： G01R1/06722 , G01R1/06766 , H01R13/2421 , H02J15/00 , Y10T29/49117 , Y10T29/49169
摘要： A mechanism is described for facilitating a dynamic electro-mechanical interconnect capable of being employed in a test system according to one embodiment. A method of embodiments of the invention may include separating, via a cavity, a first conductor of an interconnect from a second conductor of the interconnect, and isolating, via the cavity serving as a buffer, a first electrical path provided through the first conductor from a second electrical path provided through the second conductor.
摘要翻译： 描述了一种用于促进根据一个实施例的能够用于测试系统中的动态电 - 机械互连的机构。 本发明的实施例的方法可以包括通过空腔将互连的第一导体与互连的第二导体分离，并且经由用作缓冲器的空腔隔离通过第一导体提供的第一电路径 通过第二导体提供的第二电路径。
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4.发明申请公开(公告)号：US20140091824A1
公开(公告)日：2014-04-03
申请号：US13629891
申请日：2012-09-28
CPC分类号： G01R1/06722 , G01R1/06766 , H01R13/2421 , H02J15/00 , Y10T29/49117 , Y10T29/49169
摘要： A mechanism is described for facilitating a dynamic electro-mechanical interconnect capable of being employed in a test system according to one embodiment. A method of embodiments of the invention may include separating, via a cavity, a first conductor of an interconnect from a second conductor of the interconnect, and isolating, via the cavity serving as a buffer, a first electrical path provided through the first conductor from a second electrical path provided through the second conductor.
摘要翻译： 描述了一种用于促进根据一个实施例的能够用于测试系统中的动态电 - 机械互连的机构。 本发明的实施例的方法可以包括通过空腔将互连的第一导体与互连的第二导体分离，并且经由用作缓冲器的空腔隔离通过第一导体提供的第一电路径 通过第二导体提供的第二电路径。
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