摘要:
Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
摘要:
A method for automatic instrument address recognition includes requesting a list of instruments attached to a bus, collecting the list of instruments, querying each listed instrument for an identification string, comparing the identification string of each instrument to a matching pattern, and determining a match of the identification string with an instrument of interest, and selecting an address of the instrument having the identification string matching the matching pattern and returning the address for controlling the instrument of interest.
摘要:
Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
摘要:
Optical triggering system and method for synchronizing a test of an integrated circuit chip with its operation. An optical triggering system includes a testing mechanism, such as a PICA testing mechanism, for testing an integrated circuit chip. An optical trigger mechanism generates an optical trigger signal for synchronizing a test of the integrated circuit chip with its operation. The optical trigger mechanism provides an optical trigger signal having reduced jitter and a higher frequency rate than an electrical trigger signal resulting in a more accurate test of the integrated circuit chip.
摘要:
An emission map of a circuit to be tested for alterations is obtained by measuring the physical circuit to be tested. An emission map of a reference circuit is obtained by measuring a physical reference circuit or by simulating the emissions expected from the reference circuit. The emission map of the circuit to be tested is compared with the emission map of the reference circuit, to determine presence of alterations in the circuit to be tested, as compared to the reference circuit.
摘要:
A Scanning Time-Resolved Emission (S-TRE) microscope or system includes an optical system configured to collect light from emissions of light generated by a device under test (DUT). A scanning system is configured to permit the emissions of light to be collected from positions across the DUT in accordance with a scan pattern. A timing photodetector is configured to detect a single photon or photons of the emissions of light from the particular positions across the DUT such that the emissions of light are correlated to the positions to create a time-dependent map of the emissions of light across the DUT.
摘要:
A background process is used to install at least one system hook for message interception of integrated circuit chip layout display software. A call message is intercepted through the system hook, and, responsive to the call message, current layout coordinates are read from the integrated circuit chip layout display software. A representation of the current layout coordinates is entered into tool control software configured to control a physical tool for analyzing integrated circuits, and the physical tool is controlled with the tool control software, based on the representation of the current layout coordinates. In an “inverse” approach, a background process is used to install at least one system hook for message interception of tool control software configured to control a physical tool for analyzing integrated circuits, and a call message is intercepted through the system hook. Responsive to the call message, current coordinates are read from the tool control software. A representation of the current coordinates is entered into integrated circuit chip layout display software, and at least a portion of an integrated circuit layout, corresponding to the representation of the current coordinates from the tool control software, is displayed.
摘要:
Improved process variation sensors and techniques are disclosed, wherein both global and local variations associated with transistors on an integrated circuit can be monitored. For example, respective circuits for sensing a global process variation, a local process variation between neighboring negative-channel type transistors, and a local process variation between neighboring positive-channel type transistors are disclosed. Further, in one example, a method for sensing a process variation associated with transistors on an integrated circuit includes providing at least one process variation sensor on the integrated circuit, the process variation sensor comprising a sensing portion including one or more transistors and a loading and amplification portion including one or more transistors, and operating the one or more transistors of the sensing portion and the one or more transistors of the loading and amplification portion in a subthreshold region of transistor operation such that when a threshold voltage of at least one of the transistors changes, a process variation is sensed.
摘要:
Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
摘要:
This embodiment replaces the use of LBIST to get a pass or no-pass result. A selective signature feature is used to collect the top failing paths, by shmooing the chip over a cycle time. These paths can be stored on-chip or off-chip, for later use. Once the chip is running in the field for a certain time, the same procedure is performed to collect the top failing paths, and this is compared with the stored old paths. If the order of the top paths changes, it indicates that (for example) there is a path (not the slowest path before) that slows more than others, which could be potential reliability concern. Therefore, a potential reliability failure is identified in the field.