公开(公告)号：US06698511B2

公开(公告)日：2004-03-02

申请号：US10150730

申请日：2002-05-17

申请人： Joseph Ted DiBene, II ,  Farhad Raiszadeh

发明人： Joseph Ted DiBene, II ,  Farhad Raiszadeh

IPC分类号： F28F700

CPC分类号： H01L23/3672 ,  H01L2924/15192

摘要： A method, apparatus, and article of manufacture for improving the thermal efficiency for heat transfer from an electronic device using a vortex heatsink arrangement. The apparatus comprises a fin array having a plurality of fins and having a variable fin density, the fin array including a first fin array region proximate to and in thermal contact with the heat dissipating device; a second fin array region distant from the heat dissipating device. The first fin region includes a first fin density and the second fin region includes a second fin density less than the first fin density.

摘要翻译： 一种用于提高使用涡流散热装置的电子装置的热传递热效率的方法，装置和制品。 该装置包括具有多个翅片并具有可变散热片密度的散热片阵列，所述散热片阵列包括靠近并与散热装置热接触的第一翅片阵列区域; 远离散热装置的第二鳍片阵列区域。 第一散热片区域包括第一散热片密度，第二散热片区域包括小于第一散热片密度的第二散热片密度。

公开(公告)号：US06490160B2

公开(公告)日：2002-12-03

申请号：US09921153

申请日：2001-08-02

申请人： Joseph T. Dibene, II ,  Farhad Raiszadeh

发明人： Joseph T. Dibene, II ,  Farhad Raiszadeh

IPC分类号： H05K720

CPC分类号： H05K7/1092 ,  F28D15/0233 ,  F28D15/04 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7088 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00

摘要： A heat transfer device wherein a vapor chamber is combined with a pin structure that allows the highly conductive cooling vapors to flow within the pins of a pin array maximizing the efficiency of both components of the heat sink into one unit is disclosed. In one embodiment the heat transfer device comprises a thermally conductive chamber having a first thermally conductive chamber portion having a base thermally coupleable to a heat dissipating device; a second thermally conductive chamber portion having a plurality of hollow protrusions extending away from and in fluid communication with the first thermally conductive chamber portion wherein the thermally conductive chamber comprises a fluid vaporizable when in thermal communication with the heat dissipating device and condensable when in thermal communication with the hollow protrusions.