公开(公告)号：US11929673B2

公开(公告)日：2024-03-12

申请号：US17452816

申请日：2021-10-29

Applicant: Ferric Inc.

Inventor： Francesco Carobolante ,  James T. Doyle ,  Noah Andrew Sturcken

IPC: H02M3/07 ,  G06F1/26

CPC classification number: H02M3/07 ,  G06F1/26

Abstract: An assembly includes a three-level voltage converter and a second voltage converter. The three-level voltage converter is electrically coupled to a battery to convert a battery supply voltage to an intermediate voltage. The second voltage converter is electrically coupled to the three-level voltage converter to convert the intermediate voltage to a processor-supply voltage to operate a processor. At least the second voltage converter and the processor are mounted on a processor-package substrate. The three-level voltage converter can be mounted on the processor-package substrate or on a circuit board on which the processor-package substrate is mounted.

公开(公告)号：US20230326654A1

公开(公告)日：2023-10-12

申请号：US18332928

申请日：2023-06-12

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Denis Shishkov ,  Matthew Cavallaro ,  Michael Lekas ,  Ryan Davies

IPC: H01F27/24 ,  H01F27/25 ,  H01F41/02 ,  H01F41/18

CPC classification number: H01F27/24 ,  H01F27/25 ,  H01F41/0213 ,  H01F41/18

Abstract: A method for manufacturing a vertically-laminated ferromagnetic core includes (a) depositing a conductive seed layer on or over a first side of a substrate; (b) depositing a masking layer on or over a second side of the substrate, the first and second sides on opposite sides of the substrate; (c) forming a pattern in the masking layer; (d) dry etching the substrate, based on the pattern in the masking layer, from the second side to the first side to expose portions of the conductive seed layer; and (e) depositing a ferromagnetic material onto the exposed portions of the conductive seed layer to form vertically-oriented ferromagnetic layers.

公开(公告)号：US11058001B2

公开(公告)日：2021-07-06

申请号：US16007631

申请日：2018-06-13

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H01F27/28 ,  H05K1/18 ,  H01F41/04 ,  H01F41/02 ,  H01F27/24 ,  H05K1/02 ,  H05K1/11 ,  H01F17/00 ,  H01F41/32 ,  H05K1/16 ,  H05K1/03

Abstract: A structure comprises a semiconductor integrated circuit, an inductor, and a magnetic flux closure layer. The inductor is integrated into a multilevel wiring network in the semiconductor integrated circuit. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic flux closure layer is disposed within about 100 μm of a face of the planar laminated magnetic core, the face of the planar magnetic core parallel to a principal plane of the planar laminated magnetic core. A second magnetic flux closure layer can be disposed within about 100 μm of an opposing face of the planar laminated magnetic core.

公开(公告)号：US20200168394A1

公开(公告)日：2020-05-28

申请号：US16778154

申请日：2020-01-31

Applicant: Ferric Inc.

Inventor： Michael Lekas ,  Noah Sturcken

IPC: H01F38/14 ,  H04B5/00 ,  H01F27/24 ,  H01L23/64 ,  H02J50/12

Abstract: Power and/or data are transmitted through variable magnetic fields between a first transceiver coil on a transceiver apparatus and a second transceiver coil in an inductor integrated into a multilevel wiring structure on a semiconductor integrated circuit chip. The first transceiver apparatus generates magnetic fields and can transmit data by varying a characteristic of the magnetic fields. The second transceiver coil receives the power from and/or detects data in the magnetic fields from the first transceiver apparatus. The inductor can include a ferromagnetic core that concentrates magnetic flux to improve data or power transmission efficiency to miniaturize the second transceiver coil while maintaining adequate inductive coupling between the coils. The second transceiver coil can transmit data by varying the impedance of the inductor and/or the integrated circuit. The semiconductor integrated circuit chip can be coupled to an object and the second transceiver coil can transmit data relating to the object.

公开(公告)号：US10658331B2

公开(公告)日：2020-05-19

申请号：US16129305

申请日：2018-09-12

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ehsan Kalami ,  Joseph Meyer ,  Michael Lekas

IPC: H01L25/065 ,  H02M3/158 ,  H01L49/02 ,  H01L23/48 ,  H01L23/64

Abstract: A power management module comprises one or more power converter chips that are mounted on a power management package substrate. First and second electrical contacts are disposed on opposing first and second sides of the power management package substrate. The power management module can be mounted on a processor module to supply power to one or more processor chips in the processor module. In one example, the processor chip(s) are mounted on a first side of a processor package substrate and the power management module is mounted on an opposing second side of the processor package substrate. The power management module and the processor module can be centered and aligned with respect to each other or they can be offset laterally from each other. In another embodiment, the processor chip(s) are embedded in the processor package substrate.

公开(公告)号：US20200152364A1

公开(公告)日：2020-05-14

申请号：US16184024

申请日：2018-11-08

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Michael Lekas

IPC: H01F7/06 ,  H01L23/522 ,  H01L27/092 ,  H01F7/14 ,  H01F7/08 ,  H01F7/126 ,  B64C33/02

Abstract: A ferromagnetic actuator is disposed between first and second semiconductor devices that include first and second inductors. Each inductor is disposed on top of a multilevel wiring structure. Current flows through the first inductor to generate a first magnetic field that attracts the ferromagnetic actuator towards the first inductor causing the ferromagnetic actuator to transition from a first state to a second state. In the second state, a portion of the ferromagnetic actuator is disposed closer to the first inductor than it is in the first state. Current flows through the second inductor to generate a second magnetic field that attracts the ferromagnetic actuator towards the second inductor causing the ferromagnetic actuator to transition from the first or second state to a third state. In the third state, a portion of the ferromagnetic actuator is disposed closer to the first inductor than it is in the first state.

公开(公告)号：US10354950B2

公开(公告)日：2019-07-16

申请号：US15053747

申请日：2016-02-25

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies

IPC: C08K3/08 ,  H01L23/29 ,  H01L23/522 ,  H01L49/02 ,  H01L23/528 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  C08K3/22 ,  H01F41/02 ,  H01F41/04 ,  H01L21/321 ,  H01F1/26 ,  H01F1/37 ,  H01F17/00 ,  H01F3/10

Abstract: A magnetic polymer for use in microelectronic fabrication includes a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix. The magnetic polymer can be part of an insulation layer in an inductor formed in one or more backend wiring layers of an integrated device. The magnetic polymer can also be in the form of a magnetic epoxy layer for mounting contacts of the integrated device to a package substrate.

公开(公告)号：US20190182957A1

公开(公告)日：2019-06-13

申请号：US16279574

申请日：2019-02-19

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Joseph Meyer ,  Michael Lekas ,  Ryan Davies ,  David Jew ,  William Lee

IPC: H05K1/18 ,  H05K1/16 ,  H05K1/11 ,  H05K1/02 ,  H01F27/24 ,  H01F27/28 ,  H01F41/02 ,  H01F41/04

Abstract: A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or on opposing surfaces of the substrate as the electrical terminations for the substrate. Another embodiment includes a switched inductor DC-DC power converter chiplet having a first powertrain phase and multiple second powertrain phases. When the load current is less than or equal to a threshold load current, the power conversion efficiency can be improved by only operating the first powertrain phase. When the load current is greater than the threshold load current, the power conversion efficiency can be improved by operating one or more second powertrain phases.

公开(公告)号：US10028385B2

公开(公告)日：2018-07-17

申请号：US14991111

申请日：2016-01-08

Applicant: Ferric Inc.

Inventor： Noah Andrew Sturcken

IPC: H01F7/06 ,  H05K1/18 ,  H05K1/16 ,  H05K1/11 ,  H01F27/24 ,  H01F27/28 ,  H01F41/02 ,  H01F41/04 ,  H05K1/02

Abstract: An inductor is integrated into a multilevel wiring network of a semiconductor integrated circuit. The inductor includes a planar magnetic core and a conductive winding. The conductive winding turns around in generally spiral manner on the outside of the planar magnetic core. The conductive winding is piecewise constructed of wire segments and of VIAs. The wire segments pertain to at least two wiring planes and the VIAs are interconnecting the at least two wiring planes. Methods for such integration, and for fabricating laminated planar magnetic cores are also presented.

公开(公告)号：US20180182841A1

公开(公告)日：2018-06-28

申请号：US15419562

申请日：2017-01-30

Applicant: Ferric Inc.

Inventor： Noah Sturcken ,  Ryan Davies ,  Hao Wu ,  Michael Lekas

IPC: H01L49/02 ,  H01L23/522 ,  H01L23/528 ,  H01L21/3205 ,  H01L21/288 ,  H01L21/027 ,  H01F27/24 ,  H01F27/28 ,  H01F41/04

CPC classification number: H01L28/10 ,  H01F17/0033 ,  H01F27/2804 ,  H01F41/046 ,  H01F41/26 ,  H01F2027/2809 ,  H01L23/5226 ,  H01L23/5227

Abstract: Methods of manufacturing are disclosed for an inductor that includes a magnetic core lying in a core plane. The magnetic core includes a vertical laminated structure with respect to the core plane of alternating ferromagnetic vertical layers and insulator vertical layers. An easy axis of magnetization can be permanently or semi-permanently fixed in the ferromagnetic vertical layers along a first axis orthogonal to the core plane. A hard axis of magnetization can be permanently or semi-permanently induced in the ferromagnetic vertical layers, the hard axis of magnetization lying in a plane that is orthogonal to the first axis.