公开(公告)号：US20140224281A1

公开(公告)日：2014-08-14

申请号：US14346163

申请日：2011-09-22

Applicant: Xiaoyan Zhang ,  Fuping Chen ,  Hui Wang

Inventor： Xiaoyan Zhang ,  Fuping Chen ,  Hui Wang

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67051 ,  H01L21/02052 ,  H01L21/67023 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/7501 ,  H01L2224/81911 ,  H01L2924/014

Abstract: An apparatus for cleaning flip chip assemblies is provided. The apparatus comprises: a chuck assembly; a motor coupled to the chuck assembly by a spindle; at least one carrier for holding flip chips; at least one spray nozzle for directing DIW, a cleaning solution, a gas or a vapor. Apparatus of the invention further provides a method for cleaning flip chip assemblies. The method comprises: loading at least one flip chip to the flip chip carriers; rotating the chuck assembly at a rotation speed; flowing DIW for rinsing the flip chips; flowing a cleaning solution for removing the contaminants; applying ultrasonic/megasonic energy to the flip chips; blowing a gas or a vapor via the spray nozzles for drying the flip chips; bringing the flip chips out of the flip chip carriers.

Abstract translation: 提供一种用于清洁倒装芯片组件的装置。 该装置包括：卡盘组件; 由主轴联接到卡盘组件的马达; 用于保持倒装芯片的至少一个载体; 用于引导DIW，清洁溶液，气体或蒸汽的至少一个喷嘴。 本发明的装置还提供了一种清洁倒装芯片组件的方法。 该方法包括：将至少一个倒装芯片加载到倒装芯片载体; 以旋转速度旋转卡盘组件; 流动DIW冲洗倒装芯片; 流动清洁溶液去除污染物; 向倒装芯片施加超声/兆声波能量; 通过喷嘴吹入气体或蒸气以干燥倒装芯片; 将倒装芯片从倒装芯片载体中取出。