Optoelectric interconnect and method for interconnecting an optical
fiber with an optoelectric device
    2.
    发明授权
    Optoelectric interconnect and method for interconnecting an optical fiber with an optoelectric device 失效
    用于将光纤与光电器件互连的光电互连和方法

    公开(公告)号:US5657409A

    公开(公告)日:1997-08-12

    申请号:US623244

    申请日:1996-03-28

    IPC分类号: G02B6/42 H01L27/15 G02B6/36

    摘要: An optoelectric interconnect (70) includes an optical fiber (17) coupled to a ferrule (11) and an optoelectric board (20). Metal layer (14) is disposed over a surface (12) of the ferrule (11). An optoelectric device (61) is coupled to the optoelectric board (20) using tape automated bonding tapes (47, 51). The optoelectric board (20) and the ferrule (11) are positioned adjacent each-other so that optical radiation is transmitted from the optoelectric device (61) to the optical fiber (17). The position of the optoelectric device (61) is adjusted to achieve an optimum position which is characterized by a maximum optical radiation transmitted to the optical fiber(17). Upon achieving the optimum position, two bonding strips (54, 56) are fused with the metal layer (14) on the surface (12) of the ferrule (11).

    摘要翻译: 光电互连(70)包括耦合到套圈(11)和光电板(20)的光纤(17)。 金属层(14)设置在套圈(11)的表面(12)上方。 光电装置(61)使用胶带自动粘结胶带(47,51)与光电板(20)连接。 光电板(20)和套圈(11)彼此相邻地定位,使得光辐射从光电装置(61)传输到光纤(17)。 调整光电器件(61)的位置以实现最佳位置,其特征在于传输到光纤(17)的最大光辐射。 在达到最佳位置时,两个接合条(54,56)与金属层(14)熔合在套圈(11)的表面(12)上。

    Planar encapsulation process
    3.
    发明授权
    Planar encapsulation process 失效
    平面封装工艺

    公开(公告)号:US5596172A

    公开(公告)日:1997-01-21

    申请号:US560505

    申请日:1995-11-17

    摘要: A method for encapsulating a surface of an integrated circuit to protect the surface. The surface has an outer peripheral area and an inner area to be encapsulated. A frame is provided for handling an integrated circuit package. A plurality of leads are coupled between the frame and the outer peripheral area. An encapsulation material is dispensed on the outer peripheral area covering and protecting a portion of the leads and integrated circuit. A planar encapsulation material is deposited for covering and protecting the inner area. The planar encapsulation material provides a planar surface.

    摘要翻译: 一种用于封装集成电路的表面以保护表面的方法。 该表面具有外围区域和要封装的内部区域。 提供用于处理集成电路封装的框架。 多个引线耦合在框架和外周区域之间。 封装材料分配在覆盖并保护引线和集成电路的一部分的外周区域上。 沉积平面封装材料以覆盖和保护内部区域。 平面封装材料提供平面表面。