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9 条记录 (耗时 0.016 秒)

    Apparatus for wafer carrier in-process clean and rinse
    1.
    发明授权
    Apparatus for wafer carrier in-process clean and rinse 失效
    用于晶片载体在线清洁和冲洗的装置

    公开(公告)号：US06505636B1

    公开(公告)日：2003-01-14

    申请号：US09603573

    申请日：2000-06-26

    申请人： Glenn W. Travis

    发明人： Glenn W. Travis

    IPC分类号： B08B300

    CPC分类号： H01L21/67051 ,  B08B3/02 ,  B24B37/04 ,  B24B55/00 ,  Y10S134/902

    摘要： A system and method for rinsing and cleaning a wafer carrier and a semiconductor wafer mounted thereon during a chemical mechanical planarization (CMP) process is provided. The system includes a head spray assembly that comprises a plurality of spray nozzles positioned therein. The head spray assemble is moveably positionable between a park position and a spray position. The spray position is adjacent the wafer carrier such that liquid discharged from the spray nozzles is in liquid communication with the wafer carrier, the semiconductor wafer and the interior of the head spray assembly. The system provides aggressive and uniform cleaning and rinsing while containing and collecting the liquid discharged from the spray nozzles and the materials rinsed from the wafer carrier and semiconductor wafer.

    摘要翻译： 提供了一种用于在化学机械平面化（CMP）工艺期间冲洗和清洁晶片载体和安装在其上的半导体晶片的系统和方法。 该系统包括头喷射组件，其包括位于其中的多个喷嘴。 喷头组合可在公园位置和喷雾位置之间移动地定位。 喷射位置与晶片载体相邻，使得从喷嘴排出的液体与晶片载体，半导体晶片和喷头组件的内部液体连通。 该系统提供积极和均匀的清洁和冲洗，同时容纳和收集从喷嘴喷射的液体和从晶片载体和半导体晶片冲洗的材料。

    Method and apparatus for dispensing a fluid media
    2.
    发明授权
    Method and apparatus for dispensing a fluid media 有权
    用于分配流体介质的方法和装置

    公开(公告)号：US06409051B1

    公开(公告)日：2002-06-25

    申请号：US09675085

    申请日：2000-09-28

    申请人： Glenn W. Travis

    发明人： Glenn W. Travis

    IPC分类号： G01F1100

    CPC分类号： G01F11/06 ,  G01F11/04

    摘要： An apparatus for dispensing media is provided. The apparatus has a rotating element having a cylindrical bore with a first end and a second end where the rotating element rotates the first end and the second end. The apparatus also includes a housing which has a fixed input port and a fixed output port where the housing encloses the rotating element. The first end and the second end of the rotating element intermittently switches between being aligned with the fixed input port and the fixed output port and being aligned with the fixed output port and the fixed input port, respectively. The apparatus also has a cylindrical piston contained within the cylindrical bore where the cylindrical piston has a length that is less than the cylindrical bore and switches from being closer to the fixed input port and the fixed output port.

    摘要翻译： 提供了用于分配介质的设备。 该装置具有旋转元件，该旋转元件具有圆柱形孔，第一端和第二端，旋转元件旋转第一端和第二端。 该装置还包括具有固定输入端口和固定输出端口的壳体，其中壳体围绕旋转元件。 旋转元件的第一端和第二端间歇地在与固定输入端口和固定输出端口对准之间切换并分别与固定输出端口和固定输入端口对准。 该装置还具有包含在圆柱形孔内的圆柱形活塞，其中圆柱形活塞的长度小于圆柱形孔，并从更靠近固定输入端口和固定输出端口切换。

    Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
    3.
    发明授权
    Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization 失效
    用于调理用于化学机械平面化的抛光垫的方法和装置

    公开(公告)号：US06328637B1

    公开(公告)日：2001-12-11

    申请号：US09612992

    申请日：2000-07-10

    申请人： Michael Labunsky ,  Tac Huynh ,  Anthony Meyer ,  Andrew Nagengast ,  Glenn W. Travis

    发明人： Michael Labunsky ,  Tac Huynh ,  Anthony Meyer ,  Andrew Nagengast ,  Glenn W. Travis

    IPC分类号： B24B100

    CPC分类号： B24B53/017 ,  B24B49/16 ,  B24D5/02

    摘要： A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.

    摘要翻译： 描述了一种用于调节抛光垫的方法和装置。 该方法包括将具有固定在其上的磨料的圆柱滚子移动到移动的抛光垫上的步骤。 辊可以通过与抛光垫接触而被动地旋转，或者主动往复运动，同时保持对抛光垫的压力。 该装置包括一个连接到一个或多个压力施加装置的圆柱滚子，该压力施加装置机械地连接到滚子上。

    Ticket dispenser
    5.
    发明授权
    Ticket dispenser 失效
    售票机

    公开(公告)号：US4306477A

    公开(公告)日：1981-12-22

    申请号：US159688

    申请日：1980-06-16

    申请人： Glenn W. Travis

    发明人： Glenn W. Travis

    IPC分类号： B26D5/26 ,  B65C9/08 ,  B26D5/22

    CPC分类号： B26D5/26 ,  B65C9/08 ,  Y10T83/4448 ,  Y10T83/4632

    摘要： The ticket dispenser includes lower and upper overlying support plates which define a ticket material passageway therebetween. A reel support is mounted on one end and cutting apparatus are mounted on the other end of the support plates. A feed slot is formed in the upper support plate and a feed pawl reciprocates in the feed slot. A feed pawl cam urges the feed pawl downwardly into engagement with the ticket material in the passageway as the feed pawl moves toward the cutting apparatus, and urges the feed pawl upwardly away from the ticket material as the feed pawl moves away from the cutting apparatus. As the feed pawl reaches the end of its feeding stroke, the cutting apparatus cuts off the portion of the ticket material that has been pushed beyond the cutting means, and feed out apparatus pulls additional ticket material from the reel.

    摘要翻译： 售票机包括限定其间的票据通道的下部和上部上部支撑板。 卷轴支撑件安装在一端并且切割装置安装在支撑板的另一端上。 进料槽形成在上支撑板中，进给爪在进料槽中往复运动。 当进给爪向切割装置移动时，进给棘爪凸轮促使进给爪向下与通道中的检验材料接合，并且当进给爪远离切割装置移动时，将进给爪向上远离检验材料推动。 当进给爪到达其进给行程的末端时，切割装置切断已被推出超过切割装置的售票材料的部分，并且送出装置从卷轴拉出另外的订票材料。

    Wafer carrier head assembly
    6.
    发明授权
    Wafer carrier head assembly 失效
    晶圆架头组件

    公开(公告)号：US06666756B1

    公开(公告)日：2003-12-23

    申请号：US09540603

    申请日：2000-03-31

    申请人： Glenn W. Travis

    发明人： Glenn W. Travis

    IPC分类号： B24B500

    CPC分类号： B24B37/32 ,  B24B49/16

    摘要： A wafer carrier head assembly for holding a wafer in chemical mechanical planarization applications is dis;losed that includes a downwardly protruding wafer retaining ring that moves independent of the wafer carrier head and retains an edge of the wafer on said polishing surface. An adjustable wafer holding mechanism that applies one of a uniform downward force and a uniform upward force to the wafer is also included. Application of the upward force allows the wafer holding mechanism to retain and transport the wafer to a polishing surface. Application of the downward force allows the wafer holding mechanism to retain the wafer on the polishing surface and allows the wafer to be uniformly polished. The wafer carrier head assembly herein disclosed is also configured to pivotally accommodate changes in parallelism between the wafer and the polishing surface when the wafer is being polished.

    摘要翻译： 用于在化学机械平面化应用中保持晶片的晶片载体头组件被丢弃，其包括向下突出的晶片保持环，所述晶片保持环独立于晶片载体头并且将晶片的边缘保持在所述抛光表面上。 还包括可调整的晶片保持机构，其将均匀的向下的力和均匀向上的力施加到晶片。 施加向上的力允许晶片保持机构保持并将晶片传送到抛光表面。 施加向下的力允许晶片保持机构将晶片保持在抛光表面上，并允许晶片被均匀抛光。 本文公开的晶片承载头组件还构造成当晶片被抛光时可枢转地适应晶片和抛光表面之间的平行度变化。

    System for wafer carrier in-process clean and rinse
    8.
    发明授权
    System for wafer carrier in-process clean and rinse 失效
    晶圆载体在线清洁和冲洗系统

    公开(公告)号：US06659116B1

    公开(公告)日：2003-12-09

    申请号：US10319758

    申请日：2002-12-13

    申请人： Damon Vincent Williams ,  Glenn W. Travis

    发明人： Damon Vincent Williams ,  Glenn W. Travis

    IPC分类号： B08B302

    CPC分类号： H01L21/67051 ,  B08B3/02 ,  B24B37/04 ,  B24B55/00 ,  Y10S134/902

    摘要： A system for rinsing and cleaning a wafer carrier and a semiconductor wafer mounted thereon during a polishing process is provided. The system comprises a head spray assembly that includes a spray nozzle and a spray cavity. At least a part of the head spray assembly is moveably positionable between a park position and a spray position. The spray position is proximate to the wafer carrier such that liquid discharged from the spray nozzle is in liquid communication with the wafer carrier and the semiconductor wafer. The liquid as well as the materials rinsed from the wafer carrier and semiconductor wafer may be retained in the spray cavity and channeled out of the head spray assembly.

    摘要翻译： 提供了一种用于在抛光过程中漂洗和清洁晶片载体和安装在其上的半导体晶片的系统。 该系统包括头喷射组件，其包括喷嘴和喷雾腔。 喷头组件的至少一部分可移动地定位在停放位置和喷射位置之间。 喷射位置靠近晶片载体，使得从喷嘴排出的液体与晶片载体和半导体晶片液体连通。 从晶片载体和半导体晶片漂洗的液体以及材料可以保留在喷雾腔中并引导出喷头组件。

    Locking mechanism for detachably securing a wafer carrier to a conveyor
    9.
    发明授权
    Locking mechanism for detachably securing a wafer carrier to a conveyor 有权
    用于将晶片载体可拆卸地固定到输送机的锁定机构

    公开(公告)号：US06486550B1

    公开(公告)日：2002-11-26

    申请号：US09606071

    申请日：2000-06-29

    申请人： Glenn W. Travis

    发明人： Glenn W. Travis

    IPC分类号： H01L2334

    CPC分类号： H01L21/68721 ,  H01L21/68735

    摘要： A system and method for detachably securing a locking mechanism to a housing is provided. The locking mechanism comprises a cam ring, a retention ring and a plurality of locking elements. The cam ring and the retention ring are slidably coupled and concentric with respect to each other. The locking elements are movably disposed within the cam ring and the retention ring. When a rotational force is applied to the locking mechanism, the locking elements move between a first position and a second position. The housing is positioned adjacent the locking elements and concentric with the locking mechanism. In the second position, the locking elements engage an engagement mechanism on the housing.

    摘要翻译： 提供了一种用于将锁定机构可拆卸地固定到壳体的系统和方法。 锁定机构包括凸轮环，保持环和多个锁定元件。 凸轮环和保持环相对于彼此可滑动地联接和同心。 锁定元件可移动地设置在凸轮环和保持环内。 当向锁定机构施加旋转力时，锁定元件在第一位置和第二位置之间移动。 壳体邻近锁定元件定位并与锁定机构同心。 在第二位置，锁定元件与壳体上的接合机构接合。