摘要:
Memory reconfiguration during system run-time is described. In one example, a system includes a memory slot to carry a memory board and to connect the memory board to a memory controller for read and write operations, a logic device having a plurality of status registers to record the status of the memory slot and a plurality of control registers to control the operation of the memory slot, and a bus interface coupled through direct signal lines to the memory slot to communicate status and control signals with the memory slot and coupled through a serial bus to the logic device to communicate status and control signals with the logic device.
摘要:
Memory reconfiguration during system run-time is described. In one example, a system includes a memory slot to carry a memory board and to connect the memory board to a memory controller for read and write operations, a logic device having a plurality of status registers to record the status of the memory slot and a plurality of control registers to control the operation of the memory slot, and a bus interface coupled through direct signal lines to the memory slot to communicate status and control signals with the memory slot and coupled through a serial bus to the logic device to communicate status and control signals with the logic device.
摘要:
In some embodiments, an circuit card includes an electronic circuit substrate, a ground plane on the electronic circuit substrate, first and second differential signal pads on the electronic circuit substrate, a ground return signal pad associated with the first and second differential signal pads, the ground return signal pad being connected to the ground plane on the electronic substrate, and a cutout structure on the ground plane positioned near a location where the ground return signal pad connects to the ground plane, wherein the cutout structure is configured to direct a ground return path associated with the first and second differential signal pads to the ground return signal pad associated with the first and second differential signal pads. Other embodiments are disclosed and claimed.