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    Integrated circuit coolant microchannel assembly with targeted channel configuration
    1.
    发明申请
    Integrated circuit coolant microchannel assembly with targeted channel configuration 有权
    具有目标通道配置的集成电路冷却液微通道组件

    公开(公告)号：US20060226539A1

    公开(公告)日：2006-10-12

    申请号：US11101061

    申请日：2005-04-07

    申请人： Je-Young Chang ,  Ioan Sauciuc ,  Chuan Hu ,  Chia-Pin Chiu ,  Gregory Chrysler ,  Ravi Prasher

    发明人： Je-Young Chang ,  Ioan Sauciuc ,  Chuan Hu ,  Chia-Pin Chiu ,  Gregory Chrysler ,  Ravi Prasher

    IPC分类号： H01L23/34

    CPC分类号： H01L23/473 ,  F28F3/12 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A microchannel structure has microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. At least one of the microchannels has a length extent and has a first section at a first location along the length extent and a second section at a second location along the length extent. The first section of the microchannel has a first aspect ratio and the second section is divided into at least two sub-channels. Each sub-channel has a respective second aspect ratio that is greater than the first aspect ratio.

    摘要翻译： 微通道结构中形成有微通道。 微通道将输送冷却剂并靠近集成电路以将热量从集成电路传递到冷却剂。 微通道中的至少一个具有长度范围，并且具有沿着长度范围的第一位置处的第一部分和沿着长度范围的第二位置处的第二部分。 微通道的第一部分具有第一宽高比，第二部分被划分为至少两个子通道。 每个子通道具有大于第一宽高比的相应的第二宽高比。

    Localized microelectronic cooling apparatuses and associated methods and systems
    5.
    发明申请
    Localized microelectronic cooling apparatuses and associated methods and systems 有权
    本地化微电子冷却装置及相关方法和系统

    公开(公告)号：US20070144182A1

    公开(公告)日：2007-06-28

    申请号：US11319297

    申请日：2005-12-27

    申请人： Ioan Sauciuc ,  Gregory Chrysler

    发明人： Ioan Sauciuc ,  Gregory Chrysler

    IPC分类号： F25B21/02 ,  F25D23/12

    CPC分类号： F25B21/02 ,  F25D19/006 ,  H01L23/3677 ,  H01L23/38 ,  H01L2224/16 ,  H01L2924/12044

    摘要： Apparatuses and associated methods and systems to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a microelectronic cooling apparatus comprising a microelectronic device thermally coupled to one or more thermally conductive pin(s) provides cooling to one or more hot spot(s) of the microelectronic device.

    摘要翻译： 通常描述用于向微电子器件提供局部冷却的装置和相关方法和系统。 在这方面，根据一个示例性实施例，包括热耦合到一个或多个导热引脚的微电子器件的微电子冷却装置向微电子器件的一个或多个热点提供冷却。

    Application and removal of thermal interface material
    6.
    发明申请
    Application and removal of thermal interface material 有权
    热界面材料的应用和去除

    公开(公告)号：US20070068173A1

    公开(公告)日：2007-03-29

    申请号：US11599671

    申请日：2006-11-14

    申请人： Ioan Sauciuc ,  Gregory Chrysler

    发明人： Ioan Sauciuc ,  Gregory Chrysler

    IPC分类号： F25B21/02

    CPC分类号： F28D15/02 ,  H01L23/38 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/16195 ,  H01L2924/00

    摘要： A method, system and apparatus are described. The apparatus includes a first device to adjust a polarity associated with a thermoelectric (TEC) module. The adjustment is to control the flow of heat. The flow of heat is directed toward a thermal interface material (TIM) in order to melt the TIM up to an acceptable melt level. The apparatus further includes a second device to determine whether the TIM has melted up to the acceptable melt level. The apparatus includes an application device to apply the TIM to a heat sink if the TIM is melted has melted up to the acceptable melt level.

    摘要翻译： 描述了一种方法，系统和装置。 该装置包括用于调节与热电（TEC）模块相关联的极性的第一装置。 调整是为了控制热量的流动。 热流导向热界面材料（TIM），以便将TIM熔化到可接受的熔体水平。 该装置还包括第二装置，用于确定TIM已经熔化到可接受的熔融水平。 该装置包括一个施加装置，用于将TIM施加到散热器上，如果TIM熔化已熔化到可接受的熔融水平。

    Computer system having controlled cooling
    7.
    发明申请
    Computer system having controlled cooling 有权
    具有控制冷却的计算机系统

    公开(公告)号：US20050078451A1

    公开(公告)日：2005-04-14

    申请号：US10683924

    申请日：2003-10-10

    申请人： Ioan Sauciuc ,  Gregory Chrysler ,  Ravi Mahajan

    发明人： Ioan Sauciuc ,  Gregory Chrysler ,  Ravi Mahajan

    IPC分类号： G06F1/20 ,  H03K17/955 ,  H05K7/20

    CPC分类号： G06F1/20 ,  G06F1/206 ,  G06F2200/201

    摘要： A computer system and its method of cooling are provided. A vapor chamber serves as a heat spreader for heat from the microelectronic die. A thermoelectric module serves to cool the vapor chamber and maintain proper functioning of the vapor chamber, thus keeping the microelectronic die cooled. A controller receives input from five temperature sensors, and utilizes the input to control current to the thermoelectric module and voltage/current to a motor that drives a fan and provides additional cooling. A current sensor allows the controller to monitor and limit power provided to the thermoelectric module.

    摘要翻译： 提供了一种计算机系统及其冷却方法。 蒸气室用作来自微电子管芯的热量的散热器。 热电模块用于冷却蒸气室并保持蒸气室的适当功能，从而保持微电子模具的冷却。 控制器从五个温度传感器接收输入，并利用输入来控制热电模块的电流和驱动风扇的电机的电压/电流，并提供额外的冷却。 电流传感器允许控制器监测和限制提供给热电模块的功率。

    Heatsink device and method
    8.
    发明申请
    Heatsink device and method 失效
    散热装置及方法

    公开(公告)号：US20050068737A1

    公开(公告)日：2005-03-31

    申请号：US10676230

    申请日：2003-09-30

    申请人： Javier Leija ,  Ioan Sauciuc ,  Gregory Chrysler

    发明人： Javier Leija ,  Ioan Sauciuc ,  Gregory Chrysler

    IPC分类号： H01L23/427 ,  H01L23/467 ,  H05K7/20

    CPC分类号： H01L23/467 ,  H01L23/427 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16152

    摘要： A method and device for thermal conduction is provided. Devices and methods are shown that include the ability to dissipate increased amounts of heat due to the use of an active heat transfer device. Devices and methods are shown that share the necessary heat transfer between a passive heat transfer device and an active heat transfer device, thus increasing the amount of heat dissipated while maintaining reliability of the individual components. Devices and methods are shown that include an increased length of the heatsink which can keep large temperature differences between heat transfer structures and the heat transfer fluid such as air.

    摘要翻译： 提供了一种用于导热的方法和装置。 显示的装置和方法包括由于使用活性热传递装置而耗散增加的热量的能力。 示出了在被动热传递装置和主动传热装置之间共享必要的热传递的装置和方法，因此在保持各个部件的可靠性的同时增加散热量。 示出了包括增加长度的散热器的装置和方法，其可以在传热结构和诸如空气的传热流体之间保持较大的温差。

    Thermoelectric module
    9.
    发明申请
    Thermoelectric module 审中-公开
    热电模块

    公开(公告)号：US20060000500A1

    公开(公告)日：2006-01-05

    申请号：US10882548

    申请日：2004-06-30

    申请人： Ioan Sauciuc ,  Gregory Chrysler

    发明人： Ioan Sauciuc ,  Gregory Chrysler

    IPC分类号： H01L35/00 ,  H01L37/00 ,  H01L35/34 ,  H01L35/28 ,  H01L21/44

    CPC分类号： H01L23/38 ,  H01L35/32 ,  H01L2924/0002 ,  H01L2924/00

    摘要： According to an embodiment of the invention, a thermoelectric module (TEM) is formed between a first and a second thermally conductive device. A first dielectric layer is deposited over the first thermally conductive device, and interconnects are formed over the dielectric layer. Solder patches are then printed over the interconnects. A second dielectric layer is deposited over the second thermally conductive device. Interconnects and solder patches are deposited over the second dielectric layer. Alternating p- and n-type semiconductor elements are then placed over the patches over the first dielectric layer. The second thermally conductive device is then placed over the first device, and the solder is reflowed.

    摘要翻译： 根据本发明的实施例，在第一和第二导热装置之间形成热电模块（TEM）。 在第一导热装置上沉积第一介电层，并且在电介质层上形成互连。 然后在互连上印刷焊接贴片。 在第二导热装置上沉积第二电介质层。 互连件和焊料层沉积在第二介电层上。 然后将交替的p型和n型半导体元件放置在第一介电层上的贴片上。 然后将第二导热装置放置在第一装置上，并且焊料被回流。

    Method and apparatus for two-phase start-up operation
    10.
    发明申请
    Method and apparatus for two-phase start-up operation 有权
    用于两相启动操作的方法和装置

    公开(公告)号：US20050147500A1

    公开(公告)日：2005-07-07

    申请号：US10749359

    申请日：2003-12-30

    申请人： Ioan Sauciuc ,  Gregory Chrysler

    发明人： Ioan Sauciuc ,  Gregory Chrysler

    IPC分类号： F25B49/02 ,  G01N27/00 ,  H01L23/427 ,  H01L35/00 ,  H05K7/20 ,  F04B19/24 ,  F04B49/00

    CPC分类号： F25B49/02 ,  F25B2500/26 ,  F25B2500/28 ,  H01L23/427 ,  H01L35/00 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method and apparatus for removing vapor inside a liquid pump at the start up operation of the pump. In addition, a method and apparatus for removing liquid inside a compressor at the start up operation of the compressor. The pump and compressor each include a sensor attached to them that determines the physical state (i.e., liquid or vapor) of a material inside the pump or compressor. If vapor is detected inside the pump, a thermoelectric module connected to the pump is powered to condense the vapor into a liquid. Likewise, if liquid is detected inside the compressor a heater connected to the compressor is powered to evaporate the liquid into a vapor. After the state of the material inside the pump or compressor is changed, the pump or compressor is powered up for operation in a cooling system.

    摘要翻译： 一种用于在泵的启动操作时除去液体泵内的蒸气的方法和装置。 另外，在压缩机的启动运转时，除去压缩机内的液体的方法和装置。 泵和压缩机各自包括附接到它们的传感器，其确定泵或压缩机内部的材料的物理状态（即，液体或蒸气）。 如果在泵内检测到蒸汽，则连接到泵的热电模块被供电以将蒸汽冷凝成液体。 同样，如果在压缩机内检测到液体，则连接到压缩机的加热器被供电以将液体蒸发成蒸气。 在泵或压缩机内的材料状态发生变化之后，泵或压缩机上电以在冷却系统中运行。