公开(公告)号：US09255702B2

公开(公告)日：2016-02-09

申请号：US13700047

申请日：2011-06-24

申请人： Frank Singer ,  Thomas Haug ,  Alexander Sauerer ,  Hagen Luckner ,  Stefan Groetsch

发明人： Frank Singer ,  Thomas Haug ,  Alexander Sauerer ,  Hagen Luckner ,  Stefan Groetsch

IPC分类号： F21S4/00 ,  F21V29/00 ,  H05K1/02 ,  H05K3/00 ,  B60Q1/04 ,  F21V19/00 ,  F21S8/10 ,  H01L33/64 ,  H05K1/03 ,  H05K1/14

CPC分类号： F21V29/502 ,  B60Q1/04 ,  F21S41/141 ,  F21S41/19 ,  F21V19/004 ,  H01L33/641 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/142 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10393 ,  H05K2201/10409 ,  H01L2924/00014

摘要： A light emitting diode (LED) lightning module is disclosed. The LED lighting module includes a heat sink, a circuit board, a carrier, semiconductor chips such as LEDs arranged on an upper surface of the carrier, and at least one holding device pressing a lower surface of the substrate against an upper surface of the heat sink. The semiconductor chips are electrically connected to the carrier. The carrier is electrically connected to the circuit board.

摘要翻译： 公开了一种发光二极管（LED）闪电模块。 LED照明模块包括散热器，电路板，载体，布置在载体的上表面上的诸如LED的半导体芯片，以及至少一个将基板的下表面压在热的上表面上的保持装置 水槽。 半导体芯片电连接到载体。 载体电连接到电路板。

公开(公告)号：US20110215369A1

公开(公告)日：2011-09-08

申请号：US13124145

申请日：2009-10-16

申请人： Peter Brick ,  Matthias Sabathil ,  Hagen Luckner

发明人： Peter Brick ,  Matthias Sabathil ,  Hagen Luckner

IPC分类号： H01L33/62

CPC分类号： H01L33/387 ,  F21S41/155 ,  H01L33/20 ,  H01L33/22 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

摘要： A luminescence diode chip includes a semiconductor layer sequence having an active layer suitable for generating electromagnetic radiation, and a first electrical connection layer, which touches and makes electrically conductive contact with the semiconductor layer sequence. The first electrical connection layer touches and makes contact with the semiconductor layer sequence in particular with a plurality of contact areas. In the case of the luminescence diode chip, an inhomogeneous current density distribution or current distribution is set in a targeted manner in the semiconductor layer sequence by means of an inhomogeneous distribution of an area density of the contact areas along a main plane of extent of the semiconductor layer sequence.

摘要翻译： 发光二极管芯片包括具有适于产生电磁辐射的有源层的半导体层序列以及接触并与半导体层序列导电接触的第一电连接层。 第一电连接层特别地与多个接触区域接触并与半导体层序列接触。 在发光二极管芯片的情况下，通过沿着主要平面的接触区域的面积密度的不均匀分布，在半导体层序列中以目标方式设定不均匀的电流密度分布或电流分布 半导体层序列。

公开(公告)号：US08436394B2

公开(公告)日：2013-05-07

申请号：US13124145

申请日：2009-10-16

申请人： Peter Brick ,  Matthias Sabathil ,  Hagen Luckner

发明人： Peter Brick ,  Matthias Sabathil ,  Hagen Luckner

IPC分类号： H01L33/62

CPC分类号： H01L33/387 ,  F21S41/155 ,  H01L33/20 ,  H01L33/22 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

摘要： A luminescence diode chip includes a semiconductor layer sequence having an active layer suitable for generating electromagnetic radiation, and a first electrical connection layer, which touches and makes electrically conductive contact with the semiconductor layer sequence. The first electrical connection layer touches and makes contact with the semiconductor layer sequence in particular with a plurality of contact areas. In the case of the luminescence diode chip, an inhomogeneous current density distribution or current distribution is set in a targeted manner in the semiconductor layer sequence by means of an inhomogeneous distribution of an area density of the contact areas along a main plane of extent of the semiconductor layer sequence.

摘要翻译： 发光二极管芯片包括具有适于产生电磁辐射的有源层的半导体层序列以及接触并与半导体层序列导电接触的第一电连接层。 第一电连接层特别地与多个接触区域接触并与半导体层序列接触。 在发光二极管芯片的情况下，通过沿着主要平面的接触区域的面积密度的不均匀分布，在半导体层序列中以目标方式设定不均匀的电流密度分布或电流分布 半导体层序列。

公开(公告)号：US20130135883A1

公开(公告)日：2013-05-30

申请号：US13700047

申请日：2011-06-24

申请人： Frank Singer ,  Thomas Haug ,  Alexander Sauerer ,  Hagen Luckner ,  Stefan Groetsch

发明人： Frank Singer ,  Thomas Haug ,  Alexander Sauerer ,  Hagen Luckner ,  Stefan Groetsch

IPC分类号： F21V29/00 ,  B60Q1/04

CPC分类号： F21V29/502 ,  B60Q1/04 ,  F21S41/141 ,  F21S41/19 ,  F21V19/004 ,  H01L33/641 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/142 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/10393 ,  H05K2201/10409 ,  H01L2924/00014

摘要： In at least one embodiment of the optoelectronic lighting module the lighting module has a cooling body, a printed circuit board, and a substrate. One or more optoelectronic semiconductor chips is/are arranged on a substrate upper face. The semiconductor chips are electrically connected to the substrate. At least one retaining device lies directly or indirectly on the substrate upper face and presses a substrate lower face against a cooling body upper face. The substrate is electrically connected to the printed circuit board. The retaining device is electrically insulated from the at least one semiconductor chip.

摘要翻译： 在光电照明模块的至少一个实施例中，照明模块具有冷却体，印刷电路板和衬底。 一个或多个光电子半导体芯片被布置在基板上表面上。 半导体芯片电连接到基板。 至少一个保持装置直接或间接地位于基板上表面上，并将基板下表面压靠在冷却体上表面上。 基板电连接到印刷电路板。 保持装置与至少一个半导体芯片电绝缘。