公开(公告)号：US09046258B2

公开(公告)日：2015-06-02

申请号：US13695966

申请日：2011-06-24

申请人： Frank Singer ,  Thomas Haug ,  Alexander Sauerer

发明人： Frank Singer ,  Thomas Haug ,  Alexander Sauerer

IPC分类号： F21V29/00 ,  F21K99/00 ,  H05K1/02 ,  B60Q1/04 ,  F21S8/10 ,  F21Y101/02 ,  H01L33/64

CPC分类号： H01L33/64 ,  B60Q1/04 ,  F21K9/00 ,  F21S41/141 ,  F21S41/19 ,  F21V29/70 ,  F21Y2115/10 ,  H01L33/641 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/021 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/10106 ,  H01L2924/00

摘要： In at least one embodiment, an optoelectronic lighting module includes a circuit board, which an opening passes right through. The circuit board includes fastening devices for mechanically fastening the lighting module to an external heat sink. A carrier of the lighting module is mounted in the opening. At least one optoelectronic semiconductor chip is located on a carrier top and is connected electrically to the circuit board via the carrier. The circuit board is moreover connected firmly mechanically with the carrier. The circuit board is additionally designed to exert a mechanical force on the carrier and to press the carrier against the external heat sink. The carrier is designed to rest with a carrier bottom flat against the external heat sink.

摘要翻译： 在至少一个实施例中，光电子照明模块包括电路板，开口正好通过。 电路板包括用于将照明模块机械地紧固到外部散热器的紧固装置。 照明模块的载体安装在开口中。 至少一个光电半导体芯片位于载体顶部上，并通过载体与电路板电连接。 此外，电路板与载体牢固地机械连接。 电路板另外设计成在载体上施加机械力并将载体压靠在外部散热器上。 载体被设计成搁置在载体底部平坦抵靠外部散热器的位置。

公开(公告)号：US08646990B2

公开(公告)日：2014-02-11

申请号：US12922492

申请日：2009-04-17

申请人： Frank Singer ,  Stefan Groetsch

发明人： Frank Singer ,  Stefan Groetsch

IPC分类号： G02B6/36

CPC分类号： F21V17/10 ,  F21K9/00 ,  F21S41/141 ,  F21S41/25 ,  F21V5/04 ,  F21V17/06 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optoelectronic module comprising: at least one light-emitting diode chip arranged on a carrier, and a mounting attachment fastened to the carrier and at least partly covering the light-emitting diode chip, and having a structured top which allows positioning of an optical element.

摘要翻译： 一种光电模块，包括：布置在载体上的至少一个发光二极管芯片和紧固到所述载体的至少部分覆盖所述发光二极管芯片的安装附件，并且具有结构化顶部，其允许光学元件 。

公开(公告)号：US08643034B2

公开(公告)日：2014-02-04

申请号：US12920317

申请日：2009-02-25

申请人： Karl Engl ,  Frank Singer ,  Patrick Rode ,  Lutz Hoeppel ,  Martin Strassburg

发明人： Karl Engl ,  Frank Singer ,  Patrick Rode ,  Lutz Hoeppel ,  Martin Strassburg

IPC分类号： H01L29/207

CPC分类号： H01L27/156 ,  H01L33/08 ,  H01L33/382 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optoelectronic semiconductor body comprises a semiconductor layer sequence which is subdivided into at least two electrically isolated subsegments. The semiconductor layer sequence has an active layer in each subarea. Furthermore, at least three electrical contact pads are provided. A first line level makes contact with a first of the at least two subsegments and with the first contact pad. A second line level makes contact with the second of the at least two subsegments and with a second contact pad. A third line level connects the two subsegments to one another and makes contact with the third contact pad. Furthermore, the line levels are each arranged opposite a first main face, wherein the first main face is intended to emit electromagnetic radiation that is produced.

摘要翻译： 光电半导体主体包括半导体层序列，其被细分为至少两个电隔离的子区段。 半导体层序列在每个子区域中具有活性层。 此外，提供至少三个电接触垫。 第一线路级别与至少两个子片段中的第一个以及与第一接触焊盘接触。 第二线路级别与至少两个子段中的第二线路接触并且与第二接触焊盘接触。 第三线路电平将两个子段彼此连接并与第三接触焊盘接触。 此外，线路电平各自布置成与第一主面对置，其中第一主面面用于发射产生的电磁辐射。

公开(公告)号：US08396092B2

公开(公告)日：2013-03-12

申请号：US12087331

申请日：2006-12-29

申请人： Ulrich Steegmüller ,  Frank Singer ,  Thomas Schwarz ,  Michael Kühnelt

发明人： Ulrich Steegmüller ,  Frank Singer ,  Thomas Schwarz ,  Michael Kühnelt

IPC分类号： H01S3/091

CPC分类号： H01S5/0612 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01S3/0815 ,  H01S3/109 ,  H01S5/005 ,  H01S5/0071 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/024 ,  H01S5/02407 ,  H01S5/041 ,  H01S5/14 ,  H01S5/183 ,  H01S5/4056 ,  H01L2924/00

摘要： An optically pumped semiconductor apparatus having a surface-emitting semiconductor body (1) which has a radiation passage area (1a) which faces away from a mounting plane of the semiconductor body (1), and an optical element (7) which is suitable for directing pump radiation (17) onto the radiation passage area (1a) of the semiconductor body (1).

摘要翻译： 一种具有表面发射半导体本体（1）的光学泵浦半导体装置，其具有背离半导体本体（1）的安装面的辐射通路面积（1a），以及适于 将泵辐射（17）引导到半导体本体（1）的辐射通道区域（1a）上。

公开(公告)号：US20110186867A1

公开(公告)日：2011-08-04

申请号：US12745249

申请日：2008-11-18

申请人： Frank Singer ,  Thomas Zeiler ,  Joachim Reill

发明人： Frank Singer ,  Thomas Zeiler ,  Joachim Reill

IPC分类号： H01L27/15 ,  H01L33/50

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10155 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00012

摘要： An arrangement having at least two light-emitting semiconductor components (101, 111) arranged adjacent to one another has envelopes (102, 112) at least partly surrounding the at least two light-emitting semiconductor components in each case. The envelopes contain a converter substance, which partly or completely converts the wavelength range of the radiation emitted by the semiconductor components. At least one optical damping element (103) is arranged between the at least two light-emitting semiconductor components, which optically isolates the respective envelopes of the semiconductor components in order to reduce a coupling-in from at least one envelope (102) into at least one other of the envelopes (112), or from at least one semiconductor component (101) into the envelope (112) of at least one of the other semiconductor components (111).

摘要翻译： 具有彼此相邻布置的至少两个发光半导体部件（101,111）的布置具有在每种情况下至少部分地包围至少两个发光半导体部件的封套（102,112）。 信封包含转换器物质，其部分地或完全地转换由半导体元件发射的辐射的波长范围。 至少一个光学阻尼元件（103）被布置在所述至少两个发光半导体部件之间，所述至少两个发光半导体部件光学地隔离半导体部件的各个封套，以便减少从至少一个封套（102）到...的耦合 信封（112）中的至少一个，或者至少一个半导体部件（101）进入至少一个其它半导体部件（111）的外壳（112）中。

公开(公告)号：US20100230697A1

公开(公告)日：2010-09-16

申请号：US12673800

申请日：2008-08-11

申请人： Steffen Köhler ,  Moritz Engl ,  Frank Singer ,  Stefan Grötsch ,  Thomas Zeiler ,  Mathias Weiss

发明人： Steffen Köhler ,  Moritz Engl ,  Frank Singer ,  Stefan Grötsch ,  Thomas Zeiler ,  Mathias Weiss

IPC分类号： H01L33/48 ,  H01L33/60 ,  H01L21/50

CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/46 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2933/0058 ,  H01L2924/00

摘要： An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.

摘要翻译： 光电子半导体模块包括芯片载体，安装在芯片载体上的发光半导体芯片和具有至少部分透光的盖板的覆盖元件，该盖元件布置在半导体芯片背离芯片载体的一侧， 并且具有框架部分，其中横向包围半导体芯片的框架部分以接合层的方式接合到盖板并且在远离盖板的一侧与芯片载体相连接。

公开(公告)号：US07729046B2

公开(公告)日：2010-06-01

申请号：US12170238

申请日：2008-07-09

申请人： Michael Kühnelt ,  Thomas Schwarz ,  Ulrich Steegmüller ,  Frank Singer

发明人： Michael Kühnelt ,  Thomas Schwarz ,  Ulrich Steegmüller ,  Frank Singer

IPC分类号： H01S5/00

CPC分类号： H01S3/16 ,  H01S3/005 ,  H01S3/025 ,  H01S3/042 ,  H01S3/0602 ,  H01S3/0612 ,  H01S3/0627 ,  H01S3/09415 ,  H01S3/109 ,  H01S3/1611 ,  H01S3/1643 ,  H01S3/1673 ,  H01S3/2383

摘要： In a laser device, a crystal array includes a laser gain crystal and an optically non-linear frequency conversion crystal. A pump source couples at least two mutually spatially separated pump beams into the crystal array. Between two pump beams, a saw kerf of the crystal array extends parallel to the pump beams.

摘要翻译： 在激光装置中，晶体阵列包括激光增益晶体和光学非线性变换晶体。 泵浦源将至少两个相互空间分离的泵浦光束耦合到晶体阵列中。 在两个泵浦梁之间，晶体阵列的锯切平行于泵浦梁延伸。

公开(公告)号：US20100000104A1

公开(公告)日：2010-01-07

申请号：US12295794

申请日：2007-04-10

申请人： Frank Möllmer ,  Frank Singer ,  Michael Schumann ,  Martin Haushalter ,  Thomas Hoefer ,  Christine Rüth ,  Stefan Strüwing

发明人： Frank Möllmer ,  Frank Singer ,  Michael Schumann ,  Martin Haushalter ,  Thomas Hoefer ,  Christine Rüth ,  Stefan Strüwing

IPC分类号： G01C9/10

CPC分类号： G01C9/10 ,  G01C2009/066 ,  G01C2009/107

摘要： The invention is directed to a tilt sensor comprising at least one body movable along a predefined path and an optoelectronic unit for determining the position of said body, said tilt sensor being surface-mountable. The invention is further directed to a tilt sensor assembly.

摘要翻译： 本发明涉及一种倾斜传感器，其包括沿预定路径可移动的至少一个主体和用于确定所述主体的位置的光电单元，所述倾斜传感器可表面安装。 本发明还涉及一种倾斜传感器组件。

公开(公告)号：US20090246898A1

公开(公告)日：2009-10-01

申请号：US12087291

申请日：2006-12-29

申请人： Ulrich Steegmuller ,  Frank Singer ,  Thomas Schwarz ,  Roland Schulz

发明人： Ulrich Steegmuller ,  Frank Singer ,  Thomas Schwarz ,  Roland Schulz

IPC分类号： H01L21/50

CPC分类号： H01S5/14 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/181 ,  H01S3/109 ,  H01S5/005 ,  H01S5/0071 ,  H01S5/0206 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02407 ,  H01S5/02415 ,  H01S5/02438 ,  H01S5/041 ,  H01S5/0612 ,  H01S5/183 ,  H01S5/4025 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating an optically pumped semiconductor apparatus, having the following steps: provision of a connection carrier assembly (50) comprising a plurality of connection carriers (14) which are permanently connected to one another mechanically, arrangement of a surface-emitting semiconductor body (1) on a connection carrier (14) in the connection carrier assembly (50), and separation of the connection carrier assembly (50) into individual semiconductor apparatuses.

摘要翻译： 一种用于制造光泵浦半导体器件的方法，具有以下步骤：提供包括多个连接载体（14）的连接载体组件（50），所述多个连接载体（14）机械地彼此永久连接，所述表面发射半导体主体 （1）连接在连接托架组件（50）中的连接托架（14）上，并且将连接托架组件（50）分离成单独的半导体设备。

公开(公告)号：US20090225797A1

公开(公告)日：2009-09-10

申请号：US11659065

申请日：2005-06-24

申请人： Micheal Kuhnelt ,  Thomas Schwarz ,  Frank Singer ,  Ulrich Steegmüller

发明人： Micheal Kuhnelt ,  Thomas Schwarz ,  Frank Singer ,  Ulrich Steegmüller

IPC分类号： H01S3/10 ,  H01S3/08 ,  H01S3/091 ,  H01S3/04

CPC分类号： H01S5/14 ,  H01L2224/48091 ,  H01S3/0815 ,  H01S3/109 ,  H01S5/0222 ,  H01S5/02248 ,  H01S5/041 ,  H01S5/183 ,  H01L2924/00014

摘要： A semiconductor laser component comprising a semiconductor laser chip (1) provided for generating radiation and an optical device comprising a carrier (7), a radiation deflecting element (8) arranged on the carrier and a mirror arranged on the carrier is proposed, wherein the mirror is formed as an external mirror (9) of an external optical resonator for the semiconductor laser chip (1), the radiation deflecting element is arranged within the resonator, the radiation deflecting element is formed for deflecting at least a portion of a radiation (13, 160) that is generated by the semiconductor laser chip (1) and reflected by the external mirror, the carrier has a lateral main extension direction, and the semiconductor laser chip (1) is disposed downstream of the carrier in a vertical direction with respect to the lateral main extension direction.

摘要翻译： 提供了一种半导体激光器部件，其包括用于产生辐射的半导体激光器芯片（1）和包括载体（7），布置在载体上的辐射偏转元件（8）和布置在载体上的反射镜的光学装置， 反射镜被形成为用于半导体激光器芯片（1）的外部光学谐振器的外部反射镜（9），该辐射偏转元件被布置在谐振器内，该辐射偏转元件形成为用于偏转至少一部分辐射 由所述半导体激光器芯片（1）产生并由所述外部反射镜反射的所述载体具有侧向主延伸方向，并且所述半导体激光器芯片（1）沿垂直方向设置在所述载体的下游， 相对于侧向主延伸方向。