公开(公告)号：US07448923B2

公开(公告)日：2008-11-11

申请号：US11562905

申请日：2006-11-22

Applicant: Harshad K Uka

Inventor： Harshad K Uka

IPC: H01R4/02

CPC classification number: H05K3/363 ,  H01R4/024 ,  H01R12/62 ,  H01R43/0235 ,  H01R43/0249 ,  H01R43/0256 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10666 ,  H05K2201/2036 ,  H05K2203/063 ,  H05K2203/1178

Abstract: Conductive pads of a flex circuit may be electrically connected to conductive pads of a rigid circuit board. The conductive pads of the flex circuit may be sized, configured and alignable to the conductive pads of the rigid circuit board. A spacer with a plurality of apertures may be sized, configured and aligned to the conductive pads of the flex circuit and the rigid circuit board. Solder paste may be disposed between respective conductive pads of the flex circuit and the rigid circuit board within the apertures of the spacer. When the flex circuit, rigid circuit board and the spacer are assembled, the solder paste is displaced through relief vents formed through the conductive pads of the flex circuit, rigid circuit board or both the flex circuit or rigid circuit board. The solder paste is reflowed and forms a rivet structure attaching the flex circuit to the rigid circuit board as well as providing an electrical connection between the conductive pads of the flex circuit and the rigid circuit board.

Abstract translation: 柔性电路的导电焊盘可以电连接到刚性电路板的导电焊盘。 柔性电路的导电焊盘的尺寸，构造和对准刚性电路板的导电焊盘。 具有多个孔的间隔物的尺寸，配置和对准到柔性电路和刚性电路板的导电垫。 焊膏可以设置在柔性电路的相应导电焊盘和间隔件的孔内的刚性电路板之间。 当柔性电路，刚性电路板和间隔件组装时，焊膏通过柔性电路，刚性电路板或柔性电路或刚性电路板的导电焊盘形成的通孔形成位移。 焊膏被回流并且形成将柔性电路连接到刚性电路板的铆钉结构，以及在柔性电路的导电焊盘和刚性电路板之间提供电连接。

公开(公告)号：US20080139011A1

公开(公告)日：2008-06-12

申请号：US11562905

申请日：2006-11-22

Applicant: Harshad K. Uka

Inventor： Harshad K. Uka

IPC: H01R12/00

CPC classification number: H05K3/363 ,  H01R4/024 ,  H01R12/62 ,  H01R43/0235 ,  H01R43/0249 ,  H01R43/0256 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10666 ,  H05K2201/2036 ,  H05K2203/063 ,  H05K2203/1178

Abstract: Conductive pads of a flex circuit may be electrically connected to conductive pads of a rigid circuit board. The conductive pads of the flex circuit may be sized, configured and alignable to the conductive pads of the rigid circuit board. A spacer with a plurality of apertures may be sized, configured and aligned to the conductive pads of the flex circuit and the rigid circuit board. Solder paste may be disposed between respective conductive pads of the flex circuit and the rigid circuit board within the apertures of the spacer. When the flex circuit, rigid circuit board and the spacer are assembled, the solder paste is displaced through relief vents formed through the conductive pads of the flex circuit, rigid circuit board or both the flex circuit or rigid circuit board. The solder paste is reflowed and forms a rivet structure attaching the flex circuit to the rigid circuit board as well as providing an electrical connection between the conductive pads of the flex circuit and the rigid circuit board.

Abstract translation: 柔性电路的导电焊盘可以电连接到刚性电路板的导电焊盘。 柔性电路的导电焊盘的尺寸，构造和对准刚性电路板的导电焊盘。 具有多个孔的间隔物的尺寸，配置和对准到柔性电路和刚性电路板的导电垫。 焊膏可以设置在柔性电路的相应导电焊盘和间隔件的孔内的刚性电路板之间。 当柔性电路，刚性电路板和间隔件组装时，焊膏通过柔性电路，刚性电路板或柔性电路或刚性电路板的导电焊盘形成的通孔形成位移。 焊膏被回流并且形成将柔性电路连接到刚性电路板的铆钉结构，以及在柔性电路的导电焊盘和刚性电路板之间提供电连接。

公开(公告)号：US20080254653A1

公开(公告)日：2008-10-16

申请号：US12143949

申请日：2008-06-23

Applicant: Harshad K. Uka

Inventor： Harshad K. Uka

IPC: H01R12/00

CPC classification number: H05K3/363 ,  H01R4/024 ,  H01R12/62 ,  H01R43/0235 ,  H01R43/0249 ,  H01R43/0256 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10666 ,  H05K2201/2036 ,  H05K2203/063 ,  H05K2203/1178

Abstract: Conductive pads of a flex circuit may be electrically connected to conductive pads of a rigid circuit board. The conductive pads of the flex circuit may be sized, configured and alignable to the conductive pads of the rigid circuit board. A spacer with a plurality of apertures may be sized, configured and aligned to the conductive pads of the flex circuit and the rigid circuit board. Solder paste may be disposed between respective conductive pads of the flex circuit and the rigid circuit board within the apertures of the spacer. When the flex circuit, rigid circuit board and the spacer are assembled, the solder paste is displaced through relief vents formed through the conductive pads of the flex circuit, rigid circuit board or both the flex circuit or rigid circuit board. The solder paste is reflowed and forms a rivet structure attaching the flex circuit to the rigid circuit board as well as providing an electrical connection between the conductive pads of the flex circuit and the rigid circuit board.

Abstract translation: 柔性电路的导电焊盘可以电连接到刚性电路板的导电焊盘。 柔性电路的导电焊盘的尺寸，构造和对准刚性电路板的导电焊盘。 具有多个孔的间隔物的尺寸，配置和对准到柔性电路和刚性电路板的导电垫。 焊膏可以设置在柔性电路的相应导电焊盘和间隔件的孔内的刚性电路板之间。 当柔性电路，刚性电路板和间隔件组装时，焊膏通过柔性电路，刚性电路板或柔性电路或刚性电路板的导电焊盘形成的通孔形成位移。 焊膏被回流并且形成将柔性电路连接到刚性电路板的铆钉结构，以及在柔性电路的导电焊盘和刚性电路板之间提供电连接。