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6 条记录 (耗时 0.018 秒)

    Apparatus for Locking a Magazine
    2.
    发明申请
    Apparatus for Locking a Magazine 有权
    锁定杂志的装置

    公开(公告)号：US20110042242A1

    公开(公告)日：2011-02-24

    申请号：US12825160

    申请日：2010-06-28

    申请人： Chang-Hwan Ji ,  Jong-Hoon Kim ,  Hee-Sang Yang ,  Jae-Nam Lee ,  Jong-Chul Kim

    发明人： Chang-Hwan Ji ,  Jong-Hoon Kim ,  Hee-Sang Yang ,  Jae-Nam Lee ,  Jong-Chul Kim

    IPC分类号： B65D55/02

    CPC分类号： H01L21/6734

    摘要： A locking apparatus for locking a magazine configured to receive a printed circuit board (PCB) may include an actuator, a rotating block, and a locking member. The actuator may be installed on the magazine. The rotating block may be connected to the actuator. The rotating block may be rotated about a vertical axis. The locking member may be rotatably connected to the magazine about the vertical axis. The locking member may be selectively combined with the rotating block to block a front face of the magazine, thereby preventing breakaway of the PCB from the magazine.

    摘要翻译： 用于锁定构造成接收印刷电路板（PCB）的盒的锁定装置可以包括致动器，旋转块和锁定构件。 执行器可以安装在刀库上。 旋转块可以连接到致动器。 旋转块可绕垂直轴旋转。 锁定构件可以围绕垂直轴线可旋转地连接到盒。 可以将锁定构件选择性地与旋转块组合以阻挡盒的前面，从而防止PCB从盒中脱离。

    Solder ball attaching system and method
    4.
    发明授权
    Solder ball attaching system and method 失效
    焊球附着系统及方法

    公开(公告)号：US06974069B2

    公开(公告)日：2005-12-13

    申请号：US10465632

    申请日：2003-06-20

    申请人： Ju-il Kang ,  Hee-Sang Yang

    发明人： Ju-il Kang ,  Hee-Sang Yang

    IPC分类号： H05K3/34 ,  B23K1/00 ,  B23K1/20 ,  B23K3/06 ,  B23K3/08 ,  H01L21/48 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498

    CPC分类号： B23K3/0623 ,  B23K1/0016 ,  B23K1/203 ,  B23K1/206 ,  B23K3/08 ,  B23K3/082 ,  B23K2101/42 ,  H01L23/49816 ,  H01L24/11 ,  H01L2924/181 ,  H05K3/3478 ,  H01L2924/00

    摘要： The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

    摘要翻译： 本公开是执行与球栅阵列封装制造工艺的最终相对应的焊球附着工艺的复数工艺。 例如，焊剂和焊球精确地附着在其上粘附有多个焊盘图案组的基带的基架的焊球焊盘上。 在上述状态下，将基架插入到相邻的回流装置中，以使焊球附着在焊球上。 在去除焊锡球附着的焊球垫的焊剂之后，将基架储存在容器中。 为了在非常小的空间中执行基本帧存储处理，基本帧的传送过程是循环的形式。

    Solder ball attaching system and method
    5.
    发明授权
    Solder ball attaching system and method 失效
    焊球附着系统及方法

    公开(公告)号：US06607117B1

    公开(公告)日：2003-08-19

    申请号：US09690683

    申请日：2000-10-16

    申请人： Ju-Il Kang ,  Hee-Sang Yang

    发明人： Ju-Il Kang ,  Hee-Sang Yang

    IPC分类号： B23K100

    CPC分类号： B23K3/0623 ,  B23K1/0016 ,  B23K1/203 ,  B23K1/206 ,  B23K3/08 ,  B23K3/082 ,  B23K2101/42 ,  H01L23/49816 ,  H01L24/11 ,  H01L2924/181 ,  H05K3/3478 ,  H01L2924/00

    摘要： The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

    摘要翻译： 本公开是执行与球栅阵列封装制造工艺的最终相对应的焊球附着工艺的复数工艺。 例如，焊剂和焊球精确地附着在其上粘附有多个焊盘图案组的基带的基架的焊球焊盘上。 在上述状态下，将基架插入到相邻的回流装置中，以使焊球附着在焊球上。 在去除焊锡球附着的焊球垫的焊剂之后，将基架储存在容器中。 为了在非常小的空间中执行基本帧存储处理，基本帧的传送过程是循环的形式。

    Apparatus for locking a magazine
    6.
    发明授权
    Apparatus for locking a magazine 有权
    用于锁定杂志的装置

    公开(公告)号：US08317015B2

    公开(公告)日：2012-11-27

    申请号：US12825160

    申请日：2010-06-28

    申请人： Chang-Hwan Ji ,  Jong-Hoon Kim ,  Hee-Sang Yang ,  Jae-Nam Lee ,  Jong-Chul Kim

    发明人： Chang-Hwan Ji ,  Jong-Hoon Kim ,  Hee-Sang Yang ,  Jae-Nam Lee ,  Jong-Chul Kim

    IPC分类号： B65D55/02

    CPC分类号： H01L21/6734

    摘要： A locking apparatus for locking a magazine configured to receive a printed circuit board (PCB) may include an actuator, a rotating block, and a locking member. The actuator may be installed on the magazine. The rotating block may be connected to the actuator. The rotating block may be rotated about a vertical axis. The locking member may be rotatably connected to the magazine about the vertical axis. The locking member may be selectively combined with the rotating block to block a front face of the magazine, thereby preventing breakaway of the PCB from the magazine.

    摘要翻译： 用于锁定构造成接收印刷电路板（PCB）的盒的锁定装置可以包括致动器，旋转块和锁定构件。 执行器可以安装在刀库上。 旋转块可以连接到致动器。 旋转块可绕垂直轴旋转。 锁定构件可以围绕垂直轴线可旋转地连接到盒。 可以将锁定构件选择性地与旋转块组合以阻挡盒的前面，从而防止PCB从盒中脱离。