-
公开(公告)号：US20100213264A1
公开(公告)日：2010-08-26
申请号：US12682446
申请日：2008-10-15
申请人： Heikki Ahokas , Matti Ritamäki , Marko Hanhikorpi
发明人： Heikki Ahokas , Matti Ritamäki , Marko Hanhikorpi
IPC分类号： G06K19/077 , H01P11/00
CPC分类号： G06K19/07749 , Y10T29/49016
摘要： An RFID tag to be attached to an item, and a method. The tag comprises an antenna and an integrated circuit. The RFID tag further comprises a substrate on which the antenna is attached. The substrate is construed to form a stand-off relation between the item and the antenna when buried inside of the material of the item.
摘要翻译： 要附着到物品上的RFID标签和方法。 标签包括天线和集成电路。 RFID标签还包括其上附接有天线的基板。 当衬底材料被埋在物品的内部时，衬底被解释为形成物品与天线之间的间隔关系。
-
公开(公告)号：US20090249611A1
公开(公告)日：2009-10-08
申请号：US12227237
申请日：2006-05-12
申请人： Marko Hanhikorpi , Lari Kytola , Jarkko Miettinen , Matti Ritamaki , Juha Ikonen , Heikki Ahokas
发明人： Marko Hanhikorpi , Lari Kytola , Jarkko Miettinen , Matti Ritamaki , Juha Ikonen , Heikki Ahokas
CPC分类号： G06K19/07718 , G06K19/07749 , G06K19/0775 , G06K19/07786 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018 , Y10T29/49124 , Y10T29/4913
摘要： The present invention relates to a method for manufacturing products comprising transponders. The method comprises introducing a web comprising on its surface sequential structural modules comprising an impedance matching element and an integrated circuit electrically connected to the impedance matching element, the structural modules having a first distance between each other; cutting the web in such a manner that the sequential structural modules are separated from each other; attaching the structural modules to a product substrate, the sequential structural modules having a second distance between each other, the second distance being longer than the first distance; and attaching the impedance matching elements to antennas, the impedance matching elements and the antennas forming an electrical connection.
摘要翻译： 本发明涉及一种制造包含应答器的产品的方法。 该方法包括在其表面上引入包括阻抗匹配元件的顺序结构模块和电连接到阻抗匹配元件的集成电路的网，所述结构模块彼此之间具有第一距离; 以这样的方式切割网，使得顺序结构模块彼此分离; 将所述结构模块附接到产品基板，所述顺序结构模块具有彼此之间的第二距离，所述第二距离长于所述第一距离; 并且将阻抗匹配元件附接到天线，阻抗匹配元件和形成电连接的天线。
-
公开(公告)号：US08251295B2
公开(公告)日：2012-08-28
申请号：US12598159
申请日：2008-04-25
IPC分类号： G06K19/06
CPC分类号： G06K19/07745 , G06K19/0773 , G06K19/0775 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention relates to an RFID tag comprising a heat-resistant substrate made of a plastic film and capable of withstanding temperatures up to 200° C., an antenna formed on the surface of the substrate, an integrated circuit on a silicon chip electrically connected to the antenna and a joint for attaching the chip to the substrate on that the chip is capable of connecting electrically to the antenna. The joint is made of an anisotropically conductive adhesive capable of withstanding temperatures up to 200° C. and having a thermal expansion coefficient essentially similar to that of the silicon chip.
摘要翻译： 本发明涉及一种RFID标签，其包括由塑料膜制成的耐热衬底并能承受高达200℃的温度，形成在衬底表面上的天线，在硅芯片上电连接的集成电路 天线和用于将芯片附接到基板的接头，因为芯片能够电连接到天线。 接头由能够耐受高达200℃的温度并且具有基本上类似于硅芯片的热膨胀系数的各向异性导电粘合剂制成。
-
公开(公告)号：US07994995B2
公开(公告)日：2011-08-09
申请号：US11884364
申请日：2006-02-06
申请人： Matti Ritamaki , Heikki Ahokas
发明人： Matti Ritamaki , Heikki Ahokas
IPC分类号： H01Q9/00
CPC分类号： H01Q1/2208 , G06K19/0723 , G06K19/0726 , H01Q1/22 , H01Q7/00 , H01Q9/16 , Y10T29/49016
摘要： Tuning an antenna circuit that includes an inductance of a resonance circuit, and a component having a component impedance. The antenna circuit includes multiple connection areas for connecting the component to the antenna circuit At least two of the multiple of connection areas are part of the resonance circuit. The tuning can be performed by selecting at least one connection area for the component among the at least two of the multiple connection areas
摘要翻译： 调谐包括谐振电路的电感的天线电路和具有分量阻抗的分量。 天线电路包括用于将部件连接到天线电路的多个连接区域。多个连接区域中的至少两个是谐振电路的一部分。 可以通过在多个连接区域中的至少两个中选择组件的至少一个连接区域来执行调谐
-
公开(公告)号：US20050057424A1
公开(公告)日：2005-03-17
申请号：US10889454
申请日：2004-07-12
申请人： Vesa Kukko , Heikki Ahokas
发明人： Vesa Kukko , Heikki Ahokas
CPC分类号： H01Q9/27 , H01Q1/2225 , H01Q1/44 , H01Q9/04 , H01Q9/16
摘要： Fabricating planar antenna by incorporating text or graphical images into the conductive part of the antenna.
摘要翻译： 通过将文本或图形图像合并到天线的导电部分来制造平面天线。
-
公开(公告)号：US07971336B2
公开(公告)日：2011-07-05
申请号：US12227237
申请日：2006-05-12
申请人： Marko Hanhikorpi , Lari Kytola , Jarkko Miettinen , Matti Ritamaki , Juha Ikonen , Heikki Ahokas
发明人： Marko Hanhikorpi , Lari Kytola , Jarkko Miettinen , Matti Ritamaki , Juha Ikonen , Heikki Ahokas
CPC分类号： G06K19/07718 , G06K19/07749 , G06K19/0775 , G06K19/07786 , Y10T29/49002 , Y10T29/49016 , Y10T29/49018 , Y10T29/49124 , Y10T29/4913
摘要： The present invention relates to a method for manufacturing products comprising transponders. The method comprises introducing a web comprising on its surface sequential structural modules comprising an impedance matching element and an integrated circuit electrically connected to the impedance matching element, the structural modules having a first distance between each other; cutting the web in such a manner that the sequential structural modules are separated from each other; attaching the structural modules to a product substrate, the sequential structural modules having a second distance between each other, the second distance being longer than the first distance; and attaching the impedance matching elements to antennas, the impedance matching elements and the antennas forming an electrical connection.
摘要翻译： 本发明涉及一种制造包含应答器的产品的方法。 该方法包括在其表面上引入包括阻抗匹配元件的顺序结构模块和电连接到阻抗匹配元件的集成电路的网，所述结构模块彼此之间具有第一距离; 以这样的方式切割网，使得顺序结构模块彼此分离; 将所述结构模块附接到产品基板，所述顺序结构模块具有彼此之间的第二距离，所述第二距离长于所述第一距离; 并且将阻抗匹配元件附接到天线，阻抗匹配元件和形成电连接的天线。
-
公开(公告)号：US20110017832A1
公开(公告)日：2011-01-27
申请号：US12598159
申请日：2008-04-25
IPC分类号： G06K19/077
CPC分类号： G06K19/07745 , G06K19/0773 , G06K19/0775 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： The present invention relates to an RFID tag comprising a heat-resistant substrate (11) made of a plastic film and capable of withstanding temperatures up to 200° C., an antenna (1) formed on the surface of the substrate, an integrated circuit on a silicon chip (6) electrically connected to the antenna and a joint for attaching the chip to the substrate so that the chip is capable of connecting electrically to the antenna. The joint is made of an an isotropically conductive adhesive capable of withstanding temperatures up to 200° C. and having a thermal expansion coefficient essentially similar to that of the silicon chip.
摘要翻译： 本发明涉及RFID标签，该RFID标签包括由塑料膜制成并能耐受高达200℃的温度的耐热基板（11），形成在基板表面上的天线（1），集成电路 在与天线电连接的硅芯片（6）和用于将芯片附接到基板的接头上，使得芯片能够电连接到天线。 接头由能够耐受高达200℃的温度并具有基本上类似于硅芯片的热膨胀系数的各向异性导电粘合剂制成。
-
公开(公告)号：US08794531B2
公开(公告)日：2014-08-05
申请号：US12309224
申请日：2007-07-13
申请人： Matti Ritamäki , Marko Hanhikorpi , Heikki Ahokas , Lari Kytölä
发明人： Matti Ritamäki , Marko Hanhikorpi , Heikki Ahokas , Lari Kytölä
CPC分类号： G06K19/041 , G06K19/0723 , G06K19/07749
摘要： The present invention relates to a radio frequency identification tag which is adapted to work at a frequency between 850 MHz and 950 MHz. The tag may comprise a planar inverted F antenna, a loop antenna, or a dual patch antenna.
摘要翻译： 本发明涉及一种射频识别标签，其适用于在850MHz和950MHz之间的频率工作。 标签可以包括平面倒F天线，环形天线或双贴片天线。
-
公开(公告)号：US20100065647A1
公开(公告)日：2010-03-18
申请号：US12309224
申请日：2007-07-13
申请人： Matti Ritamaki , Marko Hanhikorpi , Heikki Ahokas , Lari Kytõlã
发明人： Matti Ritamaki , Marko Hanhikorpi , Heikki Ahokas , Lari Kytõlã
CPC分类号： G06K19/041 , G06K19/0723 , G06K19/07749
摘要： The present invention relates to a radio frequency identification tag which is adapted to work at a frequency between 850 MHz and 950 MHz. The tag may comprise a planar inverted F antenna, a loop antenna, or a dual patch antenna.
摘要翻译： 本发明涉及一种射频识别标签，其适用于在850MHz和950MHz之间的频率工作。 标签可以包括平面倒F天线，环形天线或双贴片天线。
-
公开(公告)号：US20080316129A1
公开(公告)日：2008-12-25
申请号：US11884364
申请日：2006-02-06
申请人： Matti Ritamaki , Heikki Ahokas
发明人： Matti Ritamaki , Heikki Ahokas
CPC分类号： H01Q1/2208 , G06K19/0723 , G06K19/0726 , H01Q1/22 , H01Q7/00 , H01Q9/16 , Y10T29/49016
摘要： Tuning an antenna circuit that includes an inductance of a resonance circuit, and a component having a component impedance. The antenna circuit includes multiple connection areas for connecting the component to the antenna circuit. At least two of the multiple of connection areas are part of the resonance circuit. The tuning can be performed by selecting at least one connection area for the component among the at least two of the multiple connection areas.
摘要翻译： 调谐包括谐振电路的电感的天线电路和具有分量阻抗的分量。 天线电路包括用于将部件连接到天线电路的多个连接区域。 多个连接区域中的至少两个是谐振电路的一部分。 可以通过在多个连接区域中的至少两个中选择组件的至少一个连接区域来执行调谐。
-
-
-
-
-
-
-
-
-
搜索结果
10 条记录 (耗时 0.012 秒)
