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    Electronic device cooling with autonomous fluid routing and method of assembly
    1.
    发明授权
    Electronic device cooling with autonomous fluid routing and method of assembly 有权
    具有自主流体路线的电子设备冷却和组装方法

    公开(公告)号：US09035452B2

    公开(公告)日：2015-05-19

    申请号：US13568667

    申请日：2012-08-07

    申请人： Stanton Earl Weaver ,  Hendrik Pieter Jacobus De Bock

    发明人： Stanton Earl Weaver ,  Hendrik Pieter Jacobus De Bock

    IPC分类号： H01L23/473 ,  H01L23/38 ,  B23P15/26

    CPC分类号： B23P15/26 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： An integrated circuit device is provided. The integrated circuit device includes a die having a first surface and a second surface opposite the first surface. The die has at least one circuit element positioned on its first surface. At least one micro-channel is defined in the second surface of the die. The integrated circuit device includes a cooling substrate attached to the second surface of the die. At least one fluid routing channel is defined in the cooling substrate. The at least one fluid routing channel is connected to the at least one micro-channel defined in the die. Additionally, the cooling substrate has at least one valve positioned within the at least one fluid routing channel. The at least one valve is configured to autonomously regulate a flow rate of a cooling fluid flowing through the at least one fluid routing channel.

    摘要翻译： 提供集成电路装置。 集成电路器件包括具有第一表面和与第一表面相对的第二表面的管芯。 模具具有至少一个位于其第一表面上的电路元件。 在模具的第二表面中限定至少一个微通道。 集成电路装置包括附接到模具的第二表面的冷却基板。 在冷却衬底中限定至少一个流体路线通道。 所述至少一个流体路由通道连接到在所述管芯中限定的所述至少一个微通道。 另外，冷却基板具有位于至少一个流体路由通道内的至少一个阀。 所述至少一个阀被配置为自主地调节流过所述至少一个流体路由通道的冷却流体的流量。

    HEAT EXCHANGE ASSEMBLY FOR USE WITH ELECTRICAL DEVICES AND METHODS OF ASSEMBLING AN ELECTRICAL DEVICE
    2.
    发明申请
    HEAT EXCHANGE ASSEMBLY FOR USE WITH ELECTRICAL DEVICES AND METHODS OF ASSEMBLING AN ELECTRICAL DEVICE 有权
    与电气设备一起使用的热交换器组件和组装电气设备的方法

    公开(公告)号：US20130170142A1

    公开(公告)日：2013-07-04

    申请号：US13340309

    申请日：2011-12-29

    申请人： Stanton Earl Weaver, JR. ,  Tao Deng ,  Hendrik Pieter Jacobus de Bock ,  Shakti Singh Chauhan

    发明人： Stanton Earl Weaver, JR. ,  Tao Deng ,  Hendrik Pieter Jacobus de Bock ,  Shakti Singh Chauhan

    IPC分类号： H05K7/20 ,  H05K13/00 ,  F28F9/00

    CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.

    摘要翻译： 这里描述了一种电气设备。 电气设备包括壳体，其包括限定空腔的内表面，联接到壳体并沿着第一平面定向的散热器，以及定位在壳体空腔内并沿着第二平面定向的至少一个电气部件， 与第一架飞机不同。 热交换组件耦合到电气部件和散热器，用于调节电气部件的温度。 热交换组件包括蒸发器部分，冷凝器部分和在蒸发器部分和冷凝器部分之间延伸的输送部分，用于在蒸发器部分和冷凝器部分之间引导工作流体。 热交换组件构造成沿着相对于输送部分定向的至少一个弯曲轴线弯曲。

    Heat exchange assembly for use with electrical devices and methods of assembling an electrical device
    4.
    发明授权
    Heat exchange assembly for use with electrical devices and methods of assembling an electrical device 有权
    用于电气设备的热交换组件和组装电气设备的方法

    公开(公告)号：US08780559B2

    公开(公告)日：2014-07-15

    申请号：US13340309

    申请日：2011-12-29

    申请人： Stanton Earl Weaver, Jr. ,  Tao Deng ,  Hendrik Pieter Jacobus de Bock ,  Shakti Singh Chauhan

    发明人： Stanton Earl Weaver, Jr. ,  Tao Deng ,  Hendrik Pieter Jacobus de Bock ,  Shakti Singh Chauhan

    IPC分类号： H05K7/20

    CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An electrical device is described herein. The electrical device includes a housing that includes an inner surface that defines a cavity, a heat sink that is coupled to the housing and oriented along a first plane, and at least one electrical component positioned within the housing cavity and oriented along a second plane that is different than the first plane. A heat exchange assembly is coupled to the electrical component and the heat sink for adjusting a temperature of the electrical component. The heat exchange assembly includes an evaporator section, a condenser section, and a transport section extending between the evaporator section and the condenser section for channeling a working fluid between the evaporator section and the condenser section. The heat exchange assembly is configured to bend along at least one bending axis oriented with respect to the transport section.

    摘要翻译： 这里描述了一种电气设备。 电气设备包括壳体，其包括限定空腔的内表面，联接到壳体并沿着第一平面定向的散热器，以及定位在壳体空腔内并沿着第二平面定向的至少一个电气部件， 与第一架飞机不同。 热交换组件耦合到电气部件和散热器，用于调节电气部件的温度。 热交换组件包括蒸发器部分，冷凝器部分和在蒸发器部分和冷凝器部分之间延伸的输送部分，用于在蒸发器部分和冷凝器部分之间引导工作流体。 热交换组件构造成沿着相对于输送部分定向的至少一个弯曲轴线弯曲。

    ELECTRONIC DEVICE COOLING WITH AUTONOMOUS FLUID ROUTING AND METHOD OF ASSEMBLY
    5.
    发明申请
    ELECTRONIC DEVICE COOLING WITH AUTONOMOUS FLUID ROUTING AND METHOD OF ASSEMBLY 有权
    具有自动流体路由冷却的电子设备和组装方法

    公开(公告)号：US20140043764A1

    公开(公告)日：2014-02-13

    申请号：US13568667

    申请日：2012-08-07

    申请人： Stanton Earl Weaver ,  Hendrik Pieter Jacobus De Bock

    发明人： Stanton Earl Weaver ,  Hendrik Pieter Jacobus De Bock

    IPC分类号： H05K7/20 ,  B23P15/26 ,  F28F27/00

    CPC分类号： B23P15/26 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

    摘要： An integrated circuit device is provided. The integrated circuit device includes a die having a first surface and a second surface opposite the first surface. The die has at least one circuit element positioned on its first surface. At least one micro-channel is defined in the second surface of the die. The integrated circuit device includes a cooling substrate attached to the second surface of the die. At least one fluid routing channel is defined in the cooling substrate. The at least one fluid routing channel is connected to the at least one micro-channel defined in the die. Additionally, the cooling substrate has at least one valve positioned within the at least one fluid routing channel. The at least one valve is configured to autonomously regulate a flow rate of a cooling fluid flowing through the at least one fluid routing channel.

    摘要翻译： 提供集成电路装置。 集成电路器件包括具有第一表面和与第一表面相对的第二表面的管芯。 模具具有至少一个位于其第一表面上的电路元件。 在模具的第二表面中限定至少一个微通道。 集成电路装置包括附接到模具的第二表面的冷却基板。 在冷却衬底中限定至少一个流体路线通道。 所述至少一个流体路由通道连接到在所述管芯中限定的所述至少一个微通道。 另外，冷却基板具有位于至少一个流体路由通道内的至少一个阀。 所述至少一个阀被配置为自主地调节流过所述至少一个流体路由通道的冷却流体的流量。

    Cooling system for an electrical machine with center rotor cooling dusts
    7.
    发明授权
    Cooling system for an electrical machine with center rotor cooling dusts 失效
    具有中心转子冷却粉尘的电机冷却系统

    公开(公告)号：US07462962B2

    公开(公告)日：2008-12-09

    申请号：US11150270

    申请日：2005-06-13

    申请人： Hendrik Pieter Jacobus De Bock ,  James Jonathan Grant ,  Samir A. Salamah ,  Norman Suguitan

    发明人： Hendrik Pieter Jacobus De Bock ,  James Jonathan Grant ,  Samir A. Salamah ,  Norman Suguitan

    IPC分类号： H02K9/06

    CPC分类号： H02K9/005 ,  H02K9/08

    摘要： An electrical machine includes a stator having a radically inwardly directed duct adjacent the center of the machine for flowing cooling medium into the gap between the stator and rotor. The rotor includes radial or diagonal ducts having scoops for directing flow generally radically inwardly to cool the field windings in the center of the machine. The cooling medium flows either into subslots for radial or diagonal outward flow through outlet ducts for return to the gap.

    摘要翻译： 电机包括定子，该定子具有邻近机器中心的自由向内导向的管道，用于使冷却介质流入定子和转子之间的间隙。 转子包括径向或对角管道，其具有用于将流体大致向内引导的铲斗，以冷却机器中心的励磁绕组。 冷却介质流入通过出口管道的径向或对角线向外流动的子槽，以返回间隙。