Optoelectronic Systems
    3.
    发明申请

    公开(公告)号:US20190107627A1

    公开(公告)日:2019-04-11

    申请号:US15999249

    申请日:2017-02-16

    摘要: The present disclosure describes an optoelectronic system and methods for efficiently capturing three-dimensional data. The optoelectronic system includes a three-dimensional imaging module and a distance measuring module. Data collected via the distance measuring module is used to collect three-dimensional data, such as three-dimensional maps or other representations of three-dimensional objects. Further, the approach can be extended to multiple regions of interest, and can be applied to the acquisition of biometric data.

    Optoelectronic modules including an image sensor having regions optically separated from one another

    公开(公告)号:US10199412B2

    公开(公告)日:2019-02-05

    申请号:US15329112

    申请日:2015-07-22

    IPC分类号: H01L27/146 H01L25/04

    摘要: This disclosure describes optoelectronic modules that include an image sensor having at least two regions separated optically from one another by a wall. The wall can include a bridge portion that extends over the image sensor and further can include a cured adhesive portion, part of which is disposed between a lower surface of the bridge portion and an upper surface of the image sensor. Various techniques are described for fabricating the modules so as to help prevent the adhesive from contaminating sensitive regions of the image sensor. The wall can be substantially light-tight so as to prevent undesired optical cross-talk, for example, between a light emitter located to one side of the wall and a light sensitive region of the image sensor located to the other side of the wall.

    METHOD FOR MANUFACTURING WAVEGUIDE STRUCTURES ON WAFER-LEVEL AND CORRESPONDING WAVEGUIDE STRUCTURES

    公开(公告)号:US20180372943A1

    公开(公告)日:2018-12-27

    申请号:US15992273

    申请日:2018-05-30

    IPC分类号: F21V8/00 B29D11/00

    摘要: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.