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公开(公告)号：US10199426B2
公开(公告)日：2019-02-05
申请号：US15828664
申请日：2017-12-01
发明人： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC分类号： H01L27/146 , H01L31/0203 , H01L31/0232 , H01L33/58
摘要： Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
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公开(公告)号：US20180266877A1
公开(公告)日：2018-09-20
申请号：US15984278
申请日：2018-05-18
发明人： Qichuan Yu , Hartmut Rudmann , Ji Wang , Kian Siang Ng , Simon Gubser , Sonja Hanselmann
IPC分类号： G01J1/02 , H01L31/173
CPC分类号： G01J1/0209 , G01J1/0214 , G01J1/0271 , G01J1/0295 , H01L31/173
摘要： Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.
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公开(公告)号：US11009660B2
公开(公告)日：2021-05-18
申请号：US16483987
申请日：2018-02-09
发明人： Simon Gubser , Qichuan Yu , Choon Hein Law , Ji Wang
摘要： The present disclosure describes light guides and a method of manufacturing light guides that include a rectangular prism-shaped bar, a first polymer or metal cladding on four sides of the rectangular prism-shaped bar, and a second polymer cladding disposed on the first polymer cladding on the four sides of the rectangular prism-shaped bar.
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公开(公告)号：US20180239116A1
公开(公告)日：2018-08-23
申请号：US15755221
申请日：2016-08-25
发明人： Qichuan Yu , Kam Wah Leong , Ji Wang
摘要： This disclosure describes optical assemblies that can be fabricated, for example, using wafer-level processes. The process can include providing a wafer stack that includes an optics wafer, and molding spacers directly onto the surface of the optics wafer. The spacers can be molded, for example, using a vacuum injection technique such that they adhere to the optics wafer without adhesive.
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公开(公告)号：US09859327B2
公开(公告)日：2018-01-02
申请号：US15367257
申请日：2016-12-02
发明人： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC分类号： H01L21/00 , H01L27/146 , H01L31/0203 , H01L31/0232 , H01L33/58
CPC分类号： H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
摘要： Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
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公开(公告)号：US20170084663A1
公开(公告)日：2017-03-23
申请号：US15367257
申请日：2016-12-02
发明人： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Sonja Hanselmann , Christoph Friese , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC分类号： H01L27/146 , H01L31/0232 , H01L33/58
CPC分类号： H01L27/14685 , H01L27/14618 , H01L27/14625 , H01L27/14687 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/12044 , H01L2933/0058 , H01L2924/00
摘要： Various optoelectronic modules are described that include an optoelectronic device (e.g., a light emitting or light detecting element) and a transparent cover. Non-transparent material is provided on the sidewalls of the transparent cover, which, in some implementations, can help reduce light leakage from the sides of the transparent cover or can help prevent stray light from entering the module. Fabrication techniques for making the modules also are described.
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7.发明申请OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT, AND FABRICATION METHODS FOR SUCH MODULES 审中-公开具有遮光以减少光泄漏或光照的光电模块，以及用于这些模块的制造方法公开(公告)号：US20150325613A1
公开(公告)日：2015-11-12
申请号：US14743073
申请日：2015-06-18
发明人： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
IPC分类号： H01L27/146 , G02B7/02 , F21V5/04 , G02B13/00 , G02B5/22
CPC分类号： H01L27/14623 , F21V5/048 , F21Y2115/10 , G02B5/22 , G02B7/02 , G02B13/0085 , H01L24/94 , H01L25/50 , H01L31/0203 , H01L31/0543 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2933/0033 , H04N5/2252 , H04N5/2257 , Y02E10/52 , Y10T29/41 , H01L2924/00
摘要： Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
摘要翻译： 光电模块包括光电器件和透明盖。 在透明盖的侧壁上设置不透明的材料，这有助于减少透明盖的侧面的光泄漏，或者有助于减少杂散光进入模块。 模块可以例如在晶片级工艺中制造。 在一些实施方案中，诸如沟槽的开口形成在透明晶片中。 然后可以使用例如真空注射工具用不透明材料填充沟槽。 当随后将包括沟槽填充的透明晶片的晶片堆叠分离成单个模块时，结果是每个模块可以包括具有被不透明材料覆盖的侧壁的透明盖。
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公开(公告)号：US20150036046A1
公开(公告)日：2015-02-05
申请号：US14339623
申请日：2014-07-24
发明人： Hartmut Rudmann , Simon Gubser , Susanne Westenhöfer , Stephan Heimgartner , Jens Geiger , Xu Yi , Thng Chong Kim , John A. Vidallon , Ji Wang , Qi Chuan Yu , Kam Wah Leong
CPC分类号： H01L27/14623 , F21V5/048 , F21Y2115/10 , G02B5/22 , G02B7/02 , G02B13/0085 , H01L24/94 , H01L25/50 , H01L31/0203 , H01L31/0543 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2933/0033 , H04N5/2252 , H04N5/2257 , Y02E10/52 , Y10T29/41 , H01L2924/00
摘要： Optoelectronic modules include an optoelectronic device and a transparent cover. A non-transparent material is provided on the sidewalls of the transparent cover, which can help reduce light leakage from the sides of the transparent cover or can help reduce stray light from entering the module. The modules can be fabricated, for example, in wafer-level processes. In some implementations, openings such as trenches are formed in a transparent wafer. The trenches then can be filled with a non-transparent material using, for example, a vacuum injection tool. When a wafer-stack including the trench-filled transparent wafer subsequently is separated into individual modules, the result is that each module can include a transparent cover having sidewalls that are covered by the non-transparent material.
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公开(公告)号：US20190097066A1
公开(公告)日：2019-03-28
申请号：US15772581
申请日：2016-11-15
发明人： Qichuan Yu , Hartmut Rudmann , Ji Wang , Kian Siang NG , Simon Gubser , James Eilertsen , Sundar Raman Ghana Sambandam
IPC分类号： H01L31/0203 , H01L31/0216 , H01L31/0232 , H01L31/18 , H01L33/54 , H01L33/58
摘要： The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.
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公开(公告)号：US20190051762A1
公开(公告)日：2019-02-14
申请号：US16073418
申请日：2017-02-21
发明人： Qichuan Yu , Hartmut Rudmann , Ji Wang , Kian Siang NG , Simon Gubser , James Eilertsen , Sundar Raman Gnana Sambandam
IPC分类号： H01L31/0203 , H01L33/48 , H01L33/00 , H01L33/44 , H01L33/58 , H01L31/18 , H01L31/0216 , H01L31/0232
摘要： The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.
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