摘要:
In an electronic parts installation device, increasing throughput by brining parallel operation of motors, etc., to the maximum, and having high reliability by reducing contacts and/or interferences generating the parallel operations, an electronic parts installation head actuator 9, comprises a plural number of suction nozzles 115, each for sucking an electronic part to install it on a printed circuit board, a nozzle selector member 301 for selecting a predetermined suction nozzle from the plural number of suction nozzles 115, and an elevating device 101 for elevating the plural number of suction nozzles 115, wherein the nozzle selector member 301 has a permanent magnet for attracting the suction nozzle 115, which is biased in one direction by a spring 112, to the direction opposite to that one direction, and an excitation coil for neutralizing a magnetic force of the permanent magnet by applying current therein.
摘要:
In a mounting apparatus for electronic components, a command from a host computer is transmitted to a linear motor M via a motion controller and a servo amplifier to thereby drive a mounting head H1 or a mounting head H2. To prevent collision between the two mounting heads H1, H2, position information from a linear encoder E is fed back to not only the servo amplifier, but also the motion controller. Once determining that the two mounting heads H1, H2 collide, the motion controller applies brake to the mounting heads H1, H2 to avoid collision therebetween, regardless of the command from the host computer.
摘要:
In a mounting apparatus for electronic components, a command from a host computer is transmitted to a linear motor M via a motion controller and a servo amplifier to thereby drive a mounting head H1 or a mounting head H2. To prevent collision between the two mounting heads H1, H2, position information from a linear encoder E is fed back to not only the servo amplifier, but also the motion controller. Once determining that the two mounting heads H1, H2 collide, the motion controller applies brake to the mounting heads H1, H2 to avoid collision therebetween, regardless of the command from the host computer.
摘要:
The invention is directed to minimization of mounting time of each of electronic components by starting simultaneous operations of the suction nozzle in vertical movement and horizontal movement based on start delay of a vertical movement mechanism or horizontal axes of the suction nozzle. When the suction nozzle is to lower, CPU determines a lowering start position of the suction nozzle during its movement based on start delay time of a nozzle vertical movement motor for vertically moving the suction nozzle, that is, time (NL axis start delay) from the time when the CPU outputs an operation signal for the nozzle vertical movement motor until the time when the nozzle vertical movement motor actually starts operating, that is stored in RAM, and time from the time when the suction nozzle starts lowering until the time when the suction nozzle reaches a distance at its lowering speed. This realizes the earlier timing to start the lowering of the suction nozzle during the movement of the mounting head, that is, during the movement of the suction nozzle.
摘要:
An electronic component mounting apparatus has a pair of guides, a beam traveling along the guides and a mounting head placed on the beam. A first linear motor moves the beam along the guides, and a second linear motor moves the mounting head along the beam. A thermal insulating portion placed between the beam and the guides thermally insulates the two components from each other. Thermal conduction portions are placed on the fixed elements of the first and second linear motors. This configuration assures an accurate operation of the mounting apparatus by eliminating thermal deformations of their components.
摘要:
An electronic component is mounted on a printed board by a first head and a second head collaboratively. The first head is prioritized to the second head for moving operations. The range which allows the second head to move is defined in consideration with all the positions where the electronic components held by the first head are to be mounted on the printed board such that no collision occurs between the first head in operation and the second head.
摘要:
The invention provides an electronic component mounting apparatus in which a mounting time per electronic component can be reduced by starting a vertical movement motor and so on as early as possible. When a CPU judges that an interlock canceling condition where the movement of a suction nozzle in X and Y directions is to be completed is satisfied and judges that an interlock canceling condition where an electronic component is to be fed on an electronic component feeding unit is satisfied, the CPU outputs a signal indicating the satisfaction of the canceling conditions to a second motor controller. A CPU of the second motor controller that receives the signal indicating the satisfaction of the interlock canceling conditions about the movement of the suction nozzle in the X and Y directions and the feeding of the electronic component on the electronic component feeding unit immediately outputs a start signal to a nozzle vertical movement motor.
摘要:
The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively.
摘要:
The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively.
摘要:
The invention is directed to an electronic component mounting apparatus which is applicable to a case in which component feeding devices need not be provided on both sides of a carrying device respectively for reasons of types of electronic components or a setting space and increases an operating rate of a beam to enhance production efficiency. An electronic component mounting apparatus has a carrying device carrying a printed board, a component feeding device supplying electronic components, a pair of beams movable in one direction by drive sources, and mounting heads each having suction nozzles and movable along the beams by drive sources. The component feeding device is provided on only one side of the carrying device, and the suction nozzles provided on each of the mounting heads pick up electronic components from the component feeding device and mount the electronic components on a printed board by moving the mounting heads provided on both the beams between the printed board on the carrying device and the component feeding device by driving the drive sources respectively.