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公开(公告)号：US20160209120A1
公开(公告)日：2016-07-21
申请号：US15082143
申请日：2016-03-28
Applicant: Hitoshi SAKAMOTO , Minoru YOSHIKAWA , Takeya HASHIGUCHI
Inventor： Hitoshi SAKAMOTO , Minoru YOSHIKAWA , Takeya HASHIGUCHI
CPC classification number: F28D15/0266 , F28D1/024 , F28D15/0283 , F28D2015/0216 , F28F3/02 , H01L23/427 , H01L2924/0002 , H01L2924/00
Abstract: A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion.
Abstract translation: 本发明的沸腾传热装置包括：热接收部分，其使液化的制冷剂沸腾以将其转化为蒸汽，并与待冷却的装置接触并冷却待冷却的装置; 蒸气管，其连接到所述受热部的上部，并且传送由所述受热部产生的蒸气; 散热部，其冷凝从蒸气管输送的蒸气，将其转化为液化的制冷剂，并将热量散发到大气中; 以及液体管，其使由所述散热部冷凝的液化制冷剂返回到所述受热部。 受热部中的蒸气的流路的截面积的至少一部分从受热部的下部朝向受热部的上部逐渐减小。
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公开(公告)号：US09398377B2
公开(公告)日：2016-07-19
申请号：US14237438
申请日：2012-08-02
Applicant: Tadao Sunahara , Masahide Tamura , Osamu Kawasaki , Masaru Tsuchiya , Ryuta Suzuki , Makoto Tsuruta , Nobuhiro Miwa , Hitoshi Sakamoto
Inventor： Tadao Sunahara , Masahide Tamura , Osamu Kawasaki , Masaru Tsuchiya , Ryuta Suzuki , Makoto Tsuruta , Nobuhiro Miwa , Hitoshi Sakamoto
Abstract: A piezoelectric sound generating element capable of providing flatter and less fluctuated sound pressure frequency characteristics includes a diaphragm that is formed in a circular plate shape with a circular profile. A piezoelectric element is affixed to the side of a bottom wall portion of the diaphragm. The piezoelectric element has an asymmetric octagonal profile including a pair of long side portions opposing each other, a pair of short side portions opposing each other, and four connecting side portions.
Abstract translation: 能够提供较平坦且波动较小的声压频率特性的压电发声元件包括形成为具有圆形轮廓的圆板形状的隔膜。 压电元件固定在隔膜的底壁部分的一侧。 压电元件具有非对称八边形轮廓，包括一对彼此相对的长边部分，一对彼此相对的短边部分和四个连接侧部分。
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公开(公告)号：US09363886B2
公开(公告)日：2016-06-07
申请号：US14240348
申请日：2012-08-15
Applicant: Hitoshi Sakamoto , Minoru Yoshikawa , Masaki Chiba , Kenichi Inaba , Arihiro Matsunaga
Inventor： Hitoshi Sakamoto , Minoru Yoshikawa , Masaki Chiba , Kenichi Inaba , Arihiro Matsunaga
CPC classification number: H05K1/021 , F28D15/0266 , G06F1/20 , H05K7/2029
Abstract: An electronic substrate has a tabular base material which can install a heater element and a cooling structure that cools the heater element. The electronic substrate can be plugged in/out in a case in the direction which is almost parallel to the face of the base material. The cooling structure has a first heat radiation part with a hollow shape and a heat transfer part. The first heat radiation part radiates the generated heat of a heater element installed in the base material. A heat transfer part transfers the generated heat to the first heat radiation part. The first heat radiation part has a first joint surface formed along a face which is almost vertical to the insert and removal direction of the base material. The first heat radiation part is connected to a second radiation part set up in the case thermally through the first joint surface.
Abstract translation: 电子基板具有片状基材，其可以安装加热元件和冷却加热器元件的冷却结构。 电子基板可以在几乎平行于基材的表面的方向上被插入/插出。 冷却结构具有中空形状的第一散热部和传热部。 第一散热部照射安装在基材中的加热元件的发热。 传热部将所产生的热量传递到第一散热部。 第一散热部具有沿着与基材的插入和移除方向几乎垂直的面形成的第一接合面。 第一散热部分连接到第二辐射部分，该第二辐射部分在热穿过第一接合表面的情况下设置。
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公开(公告)号：US09297589B2
公开(公告)日：2016-03-29
申请号：US13128740
申请日：2009-10-22
Applicant: Hitoshi Sakamoto , Minoru Yoshikawa , Takeya Hashiguchi
Inventor： Hitoshi Sakamoto , Minoru Yoshikawa , Takeya Hashiguchi
IPC: F28D15/00 , F28D15/02 , H01L23/427
CPC classification number: F28D15/0266 , F28D1/024 , F28D15/0283 , F28D2015/0216 , F28F3/02 , H01L23/427 , H01L2924/0002 , H01L2924/00
Abstract: A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion.
Abstract translation: 本发明的沸腾传热装置包括：热接收部分，其使液化的制冷剂沸腾以将其转化为蒸汽，并与待冷却的装置接触并冷却待冷却的装置; 蒸气管，其连接到所述受热部的上部，并且传送由所述受热部产生的蒸气; 散热部，其冷凝从蒸气管输送的蒸气，将其转化为液化的制冷剂，并将热量散发到大气中; 以及液体管，其使由所述散热部冷凝的液化制冷剂返回到所述受热部。 受热部中的蒸气的流路的截面积的至少一部分从受热部的下部朝向受热部的上部逐渐减小。
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公开(公告)号：US20140366572A1
公开(公告)日：2014-12-18
申请号：US14370185
申请日：2012-12-12
Applicant: Arihiro MATSUNAGA , Minoru YOSHIKAWA , Hitoshi SAKAMOTO , Akira SHOUJIGUCHI , Masaki CHIBA , Kenichi INABA , NEC Corporation
Inventor： Arihiro Matsunaga , Minoru Yoshikawa , Hitoshi Sakamoto , Akira Shoujiguchi , Masaki Chiba , Kenichi Inaba
CPC classification number: F25B39/00 , F25B23/006 , F25B39/028 , F25B39/04 , F25B2339/02 , F25B2339/041 , F28D15/0266 , F28D2021/0028 , H01L23/427 , H01L2924/0002 , H01L2924/00
Abstract: [Problem] When a size of a cooling device using a boiling cooling system is reduced, a cooling performance decreases.[Means for solving the problems] It is characterized in that an evaporation unit which stores refrigerant, a condensing unit which condenses a gas-phase refrigerant produced by vaporizing the refrigerant in the evaporation unit to a liquid and dissipates heat, a vapor pipe which conveys the gas-phase refrigerant to the condensing unit, and a liquid pipe which conveys a liquid-phase refrigerant obtained by condensing the gas-phase refrigerant in the condensing unit to the evaporation unit are included, the condensing unit includes a heat dissipation flow path, an upper header which connects the vapor pipe and the heat dissipation flow path, and a lower header which connects the heat dissipation flow path and the liquid pipe, the upper header includes a flow path header portion connected to the heat dissipation flow path and an upper header extension portion located around the flow path header portion, and the upper header extension portion has a connection port connected to the vapor pipe in a face to which the heat dissipation flow path is connected.
Abstract translation: [问题]当使用沸腾冷却系统的冷却装置的尺寸减小时，冷却性能降低。 解决问题的手段其特征在于，存储制冷剂的蒸发单元，将通过将蒸发单元中的制冷剂蒸发而产生的气相制冷剂冷凝成液体并散热的冷凝单元，传送蒸发管 包含冷凝单元的气相制冷剂和将冷凝单元中的气相制冷剂冷凝至蒸发单元而获得的液相制冷剂的液体管，包括散热流路， 连接蒸气管和散热流路的上部集管和连接散热流路和液体管的下部集管，上部集管包括与散热流路连接的流路集管部，上部 头部延伸部分位于流动路径头部分周围，并且上部标题扩展部分具有连接到蒸气pi的连接端口 pe在散热流路连接的面上。
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Patent Agency Ranking
公开(公告)号：US08908373B2
公开(公告)日：2014-12-09
申请号：US13498892
申请日：2010-09-16
Applicant: Hitoshi Sakamoto , Chenpin Hsu
Inventor： Hitoshi Sakamoto , Chenpin Hsu
IPC: H05K7/20 , H01L23/427 , H01L23/40
CPC classification number: H01L23/427 , H01L2023/4056 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
Abstract: A metal plate that forms a heat-absorbing surface has a center portion which protrudes so as to correspond to the size of a semiconductor element. A fixing support point of a plate spring is provided at a center of this protruding surface, and the plate spring is fixed on all sides. Grounding pressure is applied via the single point provided by the fixing support point. As a result, any tilting of the heat-absorbing surface relative to the surface of the heat-generating element is kept to a minimum. Heat pipes are provided around the periphery such that they enclose the protruding area from the outside.
Abstract translation: 形成吸热面的金属板具有与半导体元件的尺寸对应地突出的中心部。 板簧的固定支点设置在该突出面的中心，并且板簧固定在所有侧面上。 通过固定支撑点提供的单点施加接地压力。 结果，吸热表面相对于发热元件的表面的任何倾斜都保持最小。 围绕周边设置热管，使得它们从外部包围突出区域。
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公开(公告)号：US20130219954A1
公开(公告)日：2013-08-29
申请号：US13882711
申请日：2011-10-31
Applicant: Masaka Chiba , Minoru Yoshikawa , Hitoshi Sakamoto , Kenichi Inaba , Arihiro Matsunaga
Inventor： Masaka Chiba , Minoru Yoshikawa , Hitoshi Sakamoto , Kenichi Inaba , Arihiro Matsunaga
CPC classification number: F28D15/02 , B23P15/26 , F28D15/0266 , F28D15/046 , F28F13/187 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
Abstract: In a cooling device using an ebullient cooling system, cooling performance adversely decreases if the evaporator includes projections activating convection heat transfer and the bubble nuclei are formed on the inner wall surface. A cooling device according to an exemplary embodiment includes an evaporator storing a refrigerant and a condenser condensing and liquefying a vapor-state refrigerant vaporized in the evaporator and radiating heat. The evaporator includes a base thermally contacting with an object to be cooled, and a container. The base includes a plurality of projections on a boiling surface of a surface at an inner wall side contacting with the refrigerant. The cross-sectional area cut along a plane parallel to the boiling surface at the top of the projection is smaller than that at the boiling surface. The evaporator includes a bubble nucleus forming surface only on a part of a refrigerant contacting surface.
Abstract translation: 在使用沸腾冷却系统的冷却装置中，如果蒸发器包括启动对流热传递的突起并且气泡核形成在内壁表面上，则冷却性能不利地降低。 根据示例性实施例的冷却装置包括存储制冷剂的蒸发器和冷凝和液化在蒸发器中蒸发的蒸气状制冷剂并辐射热量的冷凝器。 蒸发器包括与要冷却的物体热接触的基座和容器。 基部包括在与制冷剂接触的内壁侧的表面的沸腾面上的多个突起。 沿着平行于突起顶部的沸腾表面的平面切割的横截面面积小于沸点表面处的截面积。 蒸发器仅在制冷剂接触表面的一部分上包括气泡核形成表面。
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公开(公告)号：US08514364B2
公开(公告)日：2013-08-20
申请号：US13003268
申请日：2009-05-21
Applicant: Kazuyuki Mikubo , Takeya Hashiguchi , Hitoshi Sakamoto
Inventor： Kazuyuki Mikubo , Takeya Hashiguchi , Hitoshi Sakamoto
IPC: G02F1/1333 , G02F1/13357
CPC classification number: H05K7/20963 , G02F1/133308 , G02F1/133385 , G02F1/133604 , G02F2001/133311 , G02F2001/133317 , G02F2001/133328 , G02F2001/133628 , G02F2201/36 , G02F2201/46 , G02F2201/50 , G02F2203/60 , G06F1/1601 , G06F1/20 , H05K7/20972
Abstract: Provided is a highly reliable liquid crystal display device that prevents the penetration of a flying dust and dirt in the outside air. A liquid crystal display device (1) having a display unit housing case (2) configured to house a light source unit and a display unit, and an electronic component housing case (3) configured to house an electronic component. The liquid crystal display device (1) is tightly closed and externally disposed with heat radiation fins (6a and 6b).
Abstract translation: 提供了一种高度可靠的液晶显示装置，其防止飞溅的灰尘和污物在外部空气中的穿透。 一种具有容纳光源单元和显示单元的显示单元外壳（2）的液晶显示装置（1），以及容纳电子部件的电子部件收纳壳体（3）。 液晶显示装置（1）紧密地封闭并且外部设置有散热片（6a和6b）。
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公开(公告)号：US20130002929A1
公开(公告)日：2013-01-03
申请号：US13527159
申请日：2012-06-19
Applicant: Hitoshi SAKAMOTO
Inventor： Hitoshi SAKAMOTO
IPC: H04N5/225
CPC classification number: H04N5/232
Abstract: A data recording control device controls a recording device to record data acquired by a data acquisition device from a first time point before inputting a trigger signal to a second time point after the trigger signal is input, to a record medium. The control device has a sensor for detecting a light; an output portion for outputting the trigger signal in correspondence to the sensor detecting the light with a predetermined amount of lighting or above when the output portion is set in a standby state; and a control portion releasing the standby state when the output portion outputs the trigger signal, and setting the output portion in the standby state in correspondence to the sensor not detecting the light with the predetermined amount of lighting or above within a predetermined period of time.
Abstract translation: 数据记录控制装置控制记录装置将从数据获取装置获取的数据从输入触发信号之前的第一时间点到触发信号输入之后的第二时间点记录到记录介质。 控制装置具有用于检测光的传感器; 输出部分，当输出部分处于待机状态时，用于输出与传感器对应的触发信号，所述传感器用预定量的照明或以上检测光; 以及当输出部分输出触发信号时释放待机状态的控制部分，并且在预定时间段内对应于不以预定量的照明或以上的光检测光的传感器将输出部分设置在待机状态。
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公开(公告)号：US20110192574A1
公开(公告)日：2011-08-11
申请号：US13062258
申请日：2009-10-07
Applicant: Minoru Yoshikawa , Hitoshi Sakamoto , Takeya Hashiguchi
Inventor： Minoru Yoshikawa , Hitoshi Sakamoto , Takeya Hashiguchi
IPC: F28D15/00
CPC classification number: F28D15/0266 , F28F9/026 , H01L23/427 , H01L2924/0002 , H01L2924/00
Abstract: A maintenance-free cooling structure is provided which, by removing bubbles produced on a boiling surface utilizing an action other than buoyancy, heat change (heat transfer) is effectively brought about on the boiling surface, thus enabling efficient cooling and its miniaturization and low power consumption. The cooling structure has an evaporation chamber 11 connected through a vapor pipe and a liquid return pipe to a condensation chamber to allow a phase change to occur from a vapor phase coolant V to a liquid phase coolant L. In the evaporation chamber, as a result of contact of the liquid phase coolant L with the boiling surface of a base plate 21 and/or with plate-shaped fins, the phase change occurs from liquid to vapor. The evaporation chamber has an aperture operating as a vapor port 25 for the vapor pipe which is formed in a neighboring position along an inner circumferential surface 23a of a cylindrical plate 23 in a ceiling surface 22a and an aperture operating as a liquid return port for the liquid return pipe which is formed in a position neighboring to an end edge along the boiling surface on an inner circumferential surface on a side opposite to the vapor port 25, so that the flow-in direction of the liquid phase coolant is in parallel to the boiling surface.
Abstract translation: 提供一种免维护的冷却结构，其通过除了浮力之外的作用除去在沸腾表面产生的气泡，在沸腾表面上有效地实现了热变化（传热），从而能够有效地冷却其小型化和低功率 消费。 冷却结构具有通过蒸汽管和液体返回管连接到冷凝室的蒸发室11，以允许从气相冷却剂V发生相变到液相冷却剂L.在蒸发室中，结果 液相冷却剂L与基板21的沸腾表面和/或板状翅片的接触，相变由液体发生。 蒸发室具有作为蒸汽管25的蒸气口的孔，该孔形成在沿天花板表面22a的圆柱形板23的内圆周表面23a的相邻位置和作为液体返回端口的孔中 液体返回管，其形成在与蒸气口25相反的一侧的内周面上沿着沸腾面的端部边缘的位置，使得液相冷却剂的流入方向平行于 沸腾的表面。
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