公开(公告)号：US20130248913A1

公开(公告)日：2013-09-26

申请号：US13878782

申请日：2011-10-07

申请人： Brendan Moran ,  Jeffrey Kmetec ,  Iain Black ,  Frederic Diana ,  Serge Laurent Rudaz ,  Li Zhang

发明人： Brendan Moran ,  Jeffrey Kmetec ,  Iain Black ,  Frederic Diana ,  Serge Laurent Rudaz ,  Li Zhang

IPC分类号： H01L33/60 ,  H01L33/50

CPC分类号： H01L33/60 ,  H01L33/50 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

摘要： A submount for a light emitting stack includes a substrate and a metallization layer having circuit traces and a planar dielectric layer that fills regions between the circuit traces. The planar dielectric layer serves to minimize the amount of light lost/absorbed by the substrate and preferably reflects the internally reflected light back toward the desired light output element. To facilitate efficient manufacture, a dielectric paste is applied over the metallized layer, then planed to expose at least portions of the metal conductors for the subsequent coupling to the light emitting stack. Pedestal elements are preferably provided at select locations on the circuit traces to facilitate this coupling while allowing the remainder of the circuit traces to be covered with the dielectric layer.

摘要翻译： 用于发光堆叠的基座包括衬底和具有电路迹线的金属化层和填充电路迹线之间的区域的平面介电层。 平面介电层用于使由衬底损失/吸收的光的量最小化，并且优选地将内部反射的光反射回所需的光输出元件。 为了促进有效的制造，将电介质浆料施加在金属化层上，然后设计成露出至少部分金属导体，以便随后与发光堆叠耦合。 优选地，在电路迹线上的选择位置设置基座元件以促进该耦合，同时允许电路迹线的其余部分被电介质层覆盖。

公开(公告)号：US09040332B2

公开(公告)日：2015-05-26

申请号：US13878782

申请日：2011-10-07

申请人： Brendan Moran ,  Jeffrey Kmetec ,  Iain Black ,  Frederic Diana ,  Serge Laurent Rudaz ,  Li Zhang

发明人： Brendan Moran ,  Jeffrey Kmetec ,  Iain Black ,  Frederic Diana ,  Serge Laurent Rudaz ,  Li Zhang

IPC分类号： H01L33/08 ,  H01L33/60 ,  H01L33/50 ,  H01L33/62

CPC分类号： H01L33/60 ,  H01L33/50 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

摘要： A submount for a light emitting stack includes a substrate and a metallization layer having circuit traces and a planar dielectric layer that fills regions between the circuit traces. The planar dielectric layer serves to minimize the amount of light lost/absorbed by the substrate and preferably reflects the internally reflected light back toward the desired light output element. To facilitate efficient manufacture, a dielectric paste is applied over the metallized layer, then planed to expose at least portions of the metal conductors for the subsequent coupling to the light emitting stack. Pedestal elements are preferably provided at select locations on the circuit traces to facilitate this coupling while allowing the remainder of the circuit traces to be covered with the dielectric layer.

摘要翻译： 用于发光堆叠的基座包括衬底和具有电路迹线的金属化层和填充电路迹线之间的区域的平面介电层。 平面介电层用于使由衬底损失/吸收的光的量最小化，并且优选地将内部反射的光反射回所需的光输出元件。 为了促进有效的制造，将电介质浆料施加在金属化层上，然后设计成露出至少部分金属导体，以便随后与发光堆叠耦合。 优选地，在电路迹线上的选择位置设置基座元件以促进该耦合，同时允许电路迹线的其余部分被电介质层覆盖。