Abstract:
The disclosure relates to preparation of silicon on insulator structures with reduced unbonded regions and to methods for producing such wafers by minimizing the roll-off amount (ROA) of the handle and donor wafers. Methods for polishing wafers are also provided.
Abstract:
The disclosure relates to preparation of silicon on insulator structures with reduced unbonded regions and to methods for producing such wafers by minimizing the roll-off amount (ROA) of the handle and donor wafers. Methods for polishing wafers are also provided.
Abstract:
The disclosure relates to preparation of silicon on insulator structures with reduced unbonded regions and to methods for producing such wafers by minimizing the roll-off amount (ROA) of the handle and donor wafers. Methods for polishing wafers are also provided.
Abstract:
A winding reel for optical fiber is provided with a drum and a flange. The flange is provided with first and second slits therein for receiving leading and trailing (frontward and rearward) portions of the optical fiber. The length of the slit that receives the forward end of the optical fiber extends from the outer periphery of the flange to the surface of the drum. The slit for receiving the rearward end of the optical fiber is shorter than the forward end receiving slit. The rearward end receiving slit extends from the outer periphery of the flange inwardly a distance such that the slit does not reach a position at which a maximum amount of optical fiber wound on the winding reel is located.
Abstract:
A hermetic coated optical fiber is produced by preparing a bare optical fiber by melting and drawing an optical fiber preform in a fiber drawing furnace and introducing the bare optical fiber in a reactor in which a raw material gas is introduced and forming a hermetic coating film around a surface of the bare optical fiber by a chemical vapor deposition method or pyrolysis in the reactor, wherein a part of an inert gas for purging the fiber drawing furnace which has been heated by a heater equipped in the furnace is exhausted and a rest of the inert gas is introduced in the reactor for diluting the raw material gas.
Abstract:
A housing having a suction port and a discharge port, an impeller 21 and a casing 22 that houses the impeller 21, an air blower 2 housed in the housing, a filter that lets through the air suctioned from the suction port by the air blower 2, and two ion generating sections that generate positive and negative ions are provided. The ion generating section is arranged on a circular-arc guide wall 2a in the casing 22. The positive and negative ions generated by the ion generating section are efficiently included in the air passing through as laminar flow along the circular-arc guide wall 22a.
Abstract:
A production method of a thin plate includes preparing a thin plate support with a receptacle cavity having a bottom surface formed with a complementary three-dimensional pattern with a three-dimensional pattern of one side surface of a machining object, setting the machining object within the receptacle cavity with mating the complementary three-dimensional pattern with the three-dimensional pattern on the one surface of the machining object, chucking the thin plate support carrying the machining object set in the receptacle cavity on a machine tool, driving the thin plate support together with the machining object to rotate, and machining the machining object as being driven to rotate on the machine tool from the other side of the machining object by means of a cutting tool.
Abstract:
A method for processing a semiconductor wafer sliced from a single-crystal ingot comprises subjecting the front and back surfaces of the wafer to a lapping operation to reduce the thickness of the wafer and to remove damage caused during slicing of the wafer. The wafer is then subjected to an etching operation to further reduce the thickness of the wafer and to further remove damage remaining after the lapping operation. The wafer is subsequently subjected to a double-side polishing operation to uniformly remove damage from the front and back surfaces caused by the lapping and etching operations, thereby improving the flatness of the wafer and leaving polished front and back surfaces. Finally, the back surface of the wafer is subjected to a back surface damaging operation in which damage is induced in the back surface of the wafer while the front surface is substantially protected against being damaged or roughened. A pressure jetting machine of the present invention includes a wafer holder that supports the wafer in the pressure jetting machine such that the back surface of the wafer is exposed to the jetted abrasive slurry while the front surface is supported by the holder in spaced relationship above a support surface of the machine to inhibit damaging engagement between the support surface and the front surface of the wafer.
Abstract:
The invention provides an ornamental article which can be produced readily in a mass together at a low cost without requiring a special skill and a production method therefor. The ornamental article is produced by fixing a base plate element having a three-dimensional pattern portion formed integrally thereon, to a chucking member for a lathe such that the three-dimensional pattern portion is fittably received in a complementary receiving portion of the chucking member, rotating the chucking member, and machining the base plate element by means of a cutting tool to remove the material of the base plate element until a boundary plane between the base plate element and the three-dimensional pattern portion is reached. The three-dimensional pattern portion of the ornamental article produced has an outer peripheral portion whose thickness gradually decreases toward an outer peripheral edge thereof so as to define an outer periphery contour line without exhibiting a steeply rising end face. When the ornamental article is attached to an object article, the three-dimensional pattern portion exhibits a continuous appearance to an outer face of the object article.
Abstract:
There is provided a process of melt drawing an optical fiber from a preform therefor in which a heating furnace comprising a muffle tube inside thereof through which the optical fiber is passed is provided immediately below a melt drawing furnace to further draw the optical fiber while heated, and an interior of the muffle tube is kept in an atmosphere selected from the group consisting of an inert atmosphere, an atmosphere comprising oxygen gas and an atmosphere comprising hydrogen gas.