Slitted winding wheel for optical fiber
    4.
    发明授权
    Slitted winding wheel for optical fiber 失效
    光纤缠绕轮

    公开(公告)号:US5441215A

    公开(公告)日:1995-08-15

    申请号:US251346

    申请日:1994-05-31

    Abstract: A winding reel for optical fiber is provided with a drum and a flange. The flange is provided with first and second slits therein for receiving leading and trailing (frontward and rearward) portions of the optical fiber. The length of the slit that receives the forward end of the optical fiber extends from the outer periphery of the flange to the surface of the drum. The slit for receiving the rearward end of the optical fiber is shorter than the forward end receiving slit. The rearward end receiving slit extends from the outer periphery of the flange inwardly a distance such that the slit does not reach a position at which a maximum amount of optical fiber wound on the winding reel is located.

    Abstract translation: 用于光纤的卷绕卷轴设有滚筒和凸缘。 凸缘在其中设置有第一和第二狭缝,用于接收光纤的前后(前后)部分。 接收光纤前端的狭缝的长度从凸缘的外周延伸到滚筒的表面。 用于接收光纤的后端的狭缝比前端接收狭缝短。 后端接收狭缝从凸缘的外周向内延伸一定距离,使得狭缝未到达缠绕在卷绕卷轴上的最大量的光纤所在的位置。

    Ion generating apparatus and air purifying apparatus
    6.
    发明授权
    Ion generating apparatus and air purifying apparatus 有权
    离子发生装置和空气净化装置

    公开(公告)号:US09005529B2

    公开(公告)日:2015-04-14

    申请号:US13061099

    申请日:2009-03-17

    Abstract: A housing having a suction port and a discharge port, an impeller 21 and a casing 22 that houses the impeller 21, an air blower 2 housed in the housing, a filter that lets through the air suctioned from the suction port by the air blower 2, and two ion generating sections that generate positive and negative ions are provided. The ion generating section is arranged on a circular-arc guide wall 2a in the casing 22. The positive and negative ions generated by the ion generating section are efficiently included in the air passing through as laminar flow along the circular-arc guide wall 22a.

    Abstract translation: 具有吸入口和排出口的壳体,容纳叶轮21的叶轮21和壳体22,容纳在壳体中的鼓风机2,通过鼓风机2吸入从吸入口吸入的空气的过滤器 并且提供了产生正离子和负离子的两个离子产生部分。 离子产生部分设置在壳体22中的圆弧引导壁2a上。由离子产生部产生的正离子和负离子被有效地包围在沿着圆弧引导壁22a作为层流通过的空气中。

    Production method of thin plate and thin plate support for chucking employed in the method
    7.
    发明授权
    Production method of thin plate and thin plate support for chucking employed in the method 失效
    该方法采用的薄板和薄板支撑的制造方法

    公开(公告)号:US06637301B2

    公开(公告)日:2003-10-28

    申请号:US09737460

    申请日:2000-12-18

    Inventor: Ichiro Yoshimura

    Abstract: A production method of a thin plate includes preparing a thin plate support with a receptacle cavity having a bottom surface formed with a complementary three-dimensional pattern with a three-dimensional pattern of one side surface of a machining object, setting the machining object within the receptacle cavity with mating the complementary three-dimensional pattern with the three-dimensional pattern on the one surface of the machining object, chucking the thin plate support carrying the machining object set in the receptacle cavity on a machine tool, driving the thin plate support together with the machining object to rotate, and machining the machining object as being driven to rotate on the machine tool from the other side of the machining object by means of a cutting tool.

    Abstract translation: 薄板的制造方法包括:准备具有容纳腔的薄板支撑体,所述容器腔具有形成有加工对象的一个​​侧面的三维图案的互补三维图案的底面,将加工对象设定在 将互补三维图案与加工对象的一个​​表面上的三维图案配合的容器腔,将容纳腔体中的加工对象的薄板支撑件夹持在机床上,将薄板支撑件一起驱动 加工对象旋转,并且通过切削工具从加工对象的另一侧在机床上被驱动以加工加工对象。

    Method for processing a semiconductor wafer
    8.
    发明授权
    Method for processing a semiconductor wafer 有权
    半导体晶片的处理方法

    公开(公告)号:US06227944B1

    公开(公告)日:2001-05-08

    申请号:US09276278

    申请日:1999-03-25

    CPC classification number: B24C3/322

    Abstract: A method for processing a semiconductor wafer sliced from a single-crystal ingot comprises subjecting the front and back surfaces of the wafer to a lapping operation to reduce the thickness of the wafer and to remove damage caused during slicing of the wafer. The wafer is then subjected to an etching operation to further reduce the thickness of the wafer and to further remove damage remaining after the lapping operation. The wafer is subsequently subjected to a double-side polishing operation to uniformly remove damage from the front and back surfaces caused by the lapping and etching operations, thereby improving the flatness of the wafer and leaving polished front and back surfaces. Finally, the back surface of the wafer is subjected to a back surface damaging operation in which damage is induced in the back surface of the wafer while the front surface is substantially protected against being damaged or roughened. A pressure jetting machine of the present invention includes a wafer holder that supports the wafer in the pressure jetting machine such that the back surface of the wafer is exposed to the jetted abrasive slurry while the front surface is supported by the holder in spaced relationship above a support surface of the machine to inhibit damaging engagement between the support surface and the front surface of the wafer.

    Abstract translation: 用于处理从单晶锭切片的半导体晶片的方法包括使晶片的前表面和后表面进行研磨操作以减小晶片的厚度并消除晶片切割期间引起的损伤。 然后对晶片进行蚀刻操作,以进一步减小晶片的厚度,并进一步消除研磨操作后剩余的损伤。 随后对晶片进行双面抛光操作,以均匀地去除由研磨和蚀刻操作引起的前表面和背面的损伤,从而提高晶片的平坦度并留下抛光的前后表面。 最后,晶片的背面受到后表面的损伤作用,其中在晶片背面引起损伤,同时基本上保护了前表面免受损坏或粗糙化。 本发明的压力喷射机包括晶片保持器,该晶片保持器在压力喷射机中支撑晶片,使得晶片的背面暴露于喷射的研磨浆料,同时前表面以保持器的间隔关系支撑在一个 机器的支撑表面以抑制支撑表面和晶片前表面之间的损坏接合。

    Ornamental article and method of producing the same
    9.
    发明授权
    Ornamental article and method of producing the same 失效
    观赏用品及其制作方法

    公开(公告)号:US5839334A

    公开(公告)日:1998-11-24

    申请号:US789265

    申请日:1997-01-28

    Inventor: Ichiro Yoshimura

    Abstract: The invention provides an ornamental article which can be produced readily in a mass together at a low cost without requiring a special skill and a production method therefor. The ornamental article is produced by fixing a base plate element having a three-dimensional pattern portion formed integrally thereon, to a chucking member for a lathe such that the three-dimensional pattern portion is fittably received in a complementary receiving portion of the chucking member, rotating the chucking member, and machining the base plate element by means of a cutting tool to remove the material of the base plate element until a boundary plane between the base plate element and the three-dimensional pattern portion is reached. The three-dimensional pattern portion of the ornamental article produced has an outer peripheral portion whose thickness gradually decreases toward an outer peripheral edge thereof so as to define an outer periphery contour line without exhibiting a steeply rising end face. When the ornamental article is attached to an object article, the three-dimensional pattern portion exhibits a continuous appearance to an outer face of the object article.

    Abstract translation: 本发明提供了一种装饰物品,其可以以低成本容易地以大量组合生产,而不需要特殊的技术及其制造方法。 通过将具有一体地形成有三维图案部分的基板元件固定在车床用夹紧部件上,使得三维图案部分适配地容纳在夹紧部件的互补部分中, 旋转夹紧构件,并且通过切割工具加工基板元件以去除基板元件的材料,直到达到基板元件和三维图案部分之间的边界平面。 所制造的装饰品的三维图案部分具有外周部分,其外周部分的厚度朝着其外周边缘逐渐减小,以便限定外周轮廓线而不呈现急剧上升的端面。 当装饰物品附着到物品上时,三维图案部分对于物品的外表面呈现出连续的外观。

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