公开(公告)号：US5797962A

公开(公告)日：1998-08-25

申请号：US654105

申请日：1996-05-28

申请人： Kenji Tomihata ,  Ikuo Sasaki ,  Masakazu Suzuki

发明人： Kenji Tomihata ,  Ikuo Sasaki ,  Masakazu Suzuki

IPC分类号： A61L17/00 ,  A61L17/10 ,  A61L17/12 ,  A61B17/04

CPC分类号： A61L17/12 ,  A61L17/105

摘要： The invention relates to a surgical suture comprising a copolymer as an essential component, the copolymer consisting of lactic acid (lactide) and .epsilon.-caprolacton as repeating unit, wherein shrinkage ratio of said surgical suture is 5% or less after heat treatment at 60.degree. C. for 20 hours and method for production thereof.

摘要翻译： 本发明涉及包含共聚物作为必要组分的手术缝合物，该共聚物由乳酸（丙交酯）和ε-己内酯作为重复单元组成，其中所述外科缝合线的收缩率在60℃热处理后为5％以下 C.20小时及其生产方法。

公开(公告)号：US5096559A

公开(公告)日：1992-03-17

申请号：US548572

申请日：1990-07-05

申请人： Ikuo Sasaki ,  Shoji Murakami ,  Koji Abe ,  Kenichi Onishi

发明人： Ikuo Sasaki ,  Shoji Murakami ,  Koji Abe ,  Kenichi Onishi

IPC分类号： C25D7/12 ,  B23H9/00 ,  B23K1/20 ,  C25D17/10 ,  C25D17/12 ,  H01L21/50 ,  H05K13/00

CPC分类号： H05K13/0084 ,  B23H9/00 ,  B23K1/20 ,  C25D17/005 ,  C25D7/0657 ,  Y10T29/53104

摘要： A cathode roller mechanism comprises a tapered cathode roller for establishing an electrical connection to a semiconductor lead frame and an elastic, frictional pressure roller. The cathode roller comprises a tapered roller body defining a tapered side surface and an electrically conductive stopper disposed on the roller body and having an inner tapered electrode. The pressure roller is arranged so that the path of a drifted lead frame can be corrected, and the drift of the lead frame can be positively prevented by pressing the lead frame in such a manner that no drift of the lead frame occurs. In addition, an auxiliary electrode is provided on the inside of the tapered electrode, a third tapered surface is provided on the auxiliary electrode, and the width of the pressure roller is set to a length sufficient to press a corner of a molded portion of lead frame having the maximum width so that electrical continuity, i.e., the connection between the lead frame and the electrode, can be stabilized, and the lead frame can be more stably made a cathode.

摘要翻译： 阴极辊机构包括用于建立与半导体引线框架和弹性摩擦压力辊的电连接的锥形阴极辊。 阴极辊包括限定锥形侧表面的圆锥滚子体和设置在辊体上并具有内锥形电极的导电止动件。 加压辊被布置成使得可以校正漂移的引线框架的路径，并且可以通过按照引导框架的漂移不发生的方式按压引线框架来可靠地防止引线框架的漂移。 此外，在锥形电极的内侧设置有辅助电极，在辅助电极上设置有第三锥形面，将压力辊的宽度设定为足以按压铅的成型部分的角部的长度 具有最大宽度的框架，使得电连续性，即引线框架和电极之间的连接能够被稳定，并且引线框架可以更稳定地形成阴极。

公开(公告)号：US06616687B1

公开(公告)日：2003-09-09

申请号：US09830509

申请日：2001-04-26

申请人： Kenji Tomihata ,  Masakazu Suzuki ,  Ikuo Sasaki

发明人： Kenji Tomihata ,  Masakazu Suzuki ,  Ikuo Sasaki

IPC分类号： A61B1704

CPC分类号： A61L17/145 ,  C08L67/04

摘要： The present invention relates to a coating material for surgical sutures which comprises as essential ingredients a copolymer having repeating units of lactic acid and &egr;-caprolacton and calcium stearate; and a surgical suture comprising a lactic acid/&egr;-caprolacton copoymer in which a lactide/&egr;-caprolacton ratio is (70-85 mol %)/(30-15 mol %) and the number of &egr;-caprolacton repeating unit is 2.5 or greater on the average.

摘要翻译： 本发明涉及用于外科缝合线的涂层材料，其包括作为必要成分的具有乳酸和ε-己内酯和硬脂酸钙重复单元的共聚物; 和包含乳酸/ε-己内酯共聚物的外科缝合线，其中丙交酯/ε-己内酯比为（70-85mol％）/（30-15mol％），ε-己内酯重复单元的数量为2.5或 平均更大。

公开(公告)号：US5050837A

公开(公告)日：1991-09-24

申请号：US498741

申请日：1990-03-23

申请人： Masaaki Hamada ,  Yoshio Iida ,  Motohiro Katayama ,  Ikuo Sasaki

发明人： Masaaki Hamada ,  Yoshio Iida ,  Motohiro Katayama ,  Ikuo Sasaki

IPC分类号： F01N13/08 ,  B60K13/04 ,  F01N13/18 ,  F16F15/08 ,  F16L3/16

CPC分类号： F01N13/1822 ,  B60K13/04 ,  F16L3/16

摘要： An elliptical-shaped, plate type muffler holding member made of an elastic material having the structure of: a first holding part having a first through hole into which a supporting member of an automotive body side is to be inserted, a second holding part formed with a space between the first holding part and having a second through hole into which a supporting member of a muffler side is to be inserted, a pair of side parts connecting the first holding part and the second holding part at the both sides thereof, and a center connecting part positioned in the space between the first and second holding parts and integrally connected to each side part at the central portion thereof. According to the present invention, the muffler holding member has the center connecting part made of an elastic material and therefore, tensile and compression stresses are working in the center connecting part. In effect, the muffler holding member of the present invention is capable of lowering vibration transmissibility in any frequency level up to 800Hz required to an automobile.

公开(公告)号：US4818204A

公开(公告)日：1989-04-04

申请号：US868590

申请日：1986-05-30

申请人： Osamu Nakagawa ,  Koji Yanagitani ,  Ikuo Sasaki ,  Toshinobu Banjo

发明人： Osamu Nakagawa ,  Koji Yanagitani ,  Ikuo Sasaki ,  Toshinobu Banjo

IPC分类号： H01L21/56 ,  B29C45/02 ,  B29C45/14 ,  B29C45/26 ,  B29C45/27 ,  B29K101/10 ,  B29L31/34 ,  B29C39/10

CPC分类号： B29C45/2701

摘要： A metal mold for plastic molding a semiconductor device by a transfer-molding method with the use of thermo-hardening plastics. The mold includes a pot section into which plastic is injected; a cavity section where a product is formed; a runner section constituting a path for the plastic from the pot section to the cavity section; a gate section provided between the runner section and the cavity section so as to reduce the cross-sectional area for the flow of the plastic which flows therethrough from the runner section to the cavity section; and a flow restrictor section provided in the path of the runner section so as to reduce the cross-sectional area of the flow of plastic.

摘要翻译： 一种金属模具，用于通过使用热硬化塑料的转印模塑法塑性模制半导体器件。 模具包括注入塑料的锅部分; 形成产品的空腔部分; 流道部，其构成从所述罐部到所述空腔部的所述塑料的路径; 设置在所述流道部分和所述空腔部分之间的门部分，以便减少从所述流道部分流到所述空腔部分的流过所述塑料的流动的横截面面积; 以及限流器部分，设置在流道部分的路径中，以便减小塑料流动的横截面积。

公开(公告)号：US4908178A

公开(公告)日：1990-03-13

申请号：US296647

申请日：1989-01-11

申请人： Osamu Nakagawa ,  Koji Yanagitani ,  Ikuo Sasaki ,  Toshinobu Banjo

发明人： Osamu Nakagawa ,  Koji Yanagitani ,  Ikuo Sasaki ,  Toshinobu Banjo

IPC分类号： H01L21/56 ,  B29C45/02 ,  B29C45/14 ,  B29C45/26 ,  B29C45/27 ,  B29K101/10 ,  B29L31/34

CPC分类号： B29C45/2701

摘要： A metal mold for plastic molding a semiconductor device by a transfer-molding method with the use of thermo-hardening plastics. The mold includes a pot section into which plastic is injected; a cavity section where a product is formed; a runner section constituting a path for the plastic from the pot section to the cavity section; a gate section provided between the runner section and the cavity section so as to reduce the cross-sectional area for the flow of the plastic which flows therethrough from the runner section to the cavity section; a flow restriction section provided in the path of the runner section so as to reduce the cross-sectional area of the flow of plastic.