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公开(公告)号：US20110269732A1
公开(公告)日：2011-11-03
申请号：US12595878
申请日：2009-10-14
申请人： Julian M.C. GOLEC , John POLLARD , James WESTCOTT , Hayley Marie BINCH , Michael Paul MORTIMORE , Daniel David ROBINSON
发明人： Julian M.C. GOLEC , John POLLARD , James WESTCOTT , Hayley Marie BINCH , Michael Paul MORTIMORE , Daniel David ROBINSON
IPC分类号： A61K31/397 , A61K31/506 , C07D403/14 , A61K31/496 , G06G7/58 , A61P35/02 , A61P35/04 , C12N9/99 , C12Q1/48 , C07D401/14 , A61P35/00
CPC分类号： C07D403/12 , A61K31/506 , A61K45/06 , C07D401/14 , C12Q1/485 , G01N2500/04 , G16B15/00
摘要： The present invention relates to drug discovery methods, particularly methods for assaying compounds for activity as Aurora kinase inhibitors. This invention also relates to a pharmacophore describing compounds that are able to promote a conformational change in the protein AuroraB and whose binding constant for the two-step process is given as Ki*. Finally, this invention also relates to compounds having the features of the pharmacophore.
摘要翻译： 本发明涉及药物发现方法，特别是用于测定化合物作为极光激酶抑制剂的活性的方法。 本发明还涉及描述能够促进蛋白质AuroraB中的构象变化的化合物的药效团，其两步法的结合常数以Ki *给出。 最后，本发明还涉及具有药效团特征的化合物。
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2.发明授权Universal tool for uniformly applying a force to a plurality of components on a circuit board 失效用于对电路板上的多个部件均匀施加力的通用工具
公开(公告)号：US6141866A
公开(公告)日：2000-11-07
申请号：US30447
申请日：1998-02-25
CPC分类号： H05K13/046 , H01L21/4882 , Y10S269/903 , Y10T29/4913 , Y10T29/53057 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A multiple force tool for applying pressure to circuit components during a manufacturing operation. A plurality of compressed air pressure cylinders are supported on a plurality of horizontal arms over a circuit board. A pressure foot of each compressed air pressure cylinder is extendable when an air controller foot switch is depressed. Positioning of each of the cylinders is afforded along two axes, so that the cylinders may be positioned over components which are to be pressed against the circuit board. Heat sinks may be pressed against components located on the circuit board to bond the heat sinks to the components.
摘要翻译： 用于在制造操作期间向电路部件施加压力的多重力工具。 多个压缩空气压力缸被支撑在电路板上的多个水平臂上。 当压缩空气控制器脚踏开关时，每个压缩空气压力缸的压脚可以延伸。 沿着两个轴提供每个气缸的定位，使得气缸可以定位在要抵靠电路板的部件上。 散热器可以压在位于电路板上的部件上，以将散热片粘接到部件上。
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公开(公告)号：US08268818B2
公开(公告)日：2012-09-18
申请号：US12438995
申请日：2007-09-04
申请人： Tiansheng Wang , Jeremy Green , Brian Ledford , François Maltais , Andreas P. Termin , Mark Cornebise , Jonathan Parsons , Adam Tanner , James Westcott
发明人： Tiansheng Wang , Jeremy Green , Brian Ledford , François Maltais , Andreas P. Termin , Mark Cornebise , Jonathan Parsons , Adam Tanner , James Westcott
IPC分类号： A61K31/427 , A61K31/454 , A61K31/495 , A61K31/497 , C07D413/14 , C07D405/14 , C07D277/44
CPC分类号： C07D417/04
摘要： The present invention relates to compounds useful as inhibitors of PI3K, particularly of PI3Kγ. The invention also provides pharmaceutically acceptable compositions comprising said compounds and methods of using the compositions in the treatment of various disease, conditions, or disorders.
摘要翻译： 本发明涉及可用作PI3K抑制剂，特别是PI3Kγ的化合物。 本发明还提供包含所述化合物的药学上可接受的组合物和使用该组合物治疗各种疾病，病症或病症的方法。
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4.发明授权Universal tool for uniformly applying a force to a plurality of components on a circuit board 失效用于对电路板上的多个部件均匀施加力的通用工具公开(公告)号：US07150096B1
公开(公告)日：2006-12-19
申请号：US09619701
申请日：2000-07-19
CPC分类号： H05K13/046 , H01L21/4882 , Y10S269/903 , Y10T29/4913 , Y10T29/53057 , Y10T29/53174 , Y10T29/53178 , Y10T29/53191
摘要： A method for applying pressure to circuit components during a manufacturing operation. The method utilizes a plurality of compressed air pressure cylinders which are supported on a plurality of horizontal arms along different axes over a circuit board. Compressed air is supplied simultaneously to each of the cylinders, and the cylinders force the component onto a bonding position on the circuit board. The method permits heat sinks to be pressed against components located on the circuit board to bond the heat sinks to the components.
摘要翻译： 一种在制造操作期间向电路部件施加压力的方法。 该方法利用多个压缩空气压力缸，其在电路板上沿着不同的轴被支撑在多个水平臂上。 压缩空气同时供给到每个气缸，并且气缸将部件压在电路板上的接合位置。 该方法允许将散热器压在位于电路板上的部件上，以将散热片连接到部件上。
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