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12 条记录 (耗时 0.013 秒)

    Transfer fluxing method and apparatus for component placement on substrate
    1.
    发明授权
    Transfer fluxing method and apparatus for component placement on substrate 失效
    用于组件放置在衬底上的转移助熔方法和装置

    公开(公告)号：US06471117B1

    公开(公告)日：2002-10-29

    申请号：US09434576

    申请日：1999-11-04

    申请人： John Gillette Davis ,  Allen Thomas Mays ,  Kris Allen Slesinger

    发明人： John Gillette Davis ,  Allen Thomas Mays ,  Kris Allen Slesinger

    IPC分类号： B23K120

    CPC分类号： B23K3/082

    摘要： A transfer fluxing apparatus is provided. The apparatus is a flux reservoir for holding flux, a compliant pad attached to an opening in the flux reservoir and a means for controlling deposition of flux onto the compliant pad. The apparatus can be attached to an automated component placement machine. In the preferred embodiment of the invention, the control means is a valve located within the flux reservoir. The valve is opened by applying pressure to a plunger that extends through the compliant pad. When the plunger is pressed, the valve opens, and flux falls onto the compliant pad. Flux then passes through the pad to a component placement site. A method for automated fluxing and to component placement also is provided.

    摘要翻译： 提供了一种转移助熔设备。 该装置是用于保持焊剂的助焊剂储存器，附接到助熔剂储存器中的开口的顺应性垫，以及用于控制助熔剂在顺应性垫上沉积的装置。 该装置可以附接到自动化部件放置机器上。 在本发明的优选实施例中，控制装置是位于通量储存器内的阀。 通过向穿过柔性垫的柱塞施加压力来打开阀。 当柱塞被按压时，阀打开，并且助焊剂落到柔性垫上。 然后，焊剂通过焊盘到组件放置位置。 还提供了一种用于自动熔化和部件放置的方法。

    Method and apparatus for soldering ball grid array modules to substrates
    2.
    发明授权
    Method and apparatus for soldering ball grid array modules to substrates 失效
    将球栅阵列模块焊接到基板的方法和装置

    公开(公告)号：US5924622A

    公开(公告)日：1999-07-20

    申请号：US683767

    申请日：1996-07-17

    申请人： John Gillette Davis ,  Joseph Michael Kielbasa

    发明人： John Gillette Davis ,  Joseph Michael Kielbasa

    IPC分类号： H01L21/60 ,  B23K3/06 ,  B23K35/02 ,  B23K35/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  B23K1/00 ,  B23K3/00

    CPC分类号： H05K3/321 ,  B23K3/0623 ,  B23K3/0638 ,  H05K3/3436 ,  H05K3/3484 ,  B23K2201/42 ,  B23K35/025 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0485 ,  H05K3/3478 ,  Y02P70/613 ,  Y10T156/10

    摘要： A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240.degree. C. and in the case of the conduction adhesive, will cure below about 240.degree. C. In the case of solid solder, thin films of flux material can be applied to opposite faces of the preform to prevent the solder from dislodging therefrom and to act as a flux when the solder is reflowed.

    摘要翻译： 提供了一种用于将具有焊接材料的球栅阵列或列格栅阵列的模块附接到以给定图案或覆盖区布置的模块的方法和装置，其具有以相同图案排列的连接器焊盘阵列的基板。 预成型的对准装置具有与模块上的球栅阵列或列图案相同的图案或覆盖区中的通孔阵列，以及衬底上的接触焊盘图案。 预制件中的通孔填充有可以是焊膏或固体焊料或可固化导电粘合剂的焊料材料。 焊料优选是铅锡共晶体，但是在任何情况下都具有小于约240℃的熔点，并且在导电粘合剂的情况下，将在低于约240℃下固化。在固体焊料的情况下， 焊剂材料的薄膜可以施加到预成型件的相对面上，以防止焊料从其中移出，并且当焊料回流时用作焊剂。

    Method and apparatus for soldering ball grid array modules to substrates
    7.
    发明授权
    Method and apparatus for soldering ball grid array modules to substrates 失效

    公开(公告)号：US06196444B1

    公开(公告)日：2001-03-06

    申请号：US09280467

    申请日：1999-03-30

    申请人： John Gillette Davis ,  Joseph Michael Kielbasa

    发明人： John Gillette Davis ,  Joseph Michael Kielbasa

    IPC分类号： B23K3102

    CPC分类号： H05K3/321 ,  B23K3/0623 ,  B23K3/0638 ,  B23K35/025 ,  B23K2101/42 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0485 ,  Y02P70/613 ,  Y10T156/10

    摘要： A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240° C. and in the case of the conduction adhesive, will cure below about 240° C. The preform with the filled through holes is interposed between the module and the substrate with the material in the holes in contact with the solder balls or columns and the contact pads. Heat is applied to reflow the solder or cure the adhesive in the holes to join the module to the substrate. Depending upon the composition of the solder of the balls or columns, they might or might not melt. In the case of solid solder, thin films of flux material can be applied to opposite faces of the preform to prevent the solder from dislodging therefrom and to act as a flux when the solder is reflowed.

    Method and apparatus for soldering ball grid array modules to substrates
    10.
    发明授权
    Method and apparatus for soldering ball grid array modules to substrates 失效

    公开(公告)号：US06296173B2

    公开(公告)日：2001-10-02

    申请号：US09753876

    申请日：2001-01-03

    申请人： John Gillette Davis ,  Joseph Michael Kielbasa

    发明人： John Gillette Davis ,  Joseph Michael Kielbasa

    IPC分类号： B23K3102

    CPC分类号： H05K3/321 ,  B23K3/0623 ,  B23K3/0638 ,  B23K35/025 ,  B23K2101/42 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0485 ,  Y02P70/613 ,  Y10T156/10

    摘要： A method and device for attaching a module having a ball grid array or column grid array of solder material thereon arranged in a given pattern or footprint to a substrate having an array of connector pads arranged in the same pattern is provided. A preformed alignment device has an array of through holes therein aligned in the same pattern or footprint as the ball grid array or column pattern on the module and the pattern of contact pads on the substrate. The through holes in the preform are filled with a solder material which can be either a solder paste or a solid solder or with a curable conductive adhesive. The solder preferably is a lead-tin eutectic, but in any event has a melting point of less than about 240° C. and in the case of the conduction adhesive, will cure below about 240° C. The preform with the filled through holes is interposed between the module and the substrate with the material in the holes in contact with the solder balls or columns and the contact pads. Heat is applied to reflow the solder or cure the adhesive in the holes to join the module to the substrate. Depending upon the composition of the solder of the balls or columns, they might or might not melt. In the case of solid solder, thin films of flux material can be applied to opposite faces of the preform to prevent the solder from dislodging therefrom and to act as a flux when the solder is reflowed.