公开(公告)号：US5877556A

公开(公告)日：1999-03-02

申请号：US814645

申请日：1997-03-10

申请人： Jen-Huang Jeng ,  T. E. Hsieh

发明人： Jen-Huang Jeng ,  T. E. Hsieh

IPC分类号： H01L23/485 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14

摘要： A composite bump structure comprising a first metal layer, a polymer bump formed on the first metal layer, and a second metal layer covering the polymer bump and the first metal layer. The first metal layer is formed above an input/output pad on an integrated circuit element. The polymer bump is positioned substantially off the center of the input/output pad. An open area next to the polymer bump above the input/output pad is established for probing test. The open area having the first and second metal layers and the input/output pad underneath can provide good testability.

摘要翻译： 一种复合凸块结构，包括第一金属层，形成在第一金属层上的聚合物凸块和覆盖聚合物凸块的第二金属层和第一金属层。 第一金属层形成在集成电路元件上的输入/输出焊盘上方。 聚合物凸块基本上位于输入/输出垫的中心。 在输入/输出焊盘上方的聚合物凸块旁边的开放区域建立用于探测测试。 具有第一和第二金属层的开口区域和下面的输入/输出垫可以提供良好的可测试性。

公开(公告)号：US6024274A

公开(公告)日：2000-02-15

申请号：US627134

申请日：1996-04-03

申请人： Shyh-Ming Chang ,  Shyuan-Jeng Ho ,  Yu-Chi Lee ,  Jen-Huang Jeng ,  Pao-Yun Tang ,  Su-Yu Fang

发明人： Shyh-Ming Chang ,  Shyuan-Jeng Ho ,  Yu-Chi Lee ,  Jen-Huang Jeng ,  Pao-Yun Tang ,  Su-Yu Fang

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/86 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/13624 ,  H01L2224/13655 ,  H01L2224/13666 ,  H01L2224/13671 ,  H01L2224/13684 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14

摘要： A tape automated bonding (TAB) process in which a tape-carrier through its finger leads is bonded to composite bumps on an IC chip wherein the composite bumps are constructed by a polymeric material layer and at least one metal layer. The polymeric material layer has a lower rigidity (or a lower Young's modules) than those of the metal layers. Structural damages during the bonding process that is frequently caused by a rigid metal bump is eliminated. The TAB bonding process can be carried out by using either an all-metal lead frame, a plated metal lead frame, or a polymer reinforced metal lead frame. The polymer/metal composite bumps constructed on the IC chip require a smaller bonding force when bonded in a thermal bonder.

摘要翻译： 通过其手指引线的带状载体被结合到IC芯片上的复合凸块的胶带自动粘合（TAB）工艺，其中复合凸块由聚合材料层和至少一个金属层构成。 聚合材料层具有比金属层低的刚性（或较低的杨氏模量）。 消除了由刚性金属凸块经常引起的接合过程中的结构损坏。 TAB接合工艺可以通过使用全金属引线框架，电镀金属引线框架或聚合物强化金属引线框架来进行。 构成在IC芯片上的聚合物/金属复合凸块在热粘合剂中粘合时需要较小的粘结力。

公开(公告)号：US5412997A

公开(公告)日：1995-05-09

申请号：US989603

申请日：1992-12-11

申请人： Dyi-Chung Hu ,  Jen-Huang Jeng

发明人： Dyi-Chung Hu ,  Jen-Huang Jeng

IPC分类号： G01N3/00 ,  G01N19/04 ,  G01N3/08

CPC分类号： G01N19/04 ,  G01N2203/0296

摘要： The present invention comprises a test system for non-destructively testing the attachment strength of a plurality of electric wires each connected to a corresponding input/output (I/O) port in an integrated circuit (IC) dice. The test system comprises a test bench for placing said integrated circuit dice thereon. The test system further comprises a force asserting means including a testing pin for asserting a controlled amount of pressing force along a predefined direction to each of the electric wires near said corresponding I/O ports on said IC dice. The test system also includes a control means including a testing arm connecting to the testing pin for controlling and positioning the testing pin to apply the controlled amount of force to each of the electric wires. The control means further includes a force measurement means for measuring the amount of force applied to each of the electric wires. The control means further comprising a positioning means which includes a plurality of stepping motors for adjusting the position of the testing arm. A test computer is connected to the control means to control the control means whereby the testing processes are performed in an automated manner.

摘要翻译： 本发明包括用于非破坏性地测试多个电线的连接强度的测试系统，每个电线连接到集成电路（IC）芯片中的对应的输入/输出（I / O）端口。 测试系统包括用于将所述集成电路晶片放置在其上的测试台。 该测试系统还包括一个力确定装置，该力确定装置包括测试销，该测试销用于将所控制的按预定方向的按压力量确定到所述IC芯片上所述相应I / O端口附近的每根电线。 测试系统还包括控制装置，该控制装置包括连接到测试销的测试臂，用于控制和定位测试销，以将控制的力施加到每个电线。 控制装置还包括用于测量施加到每根电线的力的量的力测量装置。 该控制装置还包括定位装置，该定位装置包括用于调节测试臂位置的多个步进马达。 测试计算机连接到控制装置以控制控制装置，由此以自动方式执行测试过程。

公开(公告)号：US5127573A

公开(公告)日：1992-07-07

申请号：US703873

申请日：1991-05-22

申请人： Shyh-Ming Chang ,  Jen-Huang Jeng

发明人： Shyh-Ming Chang ,  Jen-Huang Jeng

IPC分类号： B29C65/00 ,  H01L21/00

CPC分类号： H01L21/67132 ,  B29C66/8163

摘要： An improveent in a Tape Automated Bonding (TAB) apparatus wherein a support for the device being bonded to a tape, or film carrier, is provided that will automatically adjust the position of the device supported thereon to conform to the bonding surface of the thermode. The support of the invention has a central member that provides for swivelling and a second member that prevents relative rotation.

摘要翻译： 磁带自动接合（TAB）设备的改进在于其中提供了粘合到带或胶片载体上的装置的支撑件，其将自动地调节支撑在其上的装置的位置以符合热敏电极的接合表面。 本发明的支撑件具有提供旋转的中心构件和防止相对旋转的第二构件。