Semiconductor device having a channel layer and method of manufacturing the same
    1.
    发明申请
    Semiconductor device having a channel layer and method of manufacturing the same 审中-公开
    具有沟道层的半导体器件及其制造方法

    公开(公告)号:US20050263795A1

    公开(公告)日:2005-12-01

    申请号:US11137608

    申请日:2005-05-24

    摘要: In a method of forming a semiconductor device having an improved channel layer, the channel layer is formed on a surface of a semiconductor substrate and comprises a material of high carrier mobility such as silicon germanium (SiGe), germanium (Ge) and silicon carbide (SiC) using a selective epitaxial growth process. A gate insulation layer and a gate electrode are formed on the channel layer. Accordingly, a driving current of the semiconductor device increases to thereby improve operation characteristics.

    摘要翻译: 在形成具有改进的沟道层的半导体器件的方法中,沟道层形成在半导体衬底的表面上,并且包括诸如硅锗(SiGe),锗(Ge)和碳化硅的高载流子迁移率的材料 SiC),使用选择性外延生长工艺。 栅极绝缘层和栅电极形成在沟道层上。 因此,半导体器件的驱动电流增加,从而改善操作特性。