公开(公告)号：US20130045558A1

公开(公告)日：2013-02-21

申请号：US13580241

申请日：2011-02-22

申请人： Joerg Palm ,  Stephan Pohlner ,  Stefan Jost ,  Thomas Happ

发明人： Joerg Palm ,  Stephan Pohlner ,  Stefan Jost ,  Thomas Happ

IPC分类号： H01L31/18

CPC分类号： H01L31/18 ,  C23C14/0617 ,  C23C14/0623 ,  C23C14/54 ,  C23C14/564 ,  C23C16/4412 ,  C30B23/005 ,  C30B29/48

摘要： A device for depositing a layer containing at least two components on an object, including: a deposition chamber; a source containing a material to be deposited; and a control device, which controls the deposition process, implemented such that a concentration of the component of the material can be modified in its gas phase prior to deposition on the object by selective binding a specified quantity of the component, wherein the selectively bound quantity of the component is controlled by modifying a control parameter that is actively coupled to a binding rate or the component, and wherein the control device contains a gettering element containing a reactive material containing copper and/or molybdenum. Also, a method for depositing a layer containing at least two components on an object, wherein a selectively bound quantity of a component is controlled by modifying a binding rate of the component of the control device.

摘要翻译： 一种用于在物体上沉积包含至少两个组分的层的装置，包括：沉积室; 含有待沉积材料的来源; 以及控制装置，其控制沉积过程，其被实施为使得在通过选择性地结合指定量的组分之前，在沉积到物体上之前，可以在其气相中改变材料成分的浓度，其中选择性结合量 通过修改主动耦合到结合速率或部件的控制参数来控制部件，并且其中控制装置包含含有含有铜和/或钼的反应性材料的吸杂元件。 另外，一种用于在物体上沉积含有至少两种成分的层的方法，其中通过改变控制装置的部件的结合速率来控制选择性限制量的部件。

公开(公告)号：US09352431B2

公开(公告)日：2016-05-31

申请号：US13580322

申请日：2011-02-22

申请人： Joerg Palm ,  Stefan Jost ,  Martin Fuerfanger ,  Jessica Hartwich

发明人： Joerg Palm ,  Stefan Jost ,  Martin Fuerfanger ,  Jessica Hartwich

IPC分类号： B23Q3/00 ,  C23C16/458 ,  H01L21/67 ,  H01L21/673 ,  H01L31/18

CPC分类号： B23Q3/00 ,  C23C16/4582 ,  H01L21/67109 ,  H01L21/67346 ,  H01L21/67353 ,  H01L21/67383 ,  H01L31/1876 ,  Y02E10/50 ,  Y02P70/521 ,  Y10T29/49998

摘要： A device for forming a reduced chamber space, which is a process box or a process hood, containing an apparatus, which positions at least two multilayer bodies each including a surface to be processed, wherein the apparatus is designed such that the multilayer bodies are opposite to each other, wherein the surfaces to be processed are facing away from each other such that the multilayer bodies can be processed as a multilayer body arrangement in a processing system. In addition, a method for positioning the two multilayer bodies comprising a surface to be processed, with the two multilayer bodies disposed in such a device such that multilayer bodies are opposite each other, wherein the surfaces to be processed are facing away from each other, such that the multilayer bodies are processable as a multilayer body arrangement in a processing system.

摘要翻译： 一种用于形成减压室空间的装置，其是包含装置的处理箱或加工罩，所述装置定位至少两个包括待处理表面的多层体，其中，所述装置被设计成使得所述多层体相对 其中待处理的表面彼此背离，使得多层体可以在处理系统中作为多层体排列处理。 另外，一种用于定位包括待处理表面的两个多层体的方法，其中两个多层体设置在这种装置中，使得多层体彼此相对，其中待处理的表面彼此背离， 使得多层体在处理系统中可作为多层体排列。

公开(公告)号：US20130029479A1

公开(公告)日：2013-01-31

申请号：US13580383

申请日：2011-02-22

申请人： Stefan Jost ,  Joerg Palm ,  Martin Fuerfanger

发明人： Stefan Jost ,  Joerg Palm ,  Martin Fuerfanger

IPC分类号： B05C9/14 ,  H01L21/205

CPC分类号： H01L21/67346 ,  C23C16/4583 ,  H01L21/67109 ,  H01L21/67353 ,  H01L21/67383 ,  H01L31/0322 ,  H01L31/1876 ,  Y02E10/541 ,  Y02P70/521

摘要： The invention relates to a multilayer body arrangement, which comprises at least two multilayer bodies each having at least one surface to be processed as well as at least one device for positioning the multilayer bodies, wherein the device is configured such that the respective surfaces to be processed are opposite each other and thus form a quasi-closed processing space disposed between the surfaces, in which the processing occurs. It further relates to a system for processing multilayer bodies with such a multilayer body arrangement, as well as a method for processing multilayer bodies, wherein the multilayer bodies are disposed such that the respective surfaces to be processed are opposite each other and thus form a quasi-closed processing space disposed between the surfaces, in which the processing occurs.

摘要翻译： 本发明涉及一种多层体装置，其包括至少两个多层体，每个至少一个多层体具有至少一个要加工的表面以及至少一个用于定位多层体的装置，其中该装置构造成使得各个表面为 处理的物体彼此相对，从而形成设置在处理发生的表面之间的准封闭处理空间。 本发明还涉及一种用于处理具有这种多层体结构的多层体的系统，以及一种用于处理多层体的方法，其中多层体被设置成使得待处理的各个表面彼此相对，从而形成准 封闭的处理空间设置在处理发生的表面之间。

公开(公告)号：US09236282B2

公开(公告)日：2016-01-12

申请号：US13580383

申请日：2011-02-22

申请人： Stefan Jost ,  Joerg Palm ,  Martin Fuerfanger

发明人： Stefan Jost ,  Joerg Palm ,  Martin Fuerfanger

IPC分类号： H01L21/00 ,  H01L21/673 ,  C23C16/458 ,  H01L21/67 ,  H01L31/032 ,  H01L31/18

CPC分类号： H01L21/67346 ,  C23C16/4583 ,  H01L21/67109 ,  H01L21/67353 ,  H01L21/67383 ,  H01L31/0322 ,  H01L31/1876 ,  Y02E10/541 ,  Y02P70/521

摘要： The invention relates to a multilayer body arrangement, which comprises at least two multilayer bodies each having at least one surface to be processed as well as at least one device for positioning the multilayer bodies, wherein the device is configured such that the respective surfaces to be processed are opposite each other and thus form a quasi-closed processing space disposed between the surfaces, in which the processing occurs. It further relates to a system for processing multilayer bodies with such a multilayer body arrangement, as well as a method for processing multilayer bodies, wherein the multilayer bodies are disposed such that the respective surfaces to be processed are opposite each other and thus form a quasi-closed processing space disposed between the surfaces, in which the processing occurs.

摘要翻译： 本发明涉及一种多层体装置，其包括至少两个多层体，每个至少一个多层体具有至少一个要加工的表面以及至少一个用于定位多层体的装置，其中该装置构造成使得各个表面为 处理的物体彼此相对，从而形成设置在处理发生的表面之间的准封闭处理空间。 本发明还涉及一种用于处理具有这种多层体结构的多层体的系统，以及一种用于处理多层体的方法，其中多层体被设置成使得待处理的各个表面彼此相对，从而形成准 封闭的处理空间设置在处理发生的表面之间。

公开(公告)号：US20130067723A1

公开(公告)日：2013-03-21

申请号：US13580322

申请日：2011-02-22

申请人： Joerg Palm ,  Stefan Jost ,  Martin Fuerfanger ,  Jessica Hartwich

发明人： Joerg Palm ,  Stefan Jost ,  Martin Fuerfanger ,  Jessica Hartwich

IPC分类号： B23Q3/00

CPC分类号： B23Q3/00 ,  C23C16/4582 ,  H01L21/67109 ,  H01L21/67346 ,  H01L21/67353 ,  H01L21/67383 ,  H01L31/1876 ,  Y02E10/50 ,  Y02P70/521 ,  Y10T29/49998

摘要： A device for forming a reduced chamber space, which is a process box or a process hood, containing an apparatus, which positions at least two multilayer bodies each including a surface to be processed, wherein the apparatus is designed such that the multilayer bodies are opposite to each other, wherein the surfaces to be processed are facing away from each other such that the multilayer bodies can be processed as a multilayer body arrangement in a processing system. In addition, a method for positioning the two multilayer bodies comprising a surface to be processed, with the two multilayer bodies disposed in such a device such that multilayer bodies are opposite each other, wherein the surfaces to be processed are facing away from each other, such that the multilayer bodies are processable as a multilayer body arrangement in a processing system.

摘要翻译： 一种用于形成减压室空间的装置，其是包含装置的处理箱或加工罩，所述装置定位至少两个包括待处理表面的多层体，其中，所述装置被设计成使得所述多层体相对 其中待处理的表面彼此背离，使得多层体可以在处理系统中作为多层体排列处理。 另外，一种用于定位包括待处理表面的两个多层体的方法，其中两个多层体设置在这种装置中，使得多层体彼此相对，其中待处理的表面彼此背离， 使得多层体在处理系统中可作为多层体排列。