摘要:
The invention relates to a semiconductor device (10) with a substrate (11) and a semiconductor body (1) comprising a bipolar transistor with in that order a collector region (2), a base region (3), and an emitter region (4), wherein the semiconductor body comprises a projecting mesa (5) comprising at least a portion of the collector region (2) and the base region (3), which mesa is surrounded by an isolation region (6). According to the invention, the semiconductor device (10) also comprises a field effect transistor with a source region, a drain region, an interposed channel region, a superimposed gate dielectric (7), and a gate region (8), which gate region (8) forms a highest part of the field effect transistor, and the height of the mesa (5) is greater than the height of the gate region (8). This device can be manufactured inexpensively and easily by a method according to the invention, and the bipolar transistor can have excellent high-frequency characteristics.
摘要:
A method of fabricating a bipolar transistor in a first trench (11) is disclosed wherein only one photolithographic mask is applied which forms a first trench (11) and a second trench (12). A collector region (21) is formed self-aligned in the first trench (11) and the second trench (12). A base region (31) is formed self-aligned on a portion of the collector region (21), which is in the first trench (11). An emitter region (41) is formed self-aligned on a portion of the base region (31). A contact to the collector region (21) is formed in the second trench (12) and a contact to the base region (31) is formed in the first trench (11). The fabrication of the bipolar transistor may be integrated in a standard CMOS process.
摘要:
The invention relates to a method of manufacturing a semiconductor device (10) with a substrate (11) and a semiconductor body (12) which is provided with at least one bipolar transistor having an emitter region (1), a base region (2) and a collector region (3), wherein in the semiconductor body (12) a first semiconductor region (13) is formed that forms one (3) of the collector and emitter regions (1,3) and on the surface of the semiconductor body (12) a stack of layers is formed comprising a first insulating layer (4), a polycrystalline semiconductor layer (5) and a second insulating layer (6) in which stack an opening (7) is formed, after which by non-selective epitaxial growth a further semiconductor layer (22) is deposited of which a monocrystalline horizontal part on the bottom of the opening (7) forms the base region (2) and of which a polycrystalline vertical part (2A) on a side face of the opening (7) is connected to the polycrystalline semiconductor layer (5), after which spacers (S) are formed parallel to the side face of the opening (7) and a second semiconductor region (31) is formed between said spacers (S) forming the other one (1) of the emitter and collector regions (1,3). According to the invention the above method is characterized in that before the further semiconductor layer (22) is deposited, the second insulating layer (6) is provided with an end portion (6A) that viewed in projection overhangs an end portion (5A) of the underlying semiconductor layer (5). In this way bipolar transistor devices can be obtained with good high frequency properties in a cost effective manner.
摘要:
The invention provides a method for fabricating a heterojunction bipolar transistor with a base connecting region (23), which is formed self-aligned to a base region (7) without applying photolithographic techniques. Further, a collector connecting region (31) and an emitter region (29) are formed simultaneously and self-aligned to the base connecting region (23) without applying photolithographic techniques.
摘要:
Methods for manufacturing a bipolar transistor semiconductor device are described, along with devices fabricated in accordance with the methods. The methods include the steps of forming a stack of layers over a semiconductor body comprising a window definition layer (18,38), a layer (20) of semiconductor material, a first insulating layer (22), and a second insulating layer (24) which is selectively etchable with respect to the first insulating layer. A trench (26) is then etched into the stack down to the window definition layer. The portion of the trench extending through the second insulating layer is widened to form a wider trench portion (28) therethrough. A window (36) is defined in the window definition layer which is aligned with the wider trench portion, and serves to define the base-collector or base-emitter junction in the finished device.
摘要:
A semiconductor device (10) comprising a bipolar transistor and a field effect transistor within a semiconductor body (1) comprising a projecting mesa (5) within which are at least a portion of a collector region (22d and 22e) and a base region (33d) of the bipolar transistor. The bipolar transistor is provided with a first insulating cavity (92) provided in the collector region (22d and 22e). The base region (33d) is narrower in the plane of the substrate than the collector region (22d and 22e) due to a second insulating cavity (94) provided around the base region (33d) and between the collector region (22d and 22e) and the emitter region (4). By blocking diffusion from the base region the first insulating cavity (92) provides a reduction in the base collector capacitance and can be described as defining the base contact.