摘要:
A semiconductor device (10) comprising a bipolar transistor and a field effect transistor within a semiconductor body (1) comprising a projecting mesa (5) within which are at least a portion of a collector region (22d and 22e) and a base region (33d) of the bipolar transistor. The bipolar transistor is provided with a first insulating cavity (92) provided in the collector region (22d and 22e). The base region (33d) is narrower in the plane of the substrate than the collector region (22d and 22e) due to a second insulating cavity (94) provided around the base region (33d) and between the collector region (22d and 22e) and the emitter region (4). By blocking diffusion from the base region the first insulating cavity (92) provides a reduction in the base collector capacitance and can be described as defining the base contact.
摘要:
A semiconductor device (10) comprising a bipolar transistor and a field effect transistor within a semiconductor body (1) comprising a projecting mesa (5) within which are at least a portion of a collector region (22d and 22e) and a base region (33d) of the bipolar transistor. The bipolar transistor is provided with a first insulating cavity (92) provided in the collector region (22d and 22e). The base region (33d) is narrower in the plane of the substrate than the collector region (22d and 22e) due to a second insulating cavity (94) provided around the base region (33d) and between the collector region (22d and 22e) and the emitter region (4). By blocking diffusion from the base region the first insulating cavity (92) provides a reduction in the base collector capacitance and can be described as defining the base contact.
摘要:
A field effect transistor having a gate structure comprising a high-K dielectric layer, a gate electrode located on the high-K dielectric layer, and an interfacial layer located in between the high-K dielectric layer and a channel region of the field effect transistor. The interfacial layer comprises a layer of SiO2 containing a regrowth inhibiting agent. A method of forming the gate structure includes forming a gate stack comprising, in order: a SiO2 layer adjacent a channel region of the field effect transistor; a high-K dielectric layer on the SiO2 layer; and a gate electrode on the high-K dielectric layer. The method also includes introducing a regrowth inhibiting agent into the SiO2 layer and then annealing the gate structure. The presence of the regrowth inhibiting agent in the SiO2 interfacial layer inhibits regrowth of the SiO2 layer into the channel region during the annealing step.
摘要:
The invention relates to a semiconductor device (30) comprising a substrate (1), a semiconductor body (25) comprising a bipolar transistor that comprises a collector region (3), a base region (4), and an emitter region (15), wherein at least a portion of the collector region (3) is surrounded by a first isolation region (2, 8), the semiconductor body (25) further comprises an extrinsic base region (35) arranged in contacting manner to the base region (4). In this way, a fast semiconductor device with reduced impact of parasitic components is obtained.
摘要:
A tunnel field effect transistor and a method of making the same. The transistor includes a semiconductor substrate. The transistor also includes a gate located on a major surface of the substrate. The transistor further includes a drain of a first conductivity type. The transistor also includes a source of a second conductivity type extending beneath the gate. The source is separated from the gate by a channel region and a gate dielectric. The transistor is operable to allow charge carrier tunnelling from an inversion layer through an upper surface of the source.
摘要:
A tunnel field effect transistor and a method of making the same. The transistor includes a semiconductor substrate. The transistor also includes a gate located on a major surface of the substrate. The transistor further includes a drain of a first conductivity type. The transistor also includes a source of a second conductivity type extending beneath the gate. The source is separated from the gate by a channel region and a gate dielectric. The transistor is operable to allow charge carrier tunnelling from an inversion layer through an upper surface of the source.
摘要:
A field effect transistor having a gate structure comprising a high-K dielectric layer, a gate electrode located on the high-K dielectric layer, and an interfacial layer located in between the high-K dielectric layer and a channel region of the field effect transistor. The interfacial layer comprises a layer of SiO2 containing a regrowth inhibiting agent. A method of forming the gate structure includes forming a gate stack comprising, in order: a SiO2 layer adjacent a channel region of the field effect transistor; a high-K dielectric layer on the SiO2 layer; and a gate electrode on the high-K dielectric layer. The method also includes introducing a regrowth inhibiting agent into the SiO2 layer and then annealing the gate structure. The presence of the regrowth inhibiting agent in the SiO2 interfacial layer inhibits regrowth of the SiO2 layer into the channel region during the annealing step.
摘要:
The invention relates to a semiconductor device (30) comprising a substrate (1), a semiconductor body (25) comprising a bipolar transistor that comprises a collector region (3), a base region (4), and an emitter region (15), wherein at least a portion of the collector region (3) is surrounded by a first isolation region (2, 8), the semiconductor body (25) further comprises an extrinsic base region (35) arranged in contacting manner to the base region (4). In this way, a fast semiconductor device with reduced impact of parasitic components is obtained.
摘要:
A field effect transistor having a gate structure that comprises an interfacial layer positioned in between the transistor channel region and a high-K dielectric layer of the gate stack. The interfacial layer comprises AlxSiyOz, which has a higher relative dielectric constant value than SiO2. A method of forming the gate structure of a field effect transistor. The method includes forming a gate stack comprising, in order: a SiO2-based layer adjacent a channel region of the field effect transistor; a high-K dielectric layer on the SiO2-based layer; and a gate electrode on the high-K dielectric layer. The method also includes introducing Al into the SiO2-based layer to form an AlxSiyOz interfacial layer in between the high-K dielectric layer and the channel region. A heating step to allows Al introduced into channel region to diffuse out of the channel region into the interfacial layer.
摘要翻译:具有栅极结构的场效应晶体管包括位于晶体管沟道区域和栅极叠层的高K电介质层之间的界面层。 界面层包含Al x Se y O z,其比SiO 2具有更高的相对介电常数值。 一种形成场效应晶体管的栅极结构的方法。 该方法包括形成栅极堆叠,其顺序包括:与场效应晶体管的沟道区相邻的基于SiO 2的层; 在SiO 2基层上的高K电介质层; 以及在高K电介质层上的栅电极。 该方法还包括将Al引入SiO 2基层中以在高K电介质层和沟道区之间形成Al x Se y O z界面层。 加热步骤,允许引入通道区域的Al扩散到沟道区域内进入界面层。
摘要:
Disclosed is a sensor device (10) comprising a substrate (100) carrying a sensing element (110), and a metallization stack on said substrate for providing interconnections to said sensing element, the metallization stack comprising a plurality of patterned metal layers (130a-d) separated by insulating layers (120a-d), wherein a first metal layer (130c) comprises an electrode portion (16) conductively connected to the sensing element, and a further metal layer (130d) facing the first metal layer comprises a reference electrode portion (18), the electrode portion and the reference electrode portion being separated by a fluid channel (14) accessible from the top of the metallization stack. A method of manufacturing such a sensor device is also disclosed.