Semiconductor Device and Method of Manufacturing Such a Device
    1.
    发明申请
    Semiconductor Device and Method of Manufacturing Such a Device 有权
    半导体器件及其制造方法

    公开(公告)号:US20090166753A1

    公开(公告)日:2009-07-02

    申请号:US12304506

    申请日:2007-06-12

    IPC分类号: H01L27/06 H01L21/8249

    摘要: The invention relates to a semiconductor device (10) with a substrate (11) and a semiconductor body (1) comprising a bipolar transistor with in that order a collector region (2), a base region (3), and an emitter region (4), wherein the semiconductor body comprises a projecting mesa (5) comprising at least a portion of the collector region (2) and the base region (3), which mesa is surrounded by an isolation region (6). According to the invention, the semiconductor device (10) also comprises a field effect transistor with a source region, a drain region, an interposed channel region, a superimposed gate dielectric (7), and a gate region (8), which gate region (8) forms a highest part of the field effect transistor, and the height of the mesa (5) is greater than the height of the gate region (8). This device can be manufactured inexpensively and easily by a method according to the invention, and the bipolar transistor can have excellent high-frequency characteristics.

    摘要翻译: 本发明涉及具有基板(11)和半导体本体(1)的半导体器件(10),该半导体器件(1)包括双极晶体管,依次具有集电极区域(2),基极区域(3)和发射极区域 4),其中半导体主体包括包括集电极区域(2)和基极区域(3)的至少一部分的突出台面(5),该台面由隔离区域(6)包围。 根据本发明,半导体器件(10)还包括具有源极区域,漏极区域,插入沟道区域,叠加栅极电介质(7)和栅极区域(8)的场效应晶体管,该栅极区域 (8)形成场效应晶体管的最高部分,台面(5)的高度大于栅极区域(8)的高度。 该装置可以通过根据本发明的方法廉价且容易地制造,并且双极晶体管可以具有优异的高频特性。

    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED WITH SUCH A METHOD
    2.
    发明申请
    METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE OBTAINED WITH SUCH A METHOD 有权
    制造半导体器件的方法和采用这种方法获得的半导体器件

    公开(公告)号:US20100289022A1

    公开(公告)日:2010-11-18

    申请号:US12094303

    申请日:2006-10-29

    CPC分类号: H01L29/66242 H01L29/66287

    摘要: The invention relates to a method of manufacturing a semiconductor device (10) with a substrate (11) and a semiconductor body (12) which is provided with at least one bipolar transistor having an emitter region (1), a base region (2) and a collector region (3), wherein in the semiconductor body (12) a first semiconductor region (13) is formed that forms one (3) of the collector and emitter regions (1,3) and on the surface of the semiconductor body (12) a stack of layers is formed comprising a first insulating layer (4), a polycrystalline semiconductor layer (5) and a second insulating layer (6) in which stack an opening (7) is formed, after which by non-selective epitaxial growth a further semiconductor layer (22) is deposited of which a monocrystalline horizontal part on the bottom of the opening (7) forms the base region (2) and of which a polycrystalline vertical part (2A) on a side face of the opening (7) is connected to the polycrystalline semiconductor layer (5), after which spacers (S) are formed parallel to the side face of the opening (7) and a second semiconductor region (31) is formed between said spacers (S) forming the other one (1) of the emitter and collector regions (1,3). According to the invention the above method is characterized in that before the further semiconductor layer (22) is deposited, the second insulating layer (6) is provided with an end portion (6A) that viewed in projection overhangs an end portion (5A) of the underlying semiconductor layer (5). In this way bipolar transistor devices can be obtained with good high frequency properties in a cost effective manner.

    摘要翻译: 本发明涉及一种制造半导体器件(10)的方法,所述半导体器件(10)具有衬底(11)和半导体本体(12),所述半导体器件(12)具有至少一个具有发射极区域(1),基极区域(2) 和集电极区域(3),其中在所述半导体本体(12)中形成第一半导体区域(13),所述第一半导体区域形成所述集电极和发射极区域(1,3)中的一个(3)并且在所述半导体主体 (12)形成一叠层,其包括形成有开口(7)的第一绝缘层(4),多晶半导体层(5)和第二绝缘层(6),之后通过非选择性 外延生长沉积另外的半导体层(22),其中开口(7)的底部上的单晶水平部分形成基部区域(2),并且在该开口的侧面上具有多晶垂直部分(2A) (7)连接到多晶半导体层(5),之后是间隔 (S)形成为平行于开口(7)的侧面,并且在形成发射极和集电极区域(1,3)的另一个(1)的所述间隔物(S)之间形成第二半导体区域(31) )。 根据本发明,上述方法的特征在于,在沉积另外的半导体层(22)之前,第二绝缘层(6)设置有端部(6A),其从突出部分观察到突出部分 底层半导体层(5)。 以这种方式,可以以成本有效的方式获得具有良好高频特性的双极晶体管器件。

    Method of Fabricating a Bipolar Transistor
    3.
    发明申请
    Method of Fabricating a Bipolar Transistor 失效
    制造双极晶体管的方法

    公开(公告)号:US20080233688A1

    公开(公告)日:2008-09-25

    申请号:US11913049

    申请日:2006-04-24

    IPC分类号: H01L21/84 H01L21/331

    CPC分类号: H01L29/66272 H01L29/0821

    摘要: A method of fabricating a bipolar transistor in a first trench (11) is disclosed wherein only one photolithographic mask is applied which forms a first trench (11) and a second trench (12). A collector region (21) is formed self-aligned in the first trench (11) and the second trench (12). A base region (31) is formed self-aligned on a portion of the collector region (21), which is in the first trench (11). An emitter region (41) is formed self-aligned on a portion of the base region (31). A contact to the collector region (21) is formed in the second trench (12) and a contact to the base region (31) is formed in the first trench (11). The fabrication of the bipolar transistor may be integrated in a standard CMOS process.

    摘要翻译: 公开了在第一沟槽(11)中制造双极晶体管的方法,其中仅施加一个形成第一沟槽(11)和第二沟槽(12)的光刻掩模。 集电极区域(21)在第一沟槽(11)和第二沟槽(12)中自对准地形成。 基部区域(31)在位于第一沟槽(11)中的集电极区域(21)的一部分上自对准地形成。 发射极区域(41)在基极区域(31)的一部分上自对准地形成。 在所述第二沟槽(12)中形成与所述集电极区域(21)的接触,并且在所述第一沟槽(11)中形成与所述基极区域(31)的接触。 双极晶体管的制造可以集成在标准CMOS工艺中。

    Semiconductor device and method of manufacturing such a device
    4.
    发明授权
    Semiconductor device and method of manufacturing such a device 有权
    半导体装置及其制造方法

    公开(公告)号:US08373236B2

    公开(公告)日:2013-02-12

    申请号:US12304506

    申请日:2007-06-12

    IPC分类号: H01L27/06

    摘要: The invention relates to a semiconductor device (10) with a substrate (11) and a semiconductor body (1) comprising a bipolar transistor with in that order a collector region (2), a base region (3), and an emitter region (4), wherein the semiconductor body comprises a projecting mesa (5) comprising at least a portion of the collector region (2) and the base region (3), which mesa is surrounded by an isolation region (6). According to the invention, the semiconductor device (10) also comprises a field effect transistor with a source region, a drain region, an interposed channel region, a superimposed gate dielectric (7), and a gate region (8), which gate region (8) forms a highest part of the field effect transistor, and the height of the mesa (5) is greater than the height of the gate region (8). This device can be manufactured inexpensively and easily by a method according to the invention, and the bipolar transistor can have excellent high-frequency characteristics.

    摘要翻译: 本发明涉及具有基板(11)和半导体本体(1)的半导体器件(10),该半导体器件(1)包括双极晶体管,依次具有集电极区域(2),基极区域(3)和发射极区域 4),其中半导体主体包括包括集电极区域(2)和基极区域(3)的至少一部分的突出台面(5),该台面由隔离区域(6)包围。 根据本发明,半导体器件(10)还包括具有源极区域,漏极区域,插入沟道区域,叠加栅极电介质(7)和栅极区域(8)的场效应晶体管,该栅极区域 (8)形成场效应晶体管的最高部分,台面(5)的高度大于栅极区域(8)的高度。 该装置可以通过根据本发明的方法廉价且容易地制造,并且双极晶体管可以具有优异的高频特性。

    Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
    5.
    发明授权
    Method of manufacturing a semiconductor device and semiconductor device obtained with such a method 有权
    利用这种方法制造半导体器件和半导体器件的制造方法

    公开(公告)号:US08173511B2

    公开(公告)日:2012-05-08

    申请号:US12094303

    申请日:2006-10-29

    IPC分类号: H01L21/331 H01L21/8222

    CPC分类号: H01L29/66242 H01L29/66287

    摘要: The invention relates to a method of manufacturing a semiconductor device (10) with a substrate (11) and a semiconductor body (12) which is provided with at least one bipolar transistor having an emitter region (1), a base region (2) and a collector region (3), wherein in the semiconductor body (12) a first semiconductor region (13) is formed that forms one (3) of the collector and emitter regions (1,3) and on the surface of the semiconductor body (12) a stack of layers is formed comprising a first insulating layer (4), a polycrystalline semiconductor layer (5) and a second insulating layer (6) in which stack an opening (7) is formed, after which by non-selective epitaxial growth a further semiconductor layer (22) is deposited of which a monocrystalline horizontal part on the bottom of the opening (7) forms the base region (2) and of which a polycrystalline vertical part (2A) on a side face of the opening (7) is connected to the polycrystalline semiconductor layer (5), after which spacers (S) are formed parallel to the side face of the opening (7) and a second semiconductor region (31) is formed between said spacers (S) forming the other one (1) of the emitter and collector regions (1,3). According to the invention the above method is characterized in that before the further semiconductor layer (22) is deposited, the second insulating layer (6) is provided with an end portion (6A) that viewed in projection overhangs an end portion (5A) of the underlying semiconductor layer (5). In this way bipolar transistor devices can be obtained with good high frequency properties in a cost effective manner.

    摘要翻译: 本发明涉及一种制造半导体器件(10)的方法,所述半导体器件(10)具有衬底(11)和半导体本体(12),所述半导体器件(12)具有至少一个具有发射极区域(1),基极区域(2) 和集电极区域(3),其中在所述半导体本体(12)中形成第一半导体区域(13),所述第一半导体区域形成所述集电极和发射极区域(1,3)中的一个(3)并且在所述半导体主体 (12)形成一叠层,其包括形成有开口(7)的第一绝缘层(4),多晶半导体层(5)和第二绝缘层(6),之后通过非选择性 外延生长沉积另外的半导体层(22),其中开口(7)的底部上的单晶水平部分形成基部区域(2),并且在该开口的侧面上具有多晶垂直部分(2A) (7)连接到多晶半导体层(5),之后是间隔 (S)形成为平行于开口(7)的侧面,并且在形成发射极和集电极区域(1,3)的另一个(1)的所述间隔物(S)之间形成第二半导体区域(31) )。 根据本发明,上述方法的特征在于,在沉积另外的半导体层(22)之前,第二绝缘层(6)设置有端部(6A),其从突出部分观察到突出部分 底层半导体层(5)。 以这种方式,可以以成本有效的方式获得具有良好高频特性的双极晶体管器件。

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
    6.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20110215417A1

    公开(公告)日:2011-09-08

    申请号:US12918542

    申请日:2009-02-26

    IPC分类号: H01L27/06 H01L21/8249

    摘要: A semiconductor device (10) comprising a bipolar transistor and a field effect transistor within a semiconductor body (1) comprising a projecting mesa (5) within which are at least a portion of a collector region (22d and 22e) and a base region (33d) of the bipolar transistor. The bipolar transistor is provided with a first insulating cavity (92) provided in the collector region (22d and 22e). The base region (33d) is narrower in the plane of the substrate than the collector region (22d and 22e) due to a second insulating cavity (94) provided around the base region (33d) and between the collector region (22d and 22e) and the emitter region (4). By blocking diffusion from the base region the first insulating cavity (92) provides a reduction in the base collector capacitance and can be described as defining the base contact.

    摘要翻译: 一种半导体器件(10),包括半导体本体(1)内的双极晶体管和场效应晶体管,所述半导体本体(1)包括突出台面(5),所述突出台面(5)中至少一部分为集电极区域(22d和22e)和基极区域 33d)。 双极晶体管设置有设置在集电区域(22d和22e)中的第一绝缘腔(92)。 基极区域(33d)由于设置在基极区域(33d)周围的第二绝缘腔(94d)和集电极区域(22d〜22e)之间,在基板的平面内比集电体区域(22d,22e)窄, 和发射极区域(4)。 通过阻挡来自基极区域的扩散,第一绝缘腔(92)提供基极集电极电容的减小并且可以被描述为限定基极触点。

    METHOD OF FABRICATING A HETEROJUNCTION BIPOLAR TRANSISTOR
    7.
    发明申请
    METHOD OF FABRICATING A HETEROJUNCTION BIPOLAR TRANSISTOR 有权
    制备异相双极晶体管的方法

    公开(公告)号:US20090075446A1

    公开(公告)日:2009-03-19

    申请号:US11911620

    申请日:2006-04-03

    IPC分类号: H01L21/331

    摘要: The invention provides a method for fabricating a heterojunction bipolar transistor with a base connecting region (23), which is formed self-aligned to a base region (7) without applying photolithographic techniques. Further, a collector connecting region (31) and an emitter region (29) are formed simultaneously and self-aligned to the base connecting region (23) without applying photolithographic techniques.

    摘要翻译: 本发明提供了一种用于制造具有基极连接区域(23)的异质结双极晶体管的方法,该基极连接区域在不施加光刻技术的情况下自形成于基极区域(7)。 此外,在不使用光刻技术的情况下,集电极连接区域(31)和发射极区域(29)同时形成并且与基底连接区域(23)自对准。

    Sealing structure and method of manufacturing the same
    8.
    发明授权
    Sealing structure and method of manufacturing the same 有权
    密封结构及其制造方法

    公开(公告)号:US08592228B2

    公开(公告)日:2013-11-26

    申请号:US12515590

    申请日:2007-11-15

    IPC分类号: H01L21/00

    摘要: A method of manufacturing a structure (1100), the method comprising forming a cap element (401) on a substrate (101), removing material (103) of the substrate (101) below the cap element (401) to thereby form a gap (802) between the cap element (401) and the substrate (101), and rearranging material of the cap element (401) and/or of the substrate (101) to thereby merge the cap element (401) and the substrate (101) to bridge the gap (802).

    摘要翻译: 一种制造结构(1100)的方法,所述方法包括在基板(101)上形成盖元件(401),在盖元件(401)下方去除基板(101)的材料(103),从而形成间隙 (401)和基板(101)之间的盖(802)和盖元件(401)和/或基板(101)的重新排列材料,从而合并盖元件(401)和基板(101) )弥合差距(802)。

    Semiconductor device with low buried resistance and method of manufacturing such a device
    9.
    发明授权
    Semiconductor device with low buried resistance and method of manufacturing such a device 有权
    具有低掩埋电阻的半导体器件及其制造方法

    公开(公告)号:US07956399B2

    公开(公告)日:2011-06-07

    申请号:US11993296

    申请日:2006-06-22

    IPC分类号: H01L23/485

    摘要: The invention relates to a semiconductor device (10) with a substrate (11) and a semiconductor body (12) of silicon which comprises an active region (A) with a transistor (T) and a passive region (P) surrounding the active region (A) and which is provided with a buried conducting region (1) of a metallic material that is connected to a conductive region (2) of a metallic material sunken from the surface of the semiconductor body (12), by which the buried conductive region (1) is made electrically connectable at the surface of the semiconductor body (12). According to the invention, the buried conducting region (1) is made at the location of the active region (A) of the semiconductor body (12). In this way, a very low buried resistance can be locally created in the active region (A) in the semiconductor body (12), using a metallic material that has completely different crystallographic properties from the surrounding silicon. This is made possible by using a method according to the invention. Such a buried low resistance offers substantial advantages both for a bipolar transistor and for a MOS transistor.

    摘要翻译: 本发明涉及具有衬底(11)和硅的半导体本体(12)的半导体器件(10),其包括具有晶体管(T)的有源区(A)和围绕有源区的无源区(P) (A),并且设置有金属材料的埋入导电区域(1),所述埋入导电区域连接到从所述半导体主体(12)的表面凹陷的金属材料的导电区域(2),所述埋入导电区域 区域(1)在半导体本体(12)的表面处可电连接。 根据本发明,在半导体本体(12)的有源区(A)的位置处形成掩埋导电区(1)。 以这种方式,可以使用与周围的硅具有完全不同的晶体学特性的金属材料,在半导体本体(12)的有源区(A)中局部地产生非常低的掩埋电阻。 这可以通过使用根据本发明的方法来实现。 这种埋下的低电阻为双极晶体管和MOS晶体管提供了显着的优点。

    A SEALING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    A SEALING STRUCTURE AND METHOD OF MANUFACTURING THE SAME 有权
    密封结构及其制造方法

    公开(公告)号:US20100052081A1

    公开(公告)日:2010-03-04

    申请号:US12515590

    申请日:2007-11-15

    IPC分类号: H01L29/84 H01L21/306

    摘要: A method of manufacturing a structure (1100), the method comprising forming a cap element (401) on a substrate (101), removing material (103) of the substrate (101) below the cap element (401) to thereby form a gap (802) between the cap element (401) and the substrate (101), and rearranging material of the cap element (401) and/or of the substrate (101) to thereby merge the cap element (401) and the substrate (101) to bridge the gap (802).

    摘要翻译: 一种制造结构(1100)的方法,所述方法包括在基板(101)上形成盖元件(401),在盖元件(401)下方去除基板(101)的材料(103),从而形成间隙 (401)和基板(101)之间的盖(802)和盖元件(401)和/或基板(101)的重新排列材料,从而合并盖元件(401)和基板(101) )弥合差距(802)。