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1.发明授权Electrolytic deposition of metal-based composite coatings comprising nano-particles 有权包含纳米颗粒的金属基复合涂层的电解沉积公开(公告)号：US09217205B2
公开(公告)日：2015-12-22
申请号：US12747681
申请日：2008-12-10
申请人： Joseph A. Abys , Edward J. Kudrak, Jr. , Jingye Li , Chen Xu , Chonglun Fan
发明人： Joseph A. Abys , Edward J. Kudrak, Jr. , Jingye Li , Chen Xu , Chonglun Fan
摘要： A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.
摘要翻译： 提供了一种赋予衬底表面的耐腐蚀性的方法。 该方法包括使基板的表面与电解电镀溶液接触，所述电解电镀溶液包括（a）选自锌，钯，银，镍，铜，金，铂，铑等的沉积金属的沉积金属离子源， 钌，铬及其合金，（b）非金属纳米颗粒的预混合分散体，其中所述非金属颗粒在其上具有表面活性剂分子的预混合涂层; 以及将外部电子源施加到所述电解电镀溶液中，从而将包含所述沉积金属和非金属纳米颗粒的金属基复合涂层电沉积到所述表面上。
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2.发明申请ELECTROLYTIC DEPOSITION OF METAL-BASED COMPOSITE COATINGS COMPRISING NANO-PARTICLES 有权包含纳米颗粒的金属基复合涂层的电沉积公开(公告)号：US20100294669A1
公开(公告)日：2010-11-25
申请号：US12747681
申请日：2008-12-10
申请人： Joseph A. Abys , Edward J. Kudrak, JR. , Jingye Li , Chen Xu , Chonglun Fan
发明人： Joseph A. Abys , Edward J. Kudrak, JR. , Jingye Li , Chen Xu , Chonglun Fan
IPC分类号： C25D3/58 , C25D9/02 , C25D3/62 , C25D3/56 , C25D3/46 , C25D3/50 , C25D3/48 , C25D3/12 , C25D3/38 , C25D3/22
摘要： A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.
摘要翻译： 提供了一种赋予衬底表面的耐腐蚀性的方法。 该方法包括使基板的表面与电解电镀溶液接触，所述电解电镀溶液包括（a）选自锌，钯，银，镍，铜，金，铂，铑等的沉积金属的沉积金属离子源， 钌，铬及其合金，（b）非金属纳米颗粒的预混合分散体，其中所述非金属颗粒在其上具有表面活性剂分子的预混合涂层; 以及将外部电子源施加到所述电解电镀溶液中，从而将包含所述沉积金属和非金属纳米颗粒的金属基复合涂层电沉积到所述表面上。
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公开(公告)号：US20100151263A1
公开(公告)日：2010-06-17
申请号：US12596559
申请日：2008-04-18
申请人： Joseph A. Abys , Shenliang Sun , Chonglun Fan , Edward J. Kudrak, JR. , Cai Wang
发明人： Joseph A. Abys , Shenliang Sun , Chonglun Fan , Edward J. Kudrak, JR. , Cai Wang
IPC分类号： B32B15/04
CPC分类号： H05K3/282 , C23C22/03 , C23F11/10 , C23F11/149 , H05K2203/124 , Y10T428/12611 , Y10T428/12903 , Y10T428/26 , Y10T428/31678
摘要： A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.
摘要翻译： 一种用于提高包含铜或铜合金基底和至少一种金属基层在该基底表面上的装置的耐腐蚀性，耐磨性和接触电阻的方法和组合物。 该组合物包含选自膦酸，膦酸盐，膦酸酯，磷酸，磷酸盐，磷酸酯及其混合物的磷氧化物化合物; 包含含氮官能团的有机化合物; 和在25℃下测得的表面张力小于约50达因/厘米的溶剂
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公开(公告)号：US08741390B2
公开(公告)日：2014-06-03
申请号：US12596559
申请日：2008-04-18
申请人： Joseph A. Abys , Shenliang Sun , Chonglun Fan , Edward J. Kudrak, Jr. , Cai Wang
发明人： Joseph A. Abys , Shenliang Sun , Chonglun Fan , Edward J. Kudrak, Jr. , Cai Wang
IPC分类号： C23F11/167 , C23F11/14 , C23F11/16
CPC分类号： H05K3/282 , C23C22/03 , C23F11/10 , C23F11/149 , H05K2203/124 , Y10T428/12611 , Y10T428/12903 , Y10T428/26 , Y10T428/31678
摘要： A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.
摘要翻译： 一种用于提高包含铜或铜合金基底和至少一种金属基层在该基底表面上的装置的耐腐蚀性，耐磨性和接触电阻的方法和组合物。 该组合物包含选自膦酸，膦酸盐，膦酸酯，磷酸，磷酸盐，磷酸酯及其混合物的磷氧化物化合物; 包含含氮官能团的有机化合物; 和在25℃下测得的表面张力小于约50达因/厘米的溶剂
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公开(公告)号：US07883738B2
公开(公告)日：2011-02-08
申请号：US11736647
申请日：2007-04-18
CPC分类号： H05K3/282 , C23C22/03 , C23F11/10 , C23F11/149 , H05K2203/124 , Y10T428/12611 , Y10T428/12903 , Y10T428/26 , Y10T428/31678
摘要： A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an aromatic heterocycle comprising nitrogen; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.
摘要翻译： 一种用于提高包含铜或铜合金基底和至少一种金属基层在该基底表面上的装置的耐腐蚀性，耐磨性和接触电阻的方法和组合物。 该组合物包含选自膦酸，膦酸盐，膦酸酯，磷酸，磷酸盐，磷酸酯及其混合物的磷氧化物化合物; 包含氮的芳族杂环; 和在25℃下测得的表面张力小于约50达因/厘米的溶剂
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6.发明申请Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic Components 审中-公开保持电子元件锡表面的可焊性和抑制晶须生长公开(公告)号：US20080261071A1
公开(公告)日：2008-10-23
申请号：US10597374
申请日：2005-01-21
申请人： Chen Xu , Yun Zhang , Chonglun Fan , Oscar Khaselev , Joseph A. Abys , Eric Walch , Marlies Kleinfeld , Hans Ullrich Eckert
发明人： Chen Xu , Yun Zhang , Chonglun Fan , Oscar Khaselev , Joseph A. Abys , Eric Walch , Marlies Kleinfeld , Hans Ullrich Eckert
CPC分类号： H01L23/49582 , C25D5/12 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2924/00014 , H01L2924/01327 , H01L2924/15747 , H01L2924/19041 , H01R4/02 , H01R13/03 , H05K3/3426 , H05K2201/10909 , Y02P70/613 , Y10T428/12722 , H01L2224/45099 , H01L2924/00
摘要： A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 m and about 4.0 m in thickness. There is a nickel-based layer under the tin coating.
摘要翻译： 一种减少电子部件的金属特征的方法，用于减少锡涂层中的晶须形成和保持锡涂层的可焊性。 锡涂层具有内部拉伸应力，厚度在约0.5μm至约4.0μm之间。 在锡涂层下面有一个镍基层。
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公开(公告)号：US06534192B1
公开(公告)日：2003-03-18
申请号：US09405368
申请日：1999-09-24
申请人： Joseph A. Abys , Chonglun Fan , Brian T. Smith , Bruce F. Stacy , Chen Xu
发明人： Joseph A. Abys , Chonglun Fan , Brian T. Smith , Bruce F. Stacy , Chen Xu
IPC分类号： H05K109
CPC分类号： H05K3/244 , H01L24/81 , H01L24/85 , H01L2224/81444 , H01L2224/85444 , H01L2924/00014 , H05K3/062 , H05K3/108 , H05K3/28 , H05K3/384 , H05K2203/0571 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T428/12528 , Y10T428/1275 , Y10T428/12875 , Y10T428/12882 , Y10T428/1291 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.
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公开(公告)号：US08349393B2
公开(公告)日：2013-01-08
申请号：US10902398
申请日：2004-07-29
申请人： Yung-Herng Yau , Thomas B. Richardson , Joseph A. Abys , Karl F. Wengenroth , Anthony Fiore , Chen Xu , Chonglun Fan , John Fudala
发明人： Yung-Herng Yau , Thomas B. Richardson , Joseph A. Abys , Karl F. Wengenroth , Anthony Fiore , Chen Xu , Chonglun Fan , John Fudala
IPC分类号： B05D5/00
CPC分类号： H05K1/09 , C09D1/00 , C23C18/16 , C23C18/1614 , C23C18/1616 , C23C18/1633 , C23C18/1683 , C23C18/1687 , C23C18/42 , C23C18/44 , C23C18/54 , C23C22/06 , C23C22/58 , C25D3/46 , C25D3/56 , C25D3/64 , H05K3/244 , H05K3/422 , H05K2203/0257 , H05K2203/073 , Y10S205/916
摘要： Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
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9.发明授权公开(公告)号：US06517893B2
公开(公告)日：2003-02-11
申请号：US09941086
申请日：2001-08-28
申请人： Joseph A. Abys , Chonglun Fan , Brian T. Smith , Bruce F. Stacy , Chen Xu
发明人： Joseph A. Abys , Chonglun Fan , Brian T. Smith , Bruce F. Stacy , Chen Xu
IPC分类号： B05D512
CPC分类号： H05K3/244 , H01L24/81 , H01L24/85 , H01L2224/81444 , H01L2224/85444 , H01L2924/00014 , H05K3/062 , H05K3/108 , H05K3/28 , H05K3/384 , H05K2203/0571 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T428/12528 , Y10T428/1275 , Y10T428/12875 , Y10T428/12882 , Y10T428/1291 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.
摘要翻译： 印刷电路板（PWB）及其制造方法。 在一个实施例中，PWB包括：（1）具有位于其上的导电迹线的基底和（2）包含钯合金的多用途涂饰，其中钯与钴或铂族金属合金并且位于至少一部分上 的导电迹线，其形成用于PWB的非接触光洁度和接触光洁度。
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公开(公告)号：US20080261025A1
公开(公告)日：2008-10-23
申请号：US11736647
申请日：2007-04-18
申请人： Joseph A. Abys , Shenliang Sun , Chonglun Fan , Edward J. Kudrak
发明人： Joseph A. Abys , Shenliang Sun , Chonglun Fan , Edward J. Kudrak
CPC分类号： H05K3/282 , C23C22/03 , C23F11/10 , C23F11/149 , H05K2203/124 , Y10T428/12611 , Y10T428/12903 , Y10T428/26 , Y10T428/31678
摘要： A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an aromatic heterocycle comprising nitrogen; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.
摘要翻译： 一种用于提高包含铜或铜合金基底和至少一种金属基层在该基底表面上的装置的耐腐蚀性，耐磨性和接触电阻的方法和组合物。 该组合物包含选自膦酸，膦酸盐，膦酸酯，磷酸，磷酸盐，磷酸酯及其混合物的磷氧化物化合物; 包含氮的芳族杂环; 和在25℃下测得的表面张力小于约50达因/厘米的溶剂
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