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公开(公告)号：US20220192581A1
公开(公告)日：2022-06-23
申请号：US17599337
申请日：2020-08-12
发明人： Hiromi Maeda
摘要： A system for monitoring and responding to a cerebrovascular accident includes a computer, including a computer processor and a computer transceiver, a storage that stores personal medical information and a risk level, and a portable device attached to a user. When the computer transceiver receives personal medical information of the user, the computer processor calculates the risk level of a cerebrovascular accident based on the personal medical information. When the computer transceiver receives acceleration information, the computer processor determines whether to contact a predetermined contact based on the risk level and the personal medical information. The portable device includes an acceleration sensor, a position receiver, a clock, a portable transceiver, and a portable processor.
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公开(公告)号：US20210054147A1
公开(公告)日：2021-02-25
申请号：US16977714
申请日：2019-03-04
发明人： Samuel Kyran , Hiroyuki Furutani
IPC分类号： C08G73/10 , C09J179/08
摘要： Methods may include coating a substrate with a polyimide precursor composition prepared from a reaction of a diamine component and a dianhydride component, wherein the reaction includes: a diamine component containing one or more diamines having the formula: wherein R3 is selected from hydrogen, methyl, and halogen; a dianhydride component containing one or more dianhydrides, wherein the one or more dianhydrides include 4,4′-bisphenol A dianhydride (BPADA); and at least one comonomer selected from: one or more additional diamine comonomers, wherein the one or more additional diamine comonomers are present at 1 to 40 mol % of the diamine component; and/or one or more additional dianhydride comonomers, wherein the one or more additional dianhydride comonomers are present at 1 to 40 mol % of the dianhydride component; and curing the polyimide precursor composition to generate a polyimide adhesive on the substrate.
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公开(公告)号：US20200276611A1
公开(公告)日：2020-09-03
申请号：US16804606
申请日：2020-02-28
发明人： Ruolei Wang , Kenneth Sutherland
摘要： A two-component moisture curable composition, a membrane system including the same, and a structure including the same are disclosed herein. In some embodiments, a structure includes a substrate, and a membrane system disposed on the substrate, wherein the membrane system comprises a single layer prepared from a two-component moisture curable composition comprising a reactive organic polymer containing a reactive silyl function group and an epoxy resin, wherein the single layer functions as a primer and a base coat, the single layer disposed on the substrate, and a top coat disposed on the single layer on a surface of the single layer opposite that of the substrate. The moisture curable composition can be applied directly to an adhesion-resistant substrate without the higher number of application steps and/or other chemical treatment required with conventional compositions.
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公开(公告)号：US20200172408A1
公开(公告)日：2020-06-04
申请号：US16701542
申请日：2019-12-03
发明人： Hung-Jue Sue , Joseph Baker , Fangqing Xia , Cong Liu
摘要： A method of forming a composition having exfoliated nanoplatelets functionalized with covalently bound surface-modifiers, includes exfoliating a layered nanoclay is exfoliated with a surfactant. The method also includes reacting the exfoliated layered nanoclay with a surface modifier comprising one or more of an epoxide, a silane, or an isocyanate.
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公开(公告)号：US20170121487A1
公开(公告)日：2017-05-04
申请号：US15342792
申请日：2016-11-03
发明人： Xi ZHANG , Haiqing YAO , Hung-Jue SUE , Masahiro MIYAMOTO
CPC分类号： C08K3/041 , C08J3/215 , C08J2329/04 , C08K3/04 , C08K3/22 , C08K3/32 , C08K2003/2296 , C08K2003/328 , C08K2201/001 , C08K2201/011 , C09C1/04 , C09C1/043 , C09C1/44 , C09C3/08
摘要： A composition including a medium and surfactant-free nanoparticles (SFNPs) at different dispersion state or aggregation form. The composition includes: (a) a composition of a medium and surfactant-free nanoparticles in primary form, wherein the dielectric constant value (DE value) of the medium is equal to or larger than the intrinsic dielectric constant value (IDE) of the SFNPs and smaller than about 1.5 times of the IDE of the SFNPs; (b) a composition of a medium and reaction-limited aggregation form of SFNPs, wherein the DE value of the medium is much larger than the IDE of the surfactant-free nanoparticles; (c) a composition of a medium and diffusion-limited aggregation form of SFNPs, wherein the DE value of the medium is smaller than the IDE of the surfactant-free nanoparticles; and (d) a composition comprising redispersible aggregation form of surfactant-free nanoparticles, wherein the surfactant-free nanoparticles are induced to aggregate in the diffusion-limited fashion in a medium with a DE value that is smaller than the IDE of the surfactant-free nanoparticles.
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公开(公告)号：US20210340344A1
公开(公告)日：2021-11-04
申请号：US17282256
申请日：2019-10-02
发明人： Masahiko Miyauchi
摘要： An amide acid oligomer (AAO) solution, methods of making the same, powder, AAO solution prepregs, AAO dry prepreg, imide prepregs, and fiber reinforced polyimide composites with high temperature resistance and excellent mechanical properties are disclosed herein. In some embodiments, a method of making an AAO solution includes dissolving an aromatic diamine and an aromatic tetracarboxylic compound in a solvent to form a mixture, wherein the solvent has a boiling point of less than 150° C.; stirring the mixture at a temperature ranging from about 5° C. to about 60° C. for about I hour to about 24 hours to form a reaction solution; adding unsaturated acid anhydride to the reaction solution; and stirring the reaction solution at a temperature ranging from about 5° C. to about 60° C. for about 1 minute to about 180 minutes to form an amide acid oligomer solution, the amide acid oligomer solution having amide acid oligomer in the solvent.
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公开(公告)号：US20230062748A1
公开(公告)日：2023-03-02
申请号：US17798003
申请日：2021-02-05
IPC分类号： C08L67/02
摘要： A viscosity modifier for a condensation polymer may include a chain extender comprising at least one reactive monomer and at least one vinyl monomer copolymerizable with the reactive monomer, the chain extender being present in an amount ranging from 15 to 70 wt % of the viscosity modifier; and a non-condensation carrier resin present in an amount ranging from 30 to 85 wt % of the viscosity modifier. Condensation polymer compositions, methods of forming viscosity modifiers, and methods of molding condensation polymer compositions are also provided.
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公开(公告)号：US20220325117A1
公开(公告)日：2022-10-13
申请号：US17635773
申请日：2020-10-16
发明人： LUYI SUN , ANNA MARIE LACHANCE , TIANLEI ZHOU , YOUNG LIM
IPC分类号： C09D7/40 , C09D129/04 , C09D7/61 , C09D7/20
摘要： The invention relates to a nanocomposite coating system that exhibits superior barrier properties for reducing the ingress of unwanted guest species such as moisture (e.g., water vapor) and a facile method for preparing the same nanocoating system on an industrial scale. The current coating materials are able to reduce the overall ingress of unwanted guest species in a substantial improvement over the prior art.
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公开(公告)号：US20220145146A1
公开(公告)日：2022-05-12
申请号：US17434612
申请日：2020-02-28
发明人： Wenwen Li , Ken Sutherland
IPC分类号： C09J171/02 , C08G65/336 , C09J5/02 , C09J7/30 , C09J7/24
摘要： A moisture curable composition, and a method of application and a substrate including the same are disclosed herein. In some embodiments, a curable composition includes a component (A) comprising an organic polymer containing reactive silicon groups represented by the general formula (1), a component (B) comprising an organic polymer having a viscosity lower than 10,000 cP at 23° C. containing reactive silicon groups represented by the general formula (2), and a component (C) comprising a polyolefin polymer. The moisture curable composition has universal adhesiveness to an adhesion-resistant substrate, such as PVC, EPDM, and TPO. The substrates can be smooth-back or fleece-back substrates.
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公开(公告)号：US20210395458A1
公开(公告)日：2021-12-23
申请号：US17279868
申请日：2019-09-30
发明人： Paul MELONI , Haibin ZHENG
IPC分类号： C08G73/10 , C09D5/03 , C09D179/08 , C09D7/20 , H01B3/30
摘要： The present invention discloses a polyamic acid resin composition in a REACH-approved solvent system for use in wire coating applications. The polyamic acid resin composition comprises a molecular weight greater than 8,000 grams per mole, more preferably greater than 20,000 grams per mole. The REACH-approved solvent system comprising a primary REACHapproved solvent with one or more optional secondary REACH-approved co-solvents. The secondary REACH-approved co-solvent can be reactive or non-reactive with dianhydride. The present invention also discloses the elimination of solvents in polyamic acid resin to produce a REACH-approved polyamic acid resin powder.
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