公开(公告)号：US06694614B2

公开(公告)日：2004-02-24

申请号：US09867621

申请日：2001-05-31

申请人： Katsuichi Ukita ,  Kazuhide Isaji ,  Hideaki Nagatoshi ,  Hidehiko Karasaki ,  Hisashi Kinoshita ,  Tsutomu Yano

发明人： Katsuichi Ukita ,  Kazuhide Isaji ,  Hideaki Nagatoshi ,  Hidehiko Karasaki ,  Hisashi Kinoshita ,  Tsutomu Yano

IPC分类号： H01R4300

CPC分类号： B23K26/032 ,  H05K1/0269 ,  H05K3/0032 ,  H05K2203/0554 ,  H05K2203/163 ,  Y10T29/49117 ,  Y10T29/49165

摘要： A laser processes a circuit board including at least two layers. The two layers are a conductive layer with a plurality of holes and an insulating layer. The conductive layer is disposed on a surface layer of the insulating layer which is to be processed by applying a laser beam to portions of the insulating layer corresponding to the holes of the conductive layer. The circuit board is irradiated with the laser beam, and a reflected laser beam is detected, whereby the laser processing of the insulating layer corresponding to an abnormal hole in the conductive layer is stopped, if the detected value of the reflected laser beam is an abnormal value differing from a desired value. Also, the insulating layer corresponding to the hole is processed when the detected value of the reflected light conforms to the desired value.

摘要翻译： A激光器处理包括至少两层的电路板。 这两层是具有多个孔和绝缘层的导电层。 通过将激光束施加到与导电层的孔相对应的绝缘层的部分，将导电层设置在待加工的绝缘层的表面层上。 电路板用激光束照射，并且检测反射的激光束，如果反射的激光束的检测值异常，则停止与导电层中的异常孔对应的绝缘层的激光加工 值与期望值不同。 此外，当反射光的检测值符合期望值时，处理与孔相对应的绝缘层。

公开(公告)号：US06586703B2

公开(公告)日：2003-07-01

申请号：US09873529

申请日：2001-06-04

申请人： Kazuhide Isaji ,  Hidehiko Karasaki ,  Hisashi Kinoshita ,  Makoto Kato

发明人： Kazuhide Isaji ,  Hidehiko Karasaki ,  Hisashi Kinoshita ,  Makoto Kato

IPC分类号： B23K2604

CPC分类号： B23K26/382 ,  B23K26/03 ,  B23K26/032 ,  B23K26/0622 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50 ,  H05K1/0269 ,  H05K3/0035 ,  H05K2203/163

摘要： This is to present a laser machining method and a laser machining apparatus for drilling holes, capable of achieving conduction securely between adjacent conductive layers, by detecting the machining state of a workpiece adequately, and controlling the machining. For this purpose, the number of laser pulse outputs capable of machining securely is preset. During laser machining, reflected laser beam intensity from the workpiece and incident laser beam intensity are detected, and the machining state of the workpiece is detected. As a result, when judging the workpiece has reached a desired machining state, laser machining is finished if the number of times of laser machining has not reached the set number of laser pulse outputs. If it is judged that the workpiece has not reached the desired machining state, laser machining is finished when reaching the set number of laser pulse outputs. As a result, the laser machining method and laser machining apparatus capable of drilling holes of high quality at high yield and shortening the machining cycle time can be realized.

摘要翻译： 这是提出一种用于钻孔的激光加工方法和激光加工装置，其能够通过充分检测工件的加工状态并且控制加工来在相邻导电层之间牢固地实现导电。 为此，预先设定能够安全加工的激光脉冲输出的数量。 在激光加工期间，检测到来自工件的反射激光束强度和入射激光束强度，并检测工件的加工状态。 结果，当判定工件达到期望的加工状态时，如果激光加工次数尚未达到设定数量的激光脉冲输出，则激光加工结束。 如果判断出工件未达到所需的加工状态，则在到达设定数量的激光脉冲输出时，激光加工结束。 结果，可以实现能够以高产量钻出高质量的孔并缩短加工循环时间的激光加工方法和激光加工装置。

公开(公告)号：US06555782B2

公开(公告)日：2003-04-29

申请号：US09873971

申请日：2001-06-04

申请人： Kazuhide Isaji ,  Hidehiko Karasaki ,  Hisashi Kinoshita ,  Makoto Kato

发明人： Kazuhide Isaji ,  Hidehiko Karasaki ,  Hisashi Kinoshita ,  Makoto Kato

IPC分类号： B23K2600

CPC分类号： B23K26/382 ,  B23K26/03 ,  B23K26/032 ,  B23K26/0622 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50 ,  H05K1/0269 ,  H05K3/0035 ,  H05K2203/163

摘要： This is to present a laser machining method and a laser machining apparatus for drilling holes, capable of achieving conduction securely between adjacent conductive layers, by detecting the machining state of a workpiece adequately, and controlling the machining. For this purpose, the number of laser pulse outputs capable of machining securely is preset. During laser machining, reflected laser beam intensity from the workpiece and incident laser beam intensity are detected, and the machining state of the workpiece is detected. As a result, when judging the workpiece has reached a desired machining state, laser machining is finished if the number of times of laser machining has not reached the set number of laser pulse outputs. If it is judged that the workpiece has not reached the desired machining state, laser machining is finished when reaching the set number of laser pulse outputs. As a result, the laser machining method and laser machining apparatus capable of drilling holes of high quality at high yield and shortening the machining cycle time can be realized.

公开(公告)号：US06441337B1

公开(公告)日：2002-08-27

申请号：US09367343

申请日：1999-08-11

申请人： Kazuhide Isaji ,  Hidehiko Karasaki ,  Hisashi Kinoshita ,  Makoto Kato

发明人： Kazuhide Isaji ,  Hidehiko Karasaki ,  Hisashi Kinoshita ,  Makoto Kato

IPC分类号： B23K2604

CPC分类号： B23K26/382 ,  B23K26/03 ,  B23K26/032 ,  B23K26/0622 ,  B23K26/389 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50 ,  H05K1/0269 ,  H05K3/0035 ,  H05K2203/163

摘要： This is to present a laser machining method and a laser machining apparatus for drilling holes, capable of achieving conduction securely between adjacent conductive layers, by detecting the machining state of a workpiece adequately, and controlling the machining. For this purpose, the number of laser pulse outputs capable of machining securely is preset. During laser machining, reflected laser beam intensity from the workpiece and incident laser beam intensity are detected, and the machining state of the workpiece is detected. As a result, when judging the workpiece has reached a desired machining state, laser machining is finished if the number of times of laser machining has not reached the set number of laser pulse outputs. If it is judged that the workpiece has not reached the desired machining state, laser machining is finished when reaching the set number of laser pulse outputs. As a result, the laser machining method and laser machining apparatus capable of drilling holes of high quality at high yield and shortening the machining cycle time can be realized.

摘要翻译： 这是提出一种用于钻孔的激光加工方法和激光加工装置，其能够通过相当于检测工件的加工状态并且控制加工而在相邻的导电层之间牢固地实现导电。为此，激光的数量 脉冲输出能够安全地加工。 在激光加工期间，检测到来自工件的反射激光束强度和入射激光束强度，并检测工件的加工状态。 结果，当判定工件达到期望的加工状态时，如果激光加工次数尚未达到设定数量的激光脉冲输出，则激光加工结束。 如果判断出工件未达到所需的加工状态，则在到达设定数量的激光脉冲输出时，激光加工结束。 结果，可以实现能够以高产量钻出高质量的孔并缩短加工循环时间的激光加工方法和激光加工装置。