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公开(公告)号：US20130081865A1
公开(公告)日：2013-04-04
申请号：US13685972
申请日：2012-11-27
IPC分类号： H05K1/03
CPC分类号： H05K1/0373 , B32B15/04 , B32B2457/08 , H05K1/056 , H05K2201/0141 , H05K2201/0209 , Y10T428/31681
摘要： A circuit board laminate includes a metal substrate, an insulation layer disposed on the metal substrate, and a metal foil disposed on the insulation layer. A metal-based circuit board includes a metal substrate, an insulation layer disposed on the metal substrate, and a circuit pattern disposed on the insulation layer. The insulation layer contains a liquid crystal polyester and 50% by volume or more of an inorganic filler. The inorganic filler is made of boron nitride and at least one of aluminum nitride and aluminum oxide. A proportion of boron nitride in the inorganic filler is within a range of 35 to 80% by volume.
摘要翻译： 电路板层叠体包括金属基板，设置在金属基板上的绝缘层和设置在绝缘层上的金属箔。 金属基电路板包括金属基板，设置在金属基板上的绝缘层和布置在绝缘层上的电路图案。 绝缘层含有液晶聚酯和50体积％以上的无机填料。 无机填料由氮化硼和氮化铝和氧化铝中的至少一种制成。 无机填料中的氮化硼的比例在35〜80体积％的范围内。
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公开(公告)号：US20120193131A1
公开(公告)日：2012-08-02
申请号：US13262944
申请日：2010-04-07
CPC分类号： H05K1/056 , H05K2201/0141 , H05K2201/0145 , H05K2201/0209 , H05K2201/0355
摘要： The metal base circuit board according to the present invention includes a metal substrate, an insulating layer provided on the metal substrate, and a conductive foil for circuit formation that is provided on the insulating layer. The metal substrate has a thermal conductivity of 60 W/mK or more and a thickness of 0.2 to 5.0 mm. The insulating layer is formed using an insulating material composition in which an inorganic filler having a thermal conductivity of 30 W/mK or more is dispersed in a non-anisotropic liquid crystal polyester solution. According to the present invention, a metal base circuit board can be provided that can be applied in an inverter and applications requiring high heat dissipation properties, and that has high thermal conductivity, as well as having high thermal stability and electrical reliability.
摘要翻译： 根据本发明的金属基底电路板包括金属基板，设置在金属基板上的绝缘层和设置在绝缘层上的用于电路形成的导电箔。 金属基板的导热率为60W / mK以上，厚度为0.2〜5.0mm。 使用绝缘材料组合物形成绝缘层，其中导热率为30W / mK以上的无机填料分散在非各向异性液晶聚酯溶液中。 根据本发明，可以提供可应用于逆变器的金属基底电路板以及需要高散热性能，并且具有高导热性以及具有高热稳定性和电可靠性的应用。
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公开(公告)号：US09357642B2
公开(公告)日：2016-05-31
申请号：US13685972
申请日：2012-11-27
CPC分类号： H05K1/0373 , B32B15/04 , B32B2457/08 , H05K1/056 , H05K2201/0141 , H05K2201/0209 , Y10T428/31681
摘要： A circuit board laminate includes a metal substrate, an insulation layer disposed on the metal substrate, and a metal foil disposed on the insulation layer. A metal-based circuit board includes a metal substrate, an insulation layer disposed on the metal substrate, and a circuit pattern disposed on the insulation layer. The insulation layer contains a liquid crystal polyester and 50% by volume or more of an inorganic filler. The inorganic filler is made of boron nitride and at least one of aluminum nitride and aluminum oxide. A proportion of boron nitride in the inorganic filler is within a range of 35 to 80% by volume.
摘要翻译： 电路板层叠体包括金属基板，设置在金属基板上的绝缘层和设置在绝缘层上的金属箔。 金属基电路板包括金属基板，设置在金属基板上的绝缘层和布置在绝缘层上的电路图案。 绝缘层含有液晶聚酯和50体积％以上的无机填料。 无机填料由氮化硼和氮化铝和氧化铝中的至少一种制成。 无机填料中的氮化硼的比例在35〜80体积％的范围内。
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公开(公告)号：US20130037313A1
公开(公告)日：2013-02-14
申请号：US13636399
申请日：2011-03-18
申请人： Ryo Miyakoshi , Takeshi Kondo , Nobuaki Koyama , Kazuhiko Konomi
发明人： Ryo Miyakoshi , Takeshi Kondo , Nobuaki Koyama , Kazuhiko Konomi
CPC分类号： H05K1/056 , H05K2201/0141 , H05K2203/0759
摘要： A liquid composition containing a liquid crystalline polyester, a solvent, and a boron nitride having a volume average particle diameter of not less than 10 μm and not more than 80 μm, wherein the amount of the boron nitride is 30 to 90% by volume based on the total amount of the liquid crystalline polyester and the boron nitride.
摘要翻译： 含有体积平均粒径为10μm以上80μm以下的液晶聚酯，溶剂和氮化硼的液体组合物，其中氮化硼的量为30〜90体积％ 关于液晶聚酯和氮化硼的总量。
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公开(公告)号：US09538648B2
公开(公告)日：2017-01-03
申请号：US13636399
申请日：2011-03-18
申请人： Ryo Miyakoshi , Takeshi Kondo , Nobuaki Koyama , Kazuhiko Konomi
发明人： Ryo Miyakoshi , Takeshi Kondo , Nobuaki Koyama , Kazuhiko Konomi
IPC分类号： H05K1/05
CPC分类号： H05K1/056 , H05K2201/0141 , H05K2203/0759
摘要： A liquid composition containing a liquid crystalline polyester, a solvent, and a boron nitride having a volume average particle diameter of not less than 10 μm and not more than 80 μm, wherein the amount of the boron nitride is 30 to 90% by volume based on the total amount of the liquid crystalline polyester and the boron nitride.
摘要翻译： 含有体积平均粒径为10μm以上80μm以下的液晶聚酯，溶剂和氮化硼的液体组合物，其中氮化硼的量为30〜90体积％ 关于液晶聚酯和氮化硼的总量。
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