摘要:
The metal base circuit board according to the present invention includes a metal substrate, an insulating layer provided on the metal substrate, and a conductive foil for circuit formation that is provided on the insulating layer. The metal substrate has a thermal conductivity of 60 W/mK or more and a thickness of 0.2 to 5.0 mm. The insulating layer is formed using an insulating material composition in which an inorganic filler having a thermal conductivity of 30 W/mK or more is dispersed in a non-anisotropic liquid crystal polyester solution. According to the present invention, a metal base circuit board can be provided that can be applied in an inverter and applications requiring high heat dissipation properties, and that has high thermal conductivity, as well as having high thermal stability and electrical reliability.
摘要:
The present invention provides a liquid crystalline polyester comprising (a) a repeating unit derived from aromatic hydroxycarboxylic acid, (b) a repeating unit derived from aromatic dicarboxylic acid and (c) a repeating unit represented by —X—Ar1-O—Ar1-Y—, wherein Ar1 represents 1,4-phenylene which may be substituted by a halogen atom, an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 20 carbon atoms, and X and Y independently represent O or NH. The polyester in the preset invention has a sufficiently low dielectric constant and/or is a sufficiently high resistance in hydrolysis.
摘要:
The present invention provides a laminate comprising a resin layer and a copper foil. The resin layer is made from a liquid crystalline polyester having at least one structural unit selected from a structural unit derived from aromatic diamine and a structural unit derived from aromatic amine with a phenolic hydroxyl group in an amount of 10 to 35% by mole on the basis of the total structural units in the polyester. The copper foil has a tensile modulus of 60 GPa or smaller and a tensile strength at break of 150 MPa or smaller measured after heat treatment at a temperature of 300° C. The copper-foil laminate has good flexibility and high durability with little anisotropy is provided.
摘要:
The present invention provides a substrate for flexible wiring comprises a liquid crystalline polyester layer and a copper foil with a thickness of 5 μm or less. The substrate has a large adhesion between the resin layer and the copper foil, and is sufficient in water absorbing property and electrical properties.
摘要:
A film comprising a resin alloy of a liquid-crystalline polyester, a polyimide and an optional inorganic filler is provided. The film is excellent in heat resistance and dimensional stability.
摘要:
The present invention provides a laminate comprising a resin layer and a copper foil. The resin layer is made from a liquid crystalline polyester having at least one structural unit selected from a structural unit derived from aromatic diamine and a structural unit derived from aromatic amine with a phenolic hydroxyl group in an amount of 10 to 35% by mole on the basis of the total structural units in the polyester. The copper foil has a tensile modulus of 60 GPa or smaller and a tensile strength at break of 150 MPa or smaller measured after heat treatment at a temperature of 300° C. The copper-foil laminate has good flexibility and high durability with little anisotropy is provided.
摘要:
A film comprising a resin alloy of a liquid-crystalline polyester, a polyimide and an optional inorganic filler is provided. The film is excellent in heat resistance and dimensional stability.
摘要:
The present invention provides a liquid crystalline polyester comprising (a) a repeating unit derived from aromatic hydroxycarboxylic acid, (b) a repeating unit derived from aromatic dicarboxylic acid and (c) a repeating unit represented by —X—Ar1-O—Ar1-Y—, wherein Ar1 represents 1,4-phenylene which may be substituted by a halogen atom, an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 20 carbon atoms, and X and Y independently represent O or NH. The polyester in the preset invention has a sufficiently low dielectric constant and/or is a sufficiently high resistance in hydrolysis.
摘要:
The present invention provides a method for producing a laminated product, the method comprising the steps of: applying a solution containing a liquid-crystalline polymer and a solvent to a first metal layer, removing the solvent from the solution to form a liquid- crystalline polymer layer on the first metal layer, placing a second metal layer such that the liquid-crystalline polymer layer is placed between the first and second metal layers, and subjecting the liquid-crystalline polymer layer to compression from the direction of the first and second metal layers, wherein the thickness of the second metal layer is larger than that of the first metal layer. In the production method, the first metal layer preferably comprises a different metal from the second metal layer.
摘要:
An object of the present invention is to provide a liquid crystal polyester-containing liquid composition which is capable of producing a prepreg and a resin film in which surface defects are remarkably reduced even in case of drying at high temperature to remove the solvent in the production process. Disclosed Are a liquid crystal polyester-containing liquid composition comprising a liquid crystal polyester, an organic solvent, and one or more kinds of selected leveling agents, wherein the content of the leveling agent is from 0.001 to 2.0 parts by mass based on 100 parts by mass of the total amount of the liquid crystal polyester and the organic solvent; and a method for producing a resin film, which comprises applying the above-described liquid crystal polyester-containing liquid composition on a support, and then removing the solvent from the liquid crystal polyester-containing liquid composition on the support at 50° C. or higher.