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公开(公告)号：US08535809B2
公开(公告)日：2013-09-17
申请号：US11115400
申请日：2005-04-27
IPC分类号： B32B15/08
CPC分类号： B32B15/06 , B32B15/14 , B32B17/04 , B32B2038/0076 , B32B2260/04 , B32B2307/206 , B32B2307/306 , B32B2457/08 , H05K1/056 , H05K2201/0133 , H05K2201/0209 , Y10T428/24917 , Y10T428/31678 , Y10T428/31681 , Y10T428/31696
摘要： Provided is an electrical insulating resin composition capable of forming an electrical insulating layer which has excellent flexibility and board adhesiveness, together with high thermal resistance and high humidity resistance, tolerates a high temperature treatment at soldering and can be stably used for a long time under a harsh environment with high temperature and vibration in an automobile. A resin composition containing as organic components at least a rubber like polymer compound (A) composed of a copolymer of an aromatic vinyl compound and a conjugated diene compound and a polymerizable monomer (B) having one or more terminal reactive double bonds is employed as the electrical insulating resin composition. The compound (A) may be partially hydrogenated. The composition may optionally contain an oligomer (C) having a ring structure and having a reactive unsaturated bond in the molecule thereof.
摘要翻译： 提供一种电绝缘树脂组合物，其能够形成具有优异的柔性和板粘合性以及高耐热性和高耐湿性的电绝缘层，耐受焊接时的高温处理，并且可以长时间稳定地使用 恶劣的环境，汽车的高温和振动。 作为有机成分的至少含有由芳族乙烯基化合物和共轭二烯化合物的共聚物构成的橡胶状高分子化合物（A）和具有一个以上的末端反应性双键的聚合性单体（B）的树脂组合物，作为 电绝缘树脂组合物。 化合物（A）可以部分氢化。 组合物可以任选地含有具有环结构并且在其分子中具有反应性不饱和键的低聚物（C）。
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公开(公告)号：US20120193131A1
公开(公告)日：2012-08-02
申请号：US13262944
申请日：2010-04-07
CPC分类号： H05K1/056 , H05K2201/0141 , H05K2201/0145 , H05K2201/0209 , H05K2201/0355
摘要： The metal base circuit board according to the present invention includes a metal substrate, an insulating layer provided on the metal substrate, and a conductive foil for circuit formation that is provided on the insulating layer. The metal substrate has a thermal conductivity of 60 W/mK or more and a thickness of 0.2 to 5.0 mm. The insulating layer is formed using an insulating material composition in which an inorganic filler having a thermal conductivity of 30 W/mK or more is dispersed in a non-anisotropic liquid crystal polyester solution. According to the present invention, a metal base circuit board can be provided that can be applied in an inverter and applications requiring high heat dissipation properties, and that has high thermal conductivity, as well as having high thermal stability and electrical reliability.
摘要翻译： 根据本发明的金属基底电路板包括金属基板，设置在金属基板上的绝缘层和设置在绝缘层上的用于电路形成的导电箔。 金属基板的导热率为60W / mK以上，厚度为0.2〜5.0mm。 使用绝缘材料组合物形成绝缘层，其中导热率为30W / mK以上的无机填料分散在非各向异性液晶聚酯溶液中。 根据本发明，可以提供可应用于逆变器的金属基底电路板以及需要高散热性能，并且具有高导热性以及具有高热稳定性和电可靠性的应用。
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公开(公告)号：US20050276958A1
公开(公告)日：2005-12-15
申请号：US11115400
申请日：2005-04-27
CPC分类号： B32B15/06 , B32B15/14 , B32B17/04 , B32B2038/0076 , B32B2260/04 , B32B2307/206 , B32B2307/306 , B32B2457/08 , H05K1/056 , H05K2201/0133 , H05K2201/0209 , Y10T428/24917 , Y10T428/31678 , Y10T428/31681 , Y10T428/31696
摘要： Provided is an electrical insulating resin composition capable of forming an electrical insulating layer which has excellent flexibility and board adhesiveness, together with high thermal resistance and high humidity resistance, tolerates a high temperature treatment at soldering and can be stably used for a long time under a harsh environment with high temperature and vibration in an automobile. A resin composition containing as organic components at least a rubber like polymer compound (A) composed of a copolymer of an aromatic vinyl compound and a conjugated diene compound and a polymerizable monomer (B) having one or more terminal reactive double bonds is employed as the electrical insulating resin composition. The compound (A) may be partially hydrogenated. The composition may optionally contain an oligomer (C) having a ring structure and having a reactive unsaturated bond in the molecule thereof.
摘要翻译： 提供一种电绝缘树脂组合物，其能够形成具有优异的柔性和板粘合性以及高耐热性和高耐湿性的电绝缘层，耐受焊接时的高温处理，并且可以长时间稳定地使用 恶劣的环境，汽车的高温和振动。 作为有机成分的至少含有由芳族乙烯基化合物和共轭二烯化合物的共聚物构成的橡胶状高分子化合物（A）和具有一个以上的末端反应性双键的聚合性单体（B）的树脂组合物，作为 电绝缘树脂组合物。 化合物（A）可以部分氢化。 组合物可以任选地含有具有环结构并且在其分子中具有反应性不饱和键的低聚物（C）。
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4.发明申请公开(公告)号：US20070298272A1
公开(公告)日：2007-12-27
申请号：US11631856
申请日：2005-07-08
申请人： Kouichi Kusakawa , Shigeki Ichimura , Taisuke Suwa
发明人： Kouichi Kusakawa , Shigeki Ichimura , Taisuke Suwa
IPC分类号： F16J15/00
CPC分类号： F16J15/108 , B29C45/14336 , B29C2045/14459 , B29L2031/265 , B29L2031/3431 , B29L2031/3437 , F16J15/104 , Y10T428/31909
摘要： Provided are a gasket that is less likely to deform and installable with excellent workability when it is installed at a portion to be sealed and that can be produced at low cost, a method of producing the gasket, and a gasket installation method. A previously prepared thermoplastic resin film with a predetermined shape is placed in a metal mold composed of a stationary side metal mold and a movable side metal mold. Then, thermoplastic elastomer as an elastic body is insert molded on the film by an injection molding machine to form a gasket. After the molding, the gasket is removed from the metal molds.
摘要翻译： 本发明提供一种当安装在要密封的部分并且可以以低成本生产且垫圈的制造方法和垫圈安装方法时，不太可能变形和可安装并且具有优异的可加工性的垫圈。 将预先制备的具有预定形状的热塑性树脂膜放置在由固定侧金属模和可动侧金属模构成的金属模中。 然后，作为弹性体的热塑性弹性体通过注射成型机嵌入成型在膜上，形成垫圈。 成型后，从金属模具中取出垫圈。
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