公开(公告)号：US5256718A

公开(公告)日：1993-10-26

申请号：US654004

申请日：1991-02-12

申请人： Sanehiro Yamamoto ,  Hideki Sakai ,  Hirotaka Aso ,  Kazuo Ishiwatari ,  Fumitoshi Ikejiri

发明人： Sanehiro Yamamoto ,  Hideki Sakai ,  Hirotaka Aso ,  Kazuo Ishiwatari ,  Fumitoshi Ikejiri

IPC分类号： C08K3/22 ,  C08K3/32 ,  C08K5/521 ,  C08L77/00 ,  H05K1/03 ,  C08K3/10 ,  C08K5/02 ,  C08K5/17 ,  C08K5/51

CPC分类号： C08K5/521 ,  C08K3/2279 ,  C08K3/32 ,  C08L77/00 ,  H05K1/0373

摘要： The present invention provides resin compositions containing thermoplastic resins. Thermoplastic resins employable for the compositions are polyolefin resins, polyester resins, polystyrene resins, polyamide resins and polyphenylene ether resins. The present invention can be particularly effected by using polyamide, particularly, specific aromatic polyamides.In the present invention, the resin compositions can be improved in various chemical and physical properties such as flame-retardance, moldability, color tone, heat stability, mechanical strength by the use of other resin component and stabilizers such as halogenated organic compounds, modified polyolefins, antimony compounds, phosphorus-containing compounds, amine- or phosphorus-type stabilizers.

公开(公告)号：US5115010A

公开(公告)日：1992-05-19

申请号：US684517

申请日：1991-04-15

申请人： Hideki Sakai ,  Kazuo Ishiwatari ,  Fumitoshi Ikejiri

发明人： Hideki Sakai ,  Kazuo Ishiwatari ,  Fumitoshi Ikejiri

IPC分类号： C08K3/24 ,  C08L25/06 ,  C08L71/12 ,  C08L77/00

CPC分类号： C08L77/00 ,  C08K3/24 ,  C08L25/06 ,  C08L71/12

摘要： A composition comprising (I) a thermally stable polyamide such as an aromatic polyamide, (II) a halogenated polystyrene or a halogenated polyphenylene oxide, and (III) sodium antimonate has excellent fire retardancy and excellent thermal stability during molding. The thermal stability of the composition is further enhanced by including (IV) a hydrotalcite-type complex hydroxide or (V) magnesium oxide and/or zinc oxide.

公开(公告)号：US5183843A

公开(公告)日：1993-02-02

申请号：US410129

申请日：1989-09-21

申请人： Hideki Sakai ,  Kazuo Ishiwatari ,  Fumitoshi Ikejiri

发明人： Hideki Sakai ,  Kazuo Ishiwatari ,  Fumitoshi Ikejiri

IPC分类号： C08K5/09 ,  C08K5/098 ,  C08K7/02 ,  C08K7/14 ,  C08L77/00 ,  C08L77/06

CPC分类号： C08K5/098 ,  C08K7/14

摘要： A polyamide resin composition which comprises: (A) an aromatic polyamide resin comprising preferably a terephthalic acid component and a diamine component comprising at least one of an aliphatic diamine component and an alicyclic diamine component; (B) a fibrous reinforcement; and (C) at least one additive selected from the group consisting of a salt of the group I, II and III metals of the periodic table of a higher fatty acid salt and an acid ester, a partially saponified ester and a metal salt of an aliphatic carboxylic acid of 26-32 carbons.The resin composition is of high fluidity and mold-releasing properties as well as of high heat resistance and rigidity, so that the composition can be molded with decomposition of the resins.