Polyamide resin compositions
    3.
    发明授权
    Polyamide resin compositions 失效
    聚酰胺树脂组合物

    公开(公告)号:US5183843A

    公开(公告)日:1993-02-02

    申请号:US410129

    申请日:1989-09-21

    CPC分类号: C08K5/098 C08K7/14

    摘要: A polyamide resin composition which comprises: (A) an aromatic polyamide resin comprising preferably a terephthalic acid component and a diamine component comprising at least one of an aliphatic diamine component and an alicyclic diamine component; (B) a fibrous reinforcement; and (C) at least one additive selected from the group consisting of a salt of the group I, II and III metals of the periodic table of a higher fatty acid salt and an acid ester, a partially saponified ester and a metal salt of an aliphatic carboxylic acid of 26-32 carbons.The resin composition is of high fluidity and mold-releasing properties as well as of high heat resistance and rigidity, so that the composition can be molded with decomposition of the resins.

    Resin composition for forming plated layer and use thereof
    4.
    发明授权
    Resin composition for forming plated layer and use thereof 失效
    用于形成镀层的树脂组合物及其用途

    公开(公告)号:US5324766A

    公开(公告)日:1994-06-28

    申请号:US138390

    申请日:1993-10-20

    摘要: The resin composition for forming plated layer disclosed herein comprises a polyamide composed of a dicarboxylic acid component recuring unit and a recurring unit derived from a diamine component unit having an alkylene group of 4 to 25 carbon atoms and at least one inorganic filler. There are also disclosed the resin molded article having plated layer formed thereon, the electromagnetic wave shielding material, the decorative resin molded article and the connecting material produced by forming plated layer on the surfaces of the resin molded articles formed from said resin composition. Further, there is disclosed the printed circuit board produced by forming selectively metallized layer in wiring circuit portion on the surface of the resin molded article formed from said resin composition and the method for plating to form these articles having the layer plated thereon.

    摘要翻译: 本文公开的用于形成镀层的树脂组合物包含由二羧酸组分回收单元组成的聚酰胺和衍生自具有4至25个碳原子的亚烷基的二胺组分单元和至少一种无机填料的重复单元。 还公开了在由树脂组合物形成的树脂模塑制品的表面上形成有镀层的树脂模塑制品,电磁波屏蔽材料,装饰性树脂模塑制品和通过形成镀层制成的连接材料。 此外,公开了通过在由所述树脂组合物形成的树脂模塑制品的表面上的布线电路部分中选择性地金属化层形成的印刷电路板和用于镀覆其上镀有层的这些制品的方法。

    Rolling bearing cages
    5.
    发明授权
    Rolling bearing cages 失效
    滚动轴承保持架

    公开(公告)号:US5118207A

    公开(公告)日:1992-06-02

    申请号:US708849

    申请日:1991-05-31

    摘要: Rolling bearing cages disclosed herein are prepared from compositions comprising an aromatic polyamide which comprises terephthalic acid constituent units, aromatic dicarboxylic acid constituent units other than terephthalic acid constituent units and straight-chain aliphatic alkylenediamine constituent units, and glass fibers, and can be easily incorporated into bearing races without damage, resultant bearings capable of being operated over a long period of time without deformation of said cages and deterioration of the lubricant oil.

    摘要翻译: 本文公开的滚动轴承保持架由包含对苯二甲酸构成单元,除对苯二甲酸构成单元以外的芳香族二羧酸结构单元和直链脂肪族亚烷基二胺结构单元的芳香族聚酰胺和玻璃纤维组成的组合物制备,并且可以容易地并入 轴承座没有损坏,所得到的轴承能够长时间运转而不会使所述笼子变形,并且润滑油变坏。

    Thermoplastic resin composition and use thereof
    8.
    发明授权
    Thermoplastic resin composition and use thereof 失效
    热塑性树脂组合物及其用途

    公开(公告)号:US5424104A

    公开(公告)日:1995-06-13

    申请号:US178616

    申请日:1994-01-07

    CPC分类号: C08L77/00

    摘要: Disclosed is a thermoplastic resin composition comprising(A) an aromatic polyamide comprisingdicarboxylic acid units comprising 50-100 mol % of units derived from terephthalic acid, and 0-50 mol % of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic-dicarboxylic acid having 4-20 carbon atoms, anddiamine units derived from an aliphatic diamine and/or an alicyclic diamine,said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30.degree. C. and a melting point of higher than 300.degree. C.,(B) a graft modified .alpha.-olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and(C) an aliphatic polyamide,wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified .alpha.-olefin polymer, and/or the graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof (B) and 5-80 parts by weight of the aliphatic polyamide (C), based on 100 parts by weight of the aromatic polyamide (A).

    摘要翻译: 公开了一种热塑性树脂组合物,其包含(A)包含二羧酸单元的芳族聚酰胺,所述二羧酸单元包含50-100摩尔%的由对苯二甲酸衍生的单元,以及0-50摩尔%的衍生自除对苯二甲酸之外的芳族二羧酸的单元和/ 或具有4-20个碳原子的脂族二羧酸,以及衍生自脂族二胺和/或脂环族二胺的二胺单元,所述芳族聚酰胺的特性粘度为浓度为0.5-3.0dl / g。 硫酸在30℃,熔点高于300℃,(B)接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物和( C)脂肪族聚酰胺,其中所述热塑性树脂组合物包含10-80重量份的接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物(B)和5- 基于100重量份的芳族聚酰胺(A),80重量份的脂肪族聚酰胺(C)。

    Connectors
    9.
    发明授权
    Connectors 失效
    连接器

    公开(公告)号:US5405904A

    公开(公告)日:1995-04-11

    申请号:US244627

    申请日:1994-06-03

    摘要: The connector of the present invention has a housing formed from a polyamide resin composition which comprises 65-85% by weight of a specific polyamide (A), and 5-20% by weight of a graft-modified .alpha.-olefin random copolymer and/or graft-modified vinyl aromatic hydrocarbon/conjugated diene copolymer or a hydrogenation product thereof (B), and 0.1-1.0% by weight, based on 100% by weight of the total of the aromatic polyamide (A) and graft-modified copolymer (B), of a polyethylene wax or a metallic salt of an aliphatic carboxylic acid having 26-32 carbon atoms (C), and further, optionally, an antioxidant (D).An object of the present invention is to provide a connector which is free from a decrease in characteristics such as toughness by heating, and, in particular, can be formed with excellent moldability, and is light weight.

    摘要翻译: PCT No.PCT / JP93 / 01429 Sec。 371日期:1994年6月3日 102(e)日期1994年6月3日PCT提交1993年10月5日PCT公布。 出版物WO94 / 08363 日本1994年04月14日。本发明的连接器具有由聚酰胺树脂组合物形成的壳体,其包含65-85重量%的特定聚酰胺(A)和5-20重量%的接枝改性 α-烯烃无规共聚物和/或接枝改性的乙烯基芳烃/共轭二烯共聚物或其氢化产物(B),相对于芳族聚酰胺(A)的总量的100重量%为0.1-1.0重量% )和接枝改性共聚物(B),聚乙烯蜡或具有26-32个碳原子的C的脂族羧酸的金属盐(C),以及任选的抗氧化剂(D)。 本发明的目的是提供一种连接器,其不会因加热而导致的韧性等特性的降低,特别是可以形成成型性优异,重量轻。

    Cycloolefin type random copolymer compositions
    10.
    发明授权
    Cycloolefin type random copolymer compositions 失效
    环烯烃型无规共聚物组合物

    公开(公告)号:US4918133A

    公开(公告)日:1990-04-17

    申请号:US363884

    申请日:1989-06-07

    IPC分类号: C08L23/16 C08L65/00

    摘要: In accordance with the present invention, there are provided cycloolefin type random copolymer compositions excellent in heat resistance, chemical resistance, rigidity, impact resistance, etc., which comprise(A) a cycloolefin type random copolymer containing an ethylene component and a cycloolefin component and having an intrinsic viscosity [.eta.] of 0.05-10 dl/g as measured at 135.degree. C. in decalin and a softening temperature (TMA) of not lower than 70.degree. C., and(B) one or more non-rigid copolymers selected from the group consisting of:(i) a cycloolefin type random copolymer containing an ethylene component, at least one other .alpha.-olefin component and a cycloolefin component and having an intrinsic viscosity [.eta.] of 0.01-10 dl/g as measured at 135.degree. C. in decalin and a softening temperature (TMA) of below 70.degree. C.,(ii) a non-crystalline to low crystalline .alpha.-olefin type elastomeric copolymer formed from at least two .alpha.-olefins,(iii) an .alpha.-olefin-diene type elastomeric copolymer formed from at least two .alpha.-olefins and at least one non-conjugated diene, and(iv) an aromatic vinyl type hydrocarbon-conjugated diene copolymer or a hydrogenated product thereof, and optionally(c) an inorganic filler or organic filler.

    摘要翻译: PCT No.PCT / JP88 / 01027 Sec。 371日期1989年6月7日第 102(e)日期1989年6月7日PCT提交1988年10月7日PCT公布。 第WO89 / 03413号公报 根据本发明,提供了耐热性,耐化学性,刚性,耐冲击性等优异的环烯烃型无规共聚物组合物,其包含(A)含有 乙烯组分和环烯烃组分,并且在135℃下在十氢化萘中测得的特性粘度η为0.05-10dl / g,软化温度(TMA)不低于70℃,(B) 一种或多种选自以下的非刚性共聚物:(i)含有乙烯组分,至少一种其它α-烯烃组分和环烯烃组分的环烯烃型无规共聚物,其特性粘度η为0.01- 在135℃下在十氢化萘中测得的10dl / g,软化温度(TMA)低于70℃,(ii)由至少两个α - 烯烃形成的非结晶至低结晶的α-烯烃型弹性体共聚物, 烯烃,(iii)α 由至少两种α-烯烃和至少一种非共轭二烯形成的α-烯烃 - 二烯型弹性体共聚物,和(iv)芳族乙烯基型烃 - 共轭二烯共聚物或其氢化产物,和任选地(c)无机 填料或有机填料。