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公开(公告)号:US20140141273A1
公开(公告)日:2014-05-22
申请号:US14006538
申请日:2012-03-23
申请人: Masato Shimamura , Tsukasa Ohnishi , Mitsuhiro Kosai , Kazuyori Takagi , Tomoko Nonaka , Masayuki Suzuki , Toru Hayashida , Seiko Ishibashi , Shunsaku Yoshikawa , Yoshie Yamanaka
发明人: Masato Shimamura , Tsukasa Ohnishi , Mitsuhiro Kosai , Kazuyori Takagi , Tomoko Nonaka , Masayuki Suzuki , Toru Hayashida , Seiko Ishibashi , Shunsaku Yoshikawa , Yoshie Yamanaka
CPC分类号: B23K35/262 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/3618 , C22C13/00 , C22C13/02 , C22F1/16 , H01L2924/00013 , H01L2924/014 , Y10T428/12222 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要: By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.
摘要翻译: 通过使用主要由Ag组成的焊料合金,Cu:0.6〜0.9质量%,Bi:1.2〜3.0质量%,Sb:0.02〜1.0质量%,Sb:0.01〜2.0质量%,和 Sn的余量,可以获得具有优异的耐滴落冲击性和优异的热循环特性的便携式装置,而不会在诸如在太阳加热的车辆内的高温环境或低温下使用时产生热疲劳 环境,如在多雪的天气下的户外。
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公开(公告)号:US09844837B2
公开(公告)日:2017-12-19
申请号:US14006538
申请日:2012-03-23
申请人: Masato Shimamura , Tsukasa Ohnishi , Mitsuhiro Kosai , Kazuyori Takagi , Tomoko Nonaka , Masayuki Suzuki , Toru Hayashida , Seiko Ishibashi , Shunsaku Yoshikawa , Yoshie Yamanaka
发明人: Masato Shimamura , Tsukasa Ohnishi , Mitsuhiro Kosai , Kazuyori Takagi , Tomoko Nonaka , Masayuki Suzuki , Toru Hayashida , Seiko Ishibashi , Shunsaku Yoshikawa , Yoshie Yamanaka
CPC分类号: B23K35/262 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/3618 , C22C13/00 , C22C13/02 , C22F1/16 , H01L2924/00013 , H01L2924/014 , Y10T428/12222 , H01L2924/01029 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599
摘要: By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.
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