公开(公告)号：US06387746B2

公开(公告)日：2002-05-14

申请号：US09797959

申请日：2001-03-05

申请人： Yukio Katoh ,  Hiroshi Wada ,  Keizo Takemasa

发明人： Yukio Katoh ,  Hiroshi Wada ,  Keizo Takemasa

IPC分类号： H01L218234

CPC分类号： H01S5/227 ,  H01S5/1085 ,  H01S5/2201 ,  H01S5/2272

摘要： A mask layer is formed on a semiconductor substrate such that an elongate opening of the mask layer extends lengthwise at an angle relative to a [011] direction of the semiconductor substrate. A ridge waveguide structure including an active layer is formed within the elongate opening on the semiconductor substrate by a selective growth method using the mask layer as a mask. The mask layer is then removed, and a clad layer is formed over the ridge waveguide structure.

摘要翻译： 掩模层形成在半导体衬底上，使得掩模层的细长开口相对于半导体衬底的[011]方向以一定角度纵向延伸。 通过使用掩模层作为掩模的选择性生长方法，在半导体衬底上的细长开口内形成包括有源层的脊波导结构。 然后去除掩模层，并且在脊形波导结构上形成覆盖层。

公开(公告)号：US08277131B2

公开(公告)日：2012-10-02

申请号：US12659967

申请日：2010-03-26

申请人： Munechika Kubota ,  Koji Yamada ,  Keizo Takemasa ,  Tomonori Shimamura ,  Satoshi Sasaki ,  Xiang Yu ,  Kouyu Moriya ,  Takashi Sugiyama

发明人： Munechika Kubota ,  Koji Yamada ,  Keizo Takemasa ,  Tomonori Shimamura ,  Satoshi Sasaki ,  Xiang Yu ,  Kouyu Moriya ,  Takashi Sugiyama

IPC分类号： G02B6/36

CPC分类号： G02B6/4207 ,  G02B6/12004 ,  G02B6/4204 ,  G02B6/4279 ,  G02B2006/12119 ,  H01L24/48 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/12043 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01S5/0064 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/0265 ,  H01S5/06226 ,  H01S5/101 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor optical communication module includes a semiconductor chip mounted on a chip carrier and a lens assembly having an end parallel to and facing the front edge of the chip carrier. The semiconductor chip has a front facet oriented at an acute angle to the front edge of the chip carrier. An optical waveguide in the semiconductor chip transmits an optical signal that propagates on an optical axis extending from the front facet of the semiconductor chip to the end of the lens assembly. The optical axis is orthogonal to the end of the lens assembly and the front edge of the chip carrier. The angled mounting of the semiconductor chip on the chip carrier allows the lens assembly to be placed close to the edge of the chip carrier, and to be moved for optical axis adjustment without striking the chip carrier.