公开(公告)号：US5051627A

公开(公告)日：1991-09-24

申请号：US459220

申请日：1989-12-29

Applicant: Neal J. Schneier ,  Gerald R. Fischer ,  Roger A. Davidheiser ,  George E. Avera

Inventor： Neal J. Schneier ,  Gerald R. Fischer ,  Roger A. Davidheiser ,  George E. Avera

IPC: G11C11/44 ,  H03K19/195

CPC classification number: H03K19/1952 ,  Y10S505/858 ,  Y10S505/865

Abstract: A family of logic circuits using nonhysteretic superconducting quantum interference devices (SQUIDs) connected together to perform various functions using a common operating principle. Each circuit has an output line, first and second power supply lines having first and second voltage states, and input lines that can have one of the two voltage states. A pull-up circuit, having at least one SQUID, is connected between the output line and the first power supply line, and the input lines are coupled to the pull-up circuit in such a manner as to pull the output line to the first voltage state only if the input lines conform with a selected combination of voltage states. A pull-down circuit, also having at least one SQUID, is connected between the output line and the second power supply line, to pull the output line to the second voltage state only when input lines do not conform with the selected combination of voltage states. A single configuration of SQUIDs can be connected to perform any of six different basic Boolean logic functions on signals applied to the input lines. Additional SQUIDs allow the performance of more complex logic functions. A slightly different arrangement of SQUIDs operates as a two-port random access memory cell.

公开(公告)号：US5987732A

公开(公告)日：1999-11-23

申请号：US137288

申请日：1998-08-20

Applicant: Alfred E. Lee ,  Roger A. Davidheiser ,  James C. Lau

Inventor： Alfred E. Lee ,  Roger A. Davidheiser ,  James C. Lau

IPC: H05K3/46 ,  H01L21/50 ,  H01L23/552 ,  H01L23/66 ,  H01L25/00 ,  H01L25/04 ,  H01L25/18 ,  H01P11/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00

CPC classification number: H01L23/552 ,  H01L21/50 ,  H01L23/66 ,  H05K1/0219 ,  H01L2924/0002 ,  H05K1/185 ,  H05K2201/09681 ,  H05K3/0023 ,  H05K3/4644 ,  Y10T29/49016 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: The invention relates to a method for producing low cost integrated microwave assemblies, where a photoresist layer is deposited onto a substrate, a portion of the photoresist is selectively removed, a first conductive layer is applied, and, a second portion of the photoresist is removed leaving isolation walls and cavities. Electrical components are placed in the cavities and a first dielectric layer fills the cavities. Vias are created in the first dielectric material exposing the electrical contacts, a second conductive layer is applied into the vias and over the first dielectric material. The second conductive layer is patterned by removing a portion of the second conductive layer creating a signal line pattern in the second conductive layer.

Abstract translation: 本发明涉及一种生产低成本集成微波组件的方法，其中将光致抗蚀剂层沉积在衬底上，选择性地去除一部分光致抗蚀剂，施加第一导电层，并且去除光致抗蚀剂的第二部分 留下隔离墙和空腔。 电气部件被放置在空腔中，并且第一介电层填充空腔。 在暴露电触点的第一电介质材料中产生通孔，第二导电层被施加到通孔中并在第一介电材料上方。 通过去除第二导电层的一部分在第二导电层中产生信号线图案来对第二导电层进行图案化。

公开(公告)号：US6097265A

公开(公告)日：2000-08-01

申请号：US198778

申请日：1998-11-24

Applicant: Steven S. Chan ,  Roger A. Davidheiser ,  Alfred E. Lee ,  D. Ian Stones

Inventor： Steven S. Chan ,  Roger A. Davidheiser ,  Alfred E. Lee ,  D. Ian Stones

IPC: H01P5/08 ,  H01P3/12 ,  H01P5/02 ,  H01P5/103

CPC classification number: H01P5/103

Abstract: A waveguide structure (10) that provides a transition from a polymeric waveguide (26) to a coaxial connection (48). The coaxial connection (48) includes an outer conductor (50) electrically connected to a top ground plate (36) of the waveguide (26) and an inner conductor (52) that extends into the polymeric material within the waveguide (26). The inner conductor (52) is electrically connected to a capacitive plate (56), and the capacitive plate (56) is electrically connected to an elongated conductive probe (58). The conductive probe (58) is electrically connected to a conductive post (60), which is electrically connected to a bottom ground plate (38) opposite to the top ground plate (36). The conductive probe (58) extends in a direction transverse to the propagation direction of electromagnetic waves, and acts to pick up the energy in the electromagnetic radiation. The capacitive plate (56) provides a shunt capacitance that resonates out the inductance caused by the conductive probe (58) and the inner conductor (52). The conductive probe (58) is positioned relative to a backshort surface (44) of the waveguide (26) a distance that is less than a quarter wavelength of the electromagnetic radiation of interest.

Abstract translation: 提供从聚合物波导（26）到同轴连接（48）的转变的波导结构（10）。 同轴连接（48）包括电连接到波导（26）的顶部接地板（36）的外部导体（50）和延伸到波导管（26）内的聚合材料内部的内部导体（52）。 内导体（52）电连接到电容板（56），并且电容板（56）电连接到细长的导电探针（58）。 导电探针（58）电连接到导电柱（60），导电柱（60）电连接到与顶部接地板（36）相对的底部接地板（38）。 导电探针（58）在横向于电磁波的传播方向的方向上延伸，并且用于拾取电磁辐射中的能量。 电容板（56）提供谐振电容，其使由导电探针（58）和内导体（52）引起的电感谐振。 导电探针（58）相对于波导（26）的反向旋转表面（44）定位的距离小于感兴趣的电磁辐射的四分之一波长。

公开(公告)号：US06194669B1

公开(公告)日：2001-02-27

申请号：US09245317

申请日：1999-02-05

Applicant: William D. Bjorndahl ,  D. Ian Stones ,  Kenneth C. Selk ,  Roger A. Davidheiser ,  Alfred E. Lee

Inventor： William D. Bjorndahl ,  D. Ian Stones ,  Kenneth C. Selk ,  Roger A. Davidheiser ,  Alfred E. Lee

IPC: H01R1204

CPC classification number: H01L23/66 ,  H01L2223/6622 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01P1/045 ,  H05K1/0243 ,  H05K2201/09809 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A high frequency coaxial interconnection solder ball grid array produces a low loss, reproducible electrical interconnection at the circuit board level for mounting one or more high frequency components, such as high frequency IMA modules. Since the coaxial interconnection ball grid array can be and is generally implemented as part of a larger ball grid array, high frequency signal generation, signal reception and digital processing can be combined in a single electronic component, such as a circuit board. A coaxial-like interconnection is formed from a plurality of solder balls configured in a three-by-three square array. The coaxial interconnection solder ball grid array includes a single centrally disposed solder ball for interconnecting with a centrally disposed conductor of a coaxial line and a plurality of solder balls surrounding the single centrally disposed solder ball, some balls of which interconnect with a coaxial ground shield of the coaxial line. When soldered together, the centrally disposed solder ball and the central conductor of the coaxial line have the appearance of a rod with a diameter having a standard 50 ohm impedance. The outer conductive shield or ground signal path of the coaxial line is connected with multiple solder balls, to achieve a lower inductance ground-to-ground connection.

Abstract translation: 高频同轴互连焊球栅格阵列在电路板级产生低损耗，可再现的电互连，用于安装一个或多个高频部件，例如高频IMA模块。 由于同轴互连球栅阵列可以并且通常被实现为较大的球栅阵列的一部分，所以高频信号产生，信号接收和数字处理可以组合在诸如电路板的单个电子部件中。 由三个方形阵列构成的多个焊球形成同轴状的互连。 同轴互连焊球栅格阵列包括单个中心布置的焊球，用于与同轴线的中心布置的导体和围绕单个中心布置的焊球的多个焊球相互连接，其中一些球与同轴接地屏蔽 同轴线。 当焊接在一起时，中心布置的焊球和同轴线的中心导体具有直径为标准50欧姆阻抗的棒的外观。 同轴线的外部导电屏蔽或接地信号路径与多个焊球相连，以实现较低的电感接地连接。

公开(公告)号：US4276521A

公开(公告)日：1981-06-30

申请号：US970606

申请日：1978-12-18

Applicant: Roger A. Davidheiser

Inventor： Roger A. Davidheiser

IPC: H03C7/02 ,  H03C3/00 ,  H01P3/08

CPC classification number: H03C7/027

Abstract: A quadriphase modulator, designed in a planar metal geometry for operation in the microwave frequency range, uses Schottky barrier diodes as the switching elements, and is capable of operating at bit data rates up to 15% of the carrier frequency. The microwave circuit employs a microstrip power splitter that couples the carrier signal to two biphase modulators while providing DC isolation. Each biphase modulator includes coplanar-to-slot transmission line transition, with a pair of diodes controlling the phase shift across the transition. The diodes are connected in reverse polarity and the bias for switching the diodes is controlled by the modulating signal. The slot lines from the two biphase modulators are coupled through a microstrip transition and through a Lange 90 degree hybrid to the output load.

Abstract translation: 在微波频率范围内以平面金属几何形状设计的四相调制器使用肖特基势垒二极管作为开关元件，并且能够以高达载波频率的15％的位数据速率工作。 微波电路采用微带功率分配器，将载波信号耦合到两个双相调制器，同时提供直流隔离。 每个双相调制器包括共面至时隙传输线转换，一对二极管控制跨过渡的相移。 二极管以相反极性连接，用于切换二极管的偏压由调制信号控制。 来自两个双相调制器的槽线通过微带过渡并通过Lange 90度混合物耦合到输出负载。