公开(公告)号：US20160309826A1

公开(公告)日：2016-10-27

申请号：US14694752

申请日：2015-04-23

申请人： RC ANDERSON ,  KENNETH J. LONG

发明人： RC ANDERSON ,  KENNETH J. LONG

IPC分类号： A42B3/04 ,  F21V33/00 ,  F21S9/02

CPC分类号： A42B3/0453

摘要： A helmet light bar coupleable to a helmet includes a housing, a plurality of light-emitting modules associated with the housing, and a controller adapted to active one or more of the plurality of light-emitting modules responsive to either or both of a signal indicative of activation of emergency lights on a motor vehicle and a signal indicative of a level of intensity of deceleration of the motor vehicle.

摘要翻译： 可耦合到头盔的头盔灯杆包括壳体，与壳体相关联的多个发光模块，以及适于响应于指示信号中的任何一个或两个而激活多个发光模块中的一个或多个的控制器 激活汽车上的应急灯和指示机动车辆的减速度的信号的信号。

公开(公告)号：US4906162A

公开(公告)日：1990-03-06

申请号：US318999

申请日：1989-03-06

申请人： Kenneth J. Long ,  Bobby W. Formby

发明人： Kenneth J. Long ,  Bobby W. Formby

IPC分类号： H05K13/00

CPC分类号： H05K13/0084

摘要： A method for handling semiconductor components by utilizing a removable filler strip for temporarily securing or clinching longitudinally arrangeable individual components in a tube, rod or hollow magazine. The filler strip is generally flat, but has surface features that serve to press the components against the top, bottom or side of the tube. Partial removal of the filler strip will result in the dispensing of some of the components while the remainder are retained by the filler strip in the tube.

摘要翻译： 一种通过利用可拆卸的填充条来处理半导体部件的方法，用于临时固定或紧固在管，杆或空心匣中的纵向可布置的各个部件。 填料条通常是平的，但是具有用于将部件压靠在管的顶部，底部或侧面上的表面特征。 填充条的部分去除将导致一些部件的分配，而剩余部分由管中的填料条保留。

公开(公告)号：US5504369A

公开(公告)日：1996-04-02

申请号：US342960

申请日：1994-11-21

申请人： Edward C. Dasse ,  Robert W. Bollish ,  Alfredo Figueroa ,  James H. Carlquist ,  Thomas R. Yarbrough ,  Charles F. Toewe ,  Kelvin L. Holub ,  Marcus R. Burton ,  Kenneth J. Long ,  Walid S. Ballouli

发明人： Edward C. Dasse ,  Robert W. Bollish ,  Alfredo Figueroa ,  James H. Carlquist ,  Thomas R. Yarbrough ,  Charles F. Toewe ,  Kelvin L. Holub ,  Marcus R. Burton ,  Kenneth J. Long ,  Walid S. Ballouli

IPC分类号： G01R31/28 ,  H01L21/66 ,  G01R31/00

CPC分类号： G01R31/2831 ,  G01R31/2884

摘要： A semiconductor wafer (20) having integrated circuit dice (22), wafer conductors (42-47, 50-53), and wafer contact pads (38) formed thereon. The wafer conductors (42-47, 50-53) are used to transfer electrical signals to and from the integrated circuit dice (22) on semiconductor wafer (20) so that wafer level testing and burn-in can be performed on the integrated circuit dice (22). In accordance with one embodiment of the present, each wafer conductor (45, 52) is electrically coupled to the same bonding pad (78) on each integrated circuit dice (22). Each wafer conductor (42-47, 50-53) includes at least a portion of conductor (42-47) which overlies the upper surface of at least one integrated circuit dice (22).

摘要翻译： 具有集成电路晶片（22），晶片导体（42-47,50-53）和形成在其上的晶片接触焊盘（38）的半导体晶片（20）。 晶片导体（42-47,50-53）用于将电信号传送到半导体晶片（20）上的集成电路晶片（22）并从集成电路晶片（22）传出，从而可以在集成电路上执行晶片级测试和老化 骰子（22）。 根据本发明的一个实施例，每个晶片导体（45,52）电耦合到每个集成电路骰子（22）上的相同接合焊盘（78）。 每个晶片导体（42-47,50-53）包括覆盖至少一个集成电路晶片（22）的上表面的导体（42-47）的至少一部分。

公开(公告)号：US5119377A

公开(公告)日：1992-06-02

申请号：US367403

申请日：1989-06-16

申请人： Paul R. Cobb ,  Christopher J. Lennon ,  Kenneth J. Long

发明人： Paul R. Cobb ,  Christopher J. Lennon ,  Kenneth J. Long

IPC分类号： G06F11/28 ,  G06F11/00 ,  G06F11/36

CPC分类号： G06F11/366

摘要： A process for detecting software errors in a computer program and automatically gathering diagnostic data limited to the error to be resolved. Error detection code is placed within the software program during program development. When an error or failure is detected, this process is called and captures only the data required to debug the software error. The error detection code notifies the process of which data to capture by selecting entries from a table within the process. This table, known as an Application Data Table (ADT), contains the layout and format of all data areas used by the calling problem program and information required to build a generic alert and send the generic alert to a computer network monitor program. This process is only called conditionally when an error is detected. It is completely idle until such a condition occurs.

公开(公告)号：US4836371A

公开(公告)日：1989-06-06

申请号：US109564

申请日：1987-10-19

申请人： Kenneth J. Long ,  Bobby W. Formby

发明人： Kenneth J. Long ,  Bobby W. Formby

IPC分类号： H05K13/00

CPC分类号： H05K13/0084 ,  Y10S206/814

摘要： A filler strip for temporarily securing or clinching longitudinally arrangeable individual components in a tube, rod or hollow magazine. The filler strip is generally flat, but has surface features that serve to press the component against the top, bottom or side of the tube to prevent the component from knocking against adjacent components and cracking, chipping or otherwise damaging one or more of the components. The filler strip is particularly suited to eliminating the knocking motion of expensive ceramic integrated circuit packages that are shipped and handled in transparent plastic tubes or rails.

摘要翻译： 用于临时固定或紧固在管，杆或空心匣中的纵向可排列的各个部件的填充条。 填料条通常是平坦的，但是具有用于将部件压靠在管的顶部，底部或侧面上的表面特征，以防止部件与相邻部件碰撞，破裂，破碎或以其他方式损坏一个或多个部件。 填充条特别适用于消除在透明塑料管或轨道中运输和处理的昂贵的陶瓷集成电路封装的爆震运动。

公开(公告)号：US5654588A

公开(公告)日：1997-08-05

申请号：US487671

申请日：1995-06-07

申请人： Edward C. Dasse ,  Robert W. Bollish ,  Alfredo Figueroa ,  James H. Carlquist ,  Thomas R. Yarbrough ,  Charles F. Toewe ,  Kelvin L. Holub ,  Marcus R. Burton ,  Kenneth J. Long ,  Walid S. Ballouli ,  Shih King Cheng

发明人： Edward C. Dasse ,  Robert W. Bollish ,  Alfredo Figueroa ,  James H. Carlquist ,  Thomas R. Yarbrough ,  Charles F. Toewe ,  Kelvin L. Holub ,  Marcus R. Burton ,  Kenneth J. Long ,  Walid S. Ballouli ,  Shih King Cheng

IPC分类号： G01R31/28 ,  H01L21/66 ,  H01L23/58 ,  G01R31/00

CPC分类号： G01R31/2831 ,  G01R31/2884 ,  H01L22/00 ,  H01L22/32 ,  H01L2924/0002

摘要： Wafer level testing of a wafer (500) is accomplished by dividing the integrated circuits of the wafer into a plurality of segmented bus regions (514, 516, and 518 for example). Each bus region is formed having its own set of test conductors (520-530) wherein each set of test conductors are isolated from all other sets of test conductors on the wafer. Each test conductor has at least one contact pad (531-546) where each contact pad lies within a periphery of the integrated circuits' active areas. By forming pads over ICs and by sub-dividing the bus structure of test conductive lines, more high powered ICs can be tested in a wafer-level manner with fewer problems associated with speed, power, throughput, and routing problems.

摘要翻译： 通过将晶片的集成电路分成多个分段总线区域（例如514,516和518）来实现晶片（500）的晶片级测试。 每个总线区域形成有其自己的一组测试导体（520-530），其中每组测试导体与晶片上的所有其它测试导体组隔离。 每个测试导体具有至少一个接触焊盘（531-546），其中每个接触焊盘位于集成电路的有效区域的外围。 通过在IC上形成焊盘并通过对测试导线的总线结构进行细分，可以以较低的速度，功率，吞吐量和布线问题相关的问题，以晶圆级方式测试更多的高功率IC。

公开(公告)号：US5399505A

公开(公告)日：1995-03-21

申请号：US96094

申请日：1993-07-23

申请人： Edward C. Dasse ,  Robert W. Bollish ,  Alfredo Figueroa ,  James H. Carlquist ,  Thomas R. Yarbrough ,  Charles F. Toewe ,  Kelvin L. Holub ,  Marcus R. Burton ,  Kenneth J. Long ,  Walid S. Ballouli ,  Shih K. Cheng

发明人： Edward C. Dasse ,  Robert W. Bollish ,  Alfredo Figueroa ,  James H. Carlquist ,  Thomas R. Yarbrough ,  Charles F. Toewe ,  Kelvin L. Holub ,  Marcus R. Burton ,  Kenneth J. Long ,  Walid S. Ballouli ,  Shih K. Cheng

IPC分类号： G01R31/28 ,  H01L21/66

CPC分类号： G01R31/2831 ,  G01R31/2884

摘要： A semiconductor wafer (20) having integrated circuit dice (22), wafer conductors (42-47, 50-53), and wafer contact pads (38) formed thereon. The wafer conductors (42-47, 50-53) are used to transfer electrical signals to and from the integrated circuit dice (22) on semiconductor wafer (20) so that wafer level testing and burn-in can be performed on the integrated circuit dice (22). In accordance with one embodiment of the present, each wafer conductor (45, 52) is electrically coupled to the same bonding pad (78) on each integrated circuit dice (22). Each wafer conductor (42-47, 50-53) includes at least a portion of conductor (42-47) which overlies the upper surface of at least one integrated circuit dice (22).

摘要翻译： 具有集成电路晶片（22），晶片导体（42-47,50-53）和形成在其上的晶片接触焊盘（38）的半导体晶片（20）。 晶片导体（42-47,50-53）用于将电信号传送到半导体晶片（20）上的集成电路晶片（22）并从集成电路晶片（22）传出，从而可以在集成电路上执行晶片级测试和老化 骰子（22）。 根据本发明的一个实施例，每个晶片导体（45,52）电耦合到每个集成电路骰子（22）上的相同接合焊盘（78）。 每个晶片导体（42-47,50-53）包括覆盖至少一个集成电路晶片（22）的上表面的导体（42-47）的至少一部分。